Patents by Inventor Seiichi HITOMI

Seiichi HITOMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220135861
    Abstract: The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a thermally conductive material and a surface-modified inorganic substance. The composition for forming a thermally conductive material of the present invention is a composition for forming a thermally conductive material containing a surface-modified inorganic substance and a thermosetting compound, the surface-modified inorganic substance satisfying at least one of Requirement 1 or Requirement 2. Requirement 1: The surface-modified inorganic substance includes a surface-modified inorganic substance X containing the inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance.
    Type: Application
    Filed: January 13, 2022
    Publication date: May 5, 2022
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke Hayashi, Seiichi Hitomi, Teruki Niori, Keita Takahashi
  • Publication number: 20210403786
    Abstract: A composition contains a phenolic compound represented by General Formula (1), an epoxy compound, and an inorganic substance.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke HAYASHI, Seiichi HITOMI, Teruki NIORI, Keita TAKAHASHI
  • Publication number: 20210355364
    Abstract: A composition for forming a thermally conductive material contains a compound represented by General Formula (1), a phenolic compound, and an inorganic substance, in which a content of the compound represented by General Formula (1) is 30.0% by mass or greater with respect to a total organic solid content, (X—Z1—)m-A-(—Z2—Y)n??(1).
    Type: Application
    Filed: July 26, 2021
    Publication date: November 18, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke HAYASHI, Seiichi HITOMI, Teruki NIORI, Keita TAKAHASHI
  • Publication number: 20210301180
    Abstract: A composition contains an inorganic nitride, and a compound represented by General
    Type: Application
    Filed: June 10, 2021
    Publication date: September 30, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke HAYASHI, Seiichi HITOMI, Teruki NIORI, Keita TAKAHASHI
  • Publication number: 20210284788
    Abstract: The present invention provides a thermally conductive material-forming composition from which a thermally conductive material having excellent thermally conductive properties can be obtained. Moreover, a thermally conductive material formed of the thermally conductive material-forming composition, a thermally conductive sheet, and a device with a thermally conductive layer are provided. Further, the present invention provides a film from which a thermally conductive sheet having excellent thermally conductive properties can be prepared. Furthermore, a thermally conductive sheet prepared using the film, and a device with a thermally conductive layer are provided.
    Type: Application
    Filed: March 12, 2021
    Publication date: September 16, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi HITOMI, Keita TAKAHASHI, Teruki NIORI, Daisuke HAYASHI
  • Patent number: 10989846
    Abstract: Provided are a near infrared absorbing composition with which a cured film having excellent solvent resistance and thermal shock resistance can be manufactured, a near infrared cut filter, a method of manufacturing a near infrared cut filter, a solid image pickup element, a camera module, and an image display device. The near infrared absorbing composition includes: a resin A that satisfies the following condition a1; an infrared absorber B; and a solvent D. At least the resin A has a crosslinking group, or the near infrared absorbing composition further includes a compound C having a crosslinking group that is different from the resin A. condition a1: in a case where the resin A does not have a crosslinking group, a glass transition temperature of the resin A measured by differential scanning calorimetry is 0° C. to 100° C.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: April 27, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Seiichi Hitomi, Takashi Kawashima, Keisuke Arimura, Takahiro Okawara
  • Patent number: 10961423
    Abstract: A first object of the present invention is to provide a curable composition capable of providing a cured substance in which an inorganic substance exhibits excellent dispersibility and which exhibits high thermal conductivity. A second object of the present invention is to provide a thermally conductive material formed by curing the curable composition and a device with a thermally conductive layer including the thermally conductive material. The curable composition according to an embodiment of the present invention contains an inorganic substance selected from the group consisting of an inorganic nitride and an inorganic oxide, a compound which has a monovalent substituent selected from the group consisting of a boronic acid group, a boronic acid ester group, an aldehyde group, and a pyridinium group and has a molecular weight equal to or greater than 1,000, and a polymerizable monomer.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: March 30, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Seiichi Hitomi, Keita Takahashi
  • Publication number: 20200291174
    Abstract: A first object of the present invention is to provide a composition capable of forming a cured product (thermally conductive material) having excellent thermal conductivity. In addition, a second object of the present invention is to provide a thermally conductive material formed from the composition and a device with a thermally conductive layer. In addition, a third object of the present invention is to provide a method for manufacturing a thermally conductive material using the composition. The composition of the present invention includes a curing agent including an active hydrogen-containing functional group, and a main agent including a reactive group which reacts with the active hydrogen-containing functional group, in which the main agent and the curing agent respectively exhibit liquid crystallinity in a single state at a temperature of 150° C. or lower.
    Type: Application
    Filed: June 2, 2020
    Publication date: September 17, 2020
    Applicant: FUJIFILE Corporation
    Inventors: Seiichi HITOMI, Keita TAKAHASHI, Teruki NIORI, Yuji YOSHIDA
  • Publication number: 20200180957
    Abstract: The present invention provides a surface-modified inorganic nitride having excellent dispersibility. Furthermore, the present invention provides a composition, a thermally conductive material, and a device with a thermally conductive layer which contain the surface-modified inorganic nitride. The surface-modified inorganic nitride of the present invention includes an inorganic nitride, and a compound which is represented by General Formula (1) and is adsorbed onto a surface of the inorganic nitride.
    Type: Application
    Filed: January 13, 2020
    Publication date: June 11, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi HITOMI, Keita TAKAHASHI, Naoyuki HAYASHI, Daisuke HAYASHI
  • Publication number: 20200148931
    Abstract: The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.
    Type: Application
    Filed: January 13, 2020
    Publication date: May 14, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi Hitomi, Keita Takahashi, Teruki Niori, Yuji Yoshida
  • Publication number: 20200148538
    Abstract: A first object of the present invention is to provide a surface-modified inorganic nitride having excellent dispersibility. Furthermore, a second object of the present invention is to provide a composition, a thermally conductive material, and a device with a thermally conductive layer which contain the surface-modified inorganic nitride. The surface-modified inorganic nitride of the present invention includes an inorganic nitride, and a compound which is represented by General Formula (I) and is adsorbed onto a surface of the inorganic nitride. In General Formula (1), n represents an integer of 3 or greater. X represents an aromatic hydrocarbon ring group or an aromatic heterocyclic group. Y represents a single bond, —O—, —CO—, —CO—O—, —O—CO—, —S—, —CS—, —NRA—, —N?N—, or a divalent unsaturated hydrocarbon group. RA represents a hydrogen atom or an alkyl group. R1 and R2 each independently represent a substituent.
    Type: Application
    Filed: January 10, 2020
    Publication date: May 14, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi Hitomi, Keita Takahashi, Naoyuki Hayashi
  • Publication number: 20200140275
    Abstract: An object of the present invention is to provide a surface-modified inorganic nitride having excellent dispersibility. Furthermore, another object of the present invention is to provide a composition, a thermally conductive material, and a device with a thermally conductive layer which contain the surface-modified inorganic nitride. The surface-modified inorganic nitride of the present invention includes an inorganic nitride, and a compound which is represented by General Formula (I) and is adsorbed onto a surface of the inorganic nitride.
    Type: Application
    Filed: January 6, 2020
    Publication date: May 7, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi HITOMI, Keita TAKAHASHI, Naoyuki HAYASHI
  • Publication number: 20200140738
    Abstract: A first object of the present invention is to provide a surface-modified inorganic nitride having excellent dispersibility. Furthermore, a second object of the present invention is to provide a composition, a thermally conductive material, and a device with a thermally conductive layer which contain the surface-modified inorganic nitride.
    Type: Application
    Filed: January 7, 2020
    Publication date: May 7, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi HITOMI, Keita Takahashi, Naoyuki Hayashi, Teruki Niori, Daisuke Hayashi
  • Patent number: 10633252
    Abstract: A surface-modified inorganic substance is obtained by performing surface modification on a inorganic nitride by using an aldehyde compound such as a compound represented by General Formula I. A resin composition contains the surface-modified inorganic substance and a monomer having a group selected from the group consisting of an oxetanyl group, an oxiranyl group, and a (meth)acrylate group. ZZ—XX—CHO??General Formula I In the formula, ZZ represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, an oxetanyl group, an oxiranyl group, and a (meth)acrylate group, and XX represents a divalent linking group.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: April 28, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Seiichi Hitomi, Keita Takahashi
  • Publication number: 20190359876
    Abstract: A first object of the present invention is to provide a curable composition capable of providing a cured substance in which an inorganic substance exhibits excellent dispersibility and which exhibits high thermal conductivity. A second object of the present invention is to provide a thermally conductive material formed by curing the curable composition and a device with a thermally conductive layer including the thermally conductive material. The curable composition according to an embodiment of the present invention contains an inorganic substance selected from the group consisting of an inorganic nitride and an inorganic oxide, a compound which has a monovalent substituent selected from the group consisting of a boronic acid group, a boronic acid ester group, an aldehyde group, and a pyridinium group and has a molecular weight equal to or greater than 1,000, and a polymerizable monomer.
    Type: Application
    Filed: August 7, 2019
    Publication date: November 28, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi HITOMI, Keita TAKAHASHI
  • Patent number: 10215898
    Abstract: Provided are a near infrared ray absorbent composition which can form a cured film having excellent near infrared ray shielding properties, a near infrared ray cut filter, a manufacturing method of a near infrared ray cut filter, a solid image pickup element, and a camera module. The near infrared ray absorbent composition includes a copper complex that is other than a copper phthalocyanine complex and has a maximum absorption wavelength in a wavelength range of 700 to 1,200 nm and in which a molar light absorption coefficient at the maximum absorption wavelength is greater than or equal to 100 (L/mol·cm).
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: February 26, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Kouitsu Sasaki, Takashi Kawashima, Seiichi Hitomi, Yasuharu Shiraishi
  • Patent number: 10184052
    Abstract: An object of the present invention is to provide a near infrared radiation-absorbing composition having favorable shielding properties in a near infrared range when used to produce cured films, a near infrared radiation cut-off filter and a production method therefor, and a camera module and a production method therefor. The near infrared radiation-absorbing composition including a copper complex formed by reacting a compound (A) having two or more coordinating atoms that form bonds using unshared electron pairs with a copper component.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: January 22, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Seiichi Hitomi, Takashi Kawashima, Kouitsu Sasaki
  • Publication number: 20180327265
    Abstract: According to the present invention, there are provided a surface-modified inorganic substance obtained by performing surface modification on a inorganic nitride by using an aldehyde compound such as a compound represented by General Formula I and a resin composition containing the surface-modified inorganic substance and a monomer having a group selected from the group consisting of an oxetanyl group, an oxiranyl group, and a (meth)acrylate group. By using the surface-modified inorganic substance or the resin composition, it is possible to provide a thermally conductive material having excellent thermal conductivity and a device having high durability. ZZ—XX—CHO??General Formula I (In the formula, ZZ represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, an oxetanyl group, an oxiranyl group, a (meth)acrylate group, and a hydrogen atom, and XX represents a divalent linking group.
    Type: Application
    Filed: July 25, 2018
    Publication date: November 15, 2018
    Applicant: FUJIFILM Corporation
    Inventors: SEIICHI HITOMI, KEITA TAKAHASHI
  • Publication number: 20180292586
    Abstract: Provided are a near infrared absorbing composition with which a cured film having excellent solvent resistance and thermal shock resistance can be manufactured, a near infrared cut filter, a method of manufacturing a near infrared cut filter, a solid image pickup element, a camera module, and an image display device. The near infrared absorbing composition includes: a resin A that satisfies the following condition a1; an infrared absorber B; and a solvent D. At least the resin A has a crosslinking group, or the near infrared absorbing composition further includes a compound C having a crosslinking group that is different from the resin A. condition a1: in a case where the resin A does not have a crosslinking group, a glass transition temperature of the resin A measured by differential scanning calorimetry is 0° C. to 100° C.
    Type: Application
    Filed: June 14, 2018
    Publication date: October 11, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Seiichi HITOMI, Takashi KAWASHIMA, Keisuke ARIMURA, Takahiro OKAWARA
  • Publication number: 20180094086
    Abstract: The near infrared absorbing composition includes: a copper-containing polymer having a copper complex site at a polymer side chain; and a solvent, in which the copper complex site includes a site multidentate-coordinated to a copper atom and at least one selected from the group consisting of a site monodentate-coordinated to a copper atom and a counter ion to a copper complex skeleton, and a polymer main chain and a copper atom at the copper complex site are bonded to each other through the site monodentate-coordinated to a copper atom or the counter ion.
    Type: Application
    Filed: November 22, 2017
    Publication date: April 5, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Kouitsu SASAKI, Takashi KAWASHIMA, Seiichi HITOMI