Abstract: A coordination support system includes circuitry configured to: accept login information including user identification information and coordination identification information of a coordination process to be executed from a device; determine whether coordination setting for execution of the coordination process identified by the coordination identification information is configured; store an authentication ticket and a temporary token in association with each other based on a determination that the coordination setting is not configured, the authentication ticket indicating authentication of use of a function of the service providing apparatus executing the coordination process, and the temporary token indicating permission of use of the service providing apparatus; and transmit setting information including address information and the temporary token to a destination indicted by a communication address of a user identified by the user identification information, the address information indicating a storage lo

Abstract: There is provided an information processing device in which an application of an electronic device provides a service to a user, the information processing device including a processor; and a memory that includes instructions, which when executed, cause the processor to execute the following steps: associating the application with a processing flow; associating the processing flow with a scope of authorization of an external service; retrieving the scope of the authorization of the external service required by the processing flow associated with the application; retrieving authorized information representing a scope of authorization of the external service authorized by the user; and providing, for each external service, information indicating whether the external service is authorized, based on a result of comparing the scope of the authorization of the external service required by the processing flow with the scope of the authorization of the external service authorized by the user.

Abstract: A coordination support system includes circuitry configured to: accept login information including user identification information and coordination identification information of a coordination process to be executed from a device; determine whether coordination setting for execution of the coordination process identified by the coordination identification information is configured; store an authentication ticket and a temporary token in association with each other based on a determination that the coordination setting is not configured, the authentication ticket indicating authentication of use of a function of the service providing apparatus executing the coordination process, and the temporary token indicating permission of use of the service providing apparatus; and transmit setting information including address information and the temporary token to a destination indicted by a communication address of a user identified by the user identification information, the address information indicating a storage lo

Abstract: An information processing apparatus issuing qualification information that is used by a terminal apparatus in using a service includes an authenticating unit configured to receive an authentication request, which includes organization information, domain information, and account information in an on-premises environment, from the terminal apparatus, and search for a user belonging to an organization identified by the organization information from user administration information based on the account information in the on-premises environment in response to a correspondence between the organization information and the domain information inside organization administration information, which causes the organization information and the domain information to correspond; and a qualification information issuing unit configured to issue the qualification information to the searched user.

Abstract: A service providing system includes an application configured to provide a service to a terminal device that has made a service request including use identification information; a creator configured to create group identification information for identifying a group of the use identification information, based on a creation request from the application; an issuer configured to issue the use identification information associated with the group identification information, based on an issue request from the application, the issue request including the group identification information; and a verifier configured to verify the use identification information, based on a verification request from the application, the verification request including the group identification information and the use identification information.

Abstract: The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.

Abstract: There is provided an information processing device in which an application of an electronic device provides a service to a user, the information processing device including a processor; and a memory that includes instructions, which when executed, cause the processor to execute the following steps: associating the application with a processing flow; associating the processing flow with a scope of authorization of an external service; retrieving the scope of the authorization of the external service required by the processing flow associated with the application; retrieving authorized information representing a scope of authorization of the external service authorized by the user; and providing, for each external service, information indicating whether the external service is authorized, based on a result of comparing the scope of the authorization of the external service required by the processing flow with the scope of the authorization of the external service authorized by the user.

Abstract: An information processing apparatus issuing qualification information that is used by a terminal apparatus in using a service includes an authenticating unit configured to receive an authentication request, which includes organization information, domain information, and account information in an on-premises environment, from the terminal apparatus, and search for a user belonging to an organization identified by the organization information from user administration information based on the account information in the on-premises environment in response to a correspondence between the organization information and the domain information inside organization administration information, which causes the organization information and the domain information to correspond; and a qualification information issuing unit configured to issue the qualification information to the searched user.

Abstract: A service providing system includes an application configured to provide a service to a terminal device that has made a service request including use identification information; a creator configured to create group identification information for identifying a group of the use identification information, based on a creation request from the application; an issuer configured to issue the use identification information associated with the group identification information, based on an issue request from the application, the issue request including the group identification information; and a verifier configured to verify the use identification information, based on a verification request from the application, the verification request including the group identification information and the use identification information.

Abstract: The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.

Abstract: In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

Abstract: In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

Abstract: In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

Abstract: A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

Abstract: In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

Abstract: It is an object to provide a method for invalidation and new registration of a storage medium, a method for backup of data stored in a storage medium and for restoration of backup data to a storage medium, and a method for encryption of and application of an electronic signature to data to be backed up, and for decryption of backup data to be restored and verification of a signature.

Abstract: In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

Abstract: A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

Abstract: A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

Abstract: Described is a polishing technique adapted for multilevel metallization of an electronic circuit device, which comprises polishing a metal film with a polishing liquid containing an oxidizing substance, a phosphoric acid and a protection-layer forming agent. The present invention makes it possible to polishing a metal film at a high removal rate while suppressing occurrence of scratches, delamination, dishing or erosion.