Patents by Inventor Seiichi Tajima
Seiichi Tajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230240049Abstract: A semiconductor storage device according to an embodiment includes a housing, a board, a semiconductor memory component, a controller, and a heat-dissipation structure. The heat-dissipation structure includes a plurality of first heat-dissipation fins, a plurality of second heat-dissipation fins, and a first cover portion. The plurality of the first heat-dissipation fins are on a first region of the housing. The plurality of the second heat-dissipation fins are on a second region of the housing. The first cover portion is between the plurality of the first heat-dissipation fins and the plurality of the second heat-dissipation fins, or the first cover portion is at a gap between the second heat-dissipation fins. The first cover portion covers at least a part of the gap between the second heat-dissipation fins.Type: ApplicationFiled: June 15, 2022Publication date: July 27, 2023Inventor: Seiichi Tajima
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Publication number: 20230026365Abstract: According to one embodiment, a memory system includes a first plate, an intermediate member, and a substrate. The intermediate member includes a second plate and a pair of side walls. The second plate includes a first opening, and is arranged to have a gap with respect to the first plate. The second plate includes a first face facing the first plate and a second face located on a side opposite to the first face. The pair of side walls is arranged on the second face. The substrate is placed between the pair of side walls. The substrate includes a third face on which a first non-volatile memory package and a controller package are mounted. The third face faces the second plate. The first non-volatile memory package is thermally connected to the second plate. The controller package is thermally connected to the first plate through the first opening.Type: ApplicationFiled: January 24, 2022Publication date: January 26, 2023Applicant: Kioxia CorporationInventor: Seiichi TAJIMA
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Patent number: 11546989Abstract: A multilayer board insulating sheet contains a reducing agent.Type: GrantFiled: March 9, 2020Date of Patent: January 3, 2023Assignee: TDK CORPORATIONInventors: Seiko Komatsu, Takaaki Morita, Seiichi Tajima
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Patent number: 11445605Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.Type: GrantFiled: June 30, 2020Date of Patent: September 13, 2022Assignee: TDK CORPORATIONInventors: Takaaki Morita, Seiko Komatsu, Seiichi Tajima, Wakiko Sato
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Patent number: 11412621Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.Type: GrantFiled: March 9, 2020Date of Patent: August 9, 2022Assignee: TDK CORPORATIONInventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
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Patent number: 11382218Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.Type: GrantFiled: May 24, 2019Date of Patent: July 5, 2022Assignee: TDK CORPORATIONInventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
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Patent number: 10905013Abstract: In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.Type: GrantFiled: May 24, 2019Date of Patent: January 26, 2021Assignee: TDK CORPORATIONInventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
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Publication number: 20210014966Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.Type: ApplicationFiled: June 30, 2020Publication date: January 14, 2021Applicant: TDK CORPORATIONInventors: Takaaki MORITA, Seiko KOMATSU, Seiichi TAJIMA, Wakiko SATO
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Publication number: 20200315034Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.Type: ApplicationFiled: March 9, 2020Publication date: October 1, 2020Applicant: TDK CORPORATIONInventors: Takaaki MORITA, Seiichi TAJIMA, Takashi KARIYA
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Publication number: 20200315008Abstract: A multilayer board insulating sheet contains a reducing agent.Type: ApplicationFiled: March 9, 2020Publication date: October 1, 2020Applicant: TDK CORPORATIONInventors: Seiko KOMATSU, Takaaki MORITA, Seiichi TAJIMA
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Publication number: 20190373739Abstract: In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.Type: ApplicationFiled: May 24, 2019Publication date: December 5, 2019Applicant: TDK CORPORATIONInventors: Takaaki MORITA, Seiichi TAJIMA, Takashi KARIYA
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Publication number: 20190373742Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.Type: ApplicationFiled: May 24, 2019Publication date: December 5, 2019Applicant: TDK CORPORATIONInventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
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Patent number: 8929089Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.Type: GrantFiled: March 10, 2011Date of Patent: January 6, 2015Assignee: TDK CorporationInventors: Shigeru Asami, Seiichi Tajima, Hiroki Hara, Shuichi Takizawa, Masumi Kameda, Kenichi Kawabata
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Publication number: 20110229708Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.Type: ApplicationFiled: March 10, 2011Publication date: September 22, 2011Applicant: TDK CORPORATIONInventors: Shigeru ASAMI, Seiichi TAJIMA, Hiroki HARA, Shuichi TAKIZAWA, Masumi KAMEDA, Kenichi KAWABATA
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Publication number: 20110198115Abstract: An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin.Type: ApplicationFiled: February 11, 2011Publication date: August 18, 2011Applicant: TDK CORPORATIONInventors: Yukihiro AZUMA, Seiichi TAJIMA, Shigeru ASAMI, Hiroki HARA, Shuichi TAKIZAWA, Kenichi KAWABATA
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Patent number: 7134196Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.Type: GrantFiled: March 30, 2004Date of Patent: November 14, 2006Assignee: TDK CorporationInventors: Bunji Moriya, Seiichi Tajima, Fumikachi Kurosawa, Shinichiro Hayashi
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Publication number: 20040177498Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.Type: ApplicationFiled: March 30, 2004Publication date: September 16, 2004Applicant: TDK CORPORATIONInventors: Bunji Moriya, Seiichi Tajima, Fumikachi Kurosawa, Shinichiro Hayashi
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Patent number: 6604266Abstract: A method for manufacturing a piezoelectric component in which a resonating portion on a piezoelectric substrate is provided with a deposit that is sensitive to radiation in a range of wavelengths from 350 to 2000 nm so as to have portions thereof trimmed away to form indentations therein without burning the deposit to avoid generating heat that is injurious to the piezoelectric component and substrate. A laser beam in the frequency range of 350 to 2000 nm is then caused to impinge on the deposit to cause the formation of trimmed indentations without substrate damaging heat in a controlled manner to adjust the resonance frequency of the piezoelectric component.Type: GrantFiled: June 27, 2000Date of Patent: August 12, 2003Assignee: TDK CorporationInventors: Seiichi Tajima, Takahito Kiriyama
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Patent number: 6475823Abstract: The invention is directed to piezoelectric device having a vibration space that achieves a high degree of airtightness which is not readily reduced, and a manufacturing method thereof. First and second hollow layers are formed at first and second surfaces of a piezoelectric substrate to form first and second cavities around first and second electrodes respectively. The first and second cavities each have a uniform width and extend between a first surface and an opposing second surface of the first and second hollow layers respectively, around vibration portions of the piezoelectric element. First and second sealing layers are each formed on the second surface of the first and second hollow layers to seal the first and second cavities.Type: GrantFiled: June 2, 2000Date of Patent: November 5, 2002Assignee: TDK CorporationInventors: Shigeru Sakano, Akira Suzuki, Takahito Kiriyama, Seiichi Tajima, Ikuo Katoh
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Publication number: 20020097562Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.Type: ApplicationFiled: December 11, 2001Publication date: July 25, 2002Applicant: TDK CORPORATIONInventors: Bunji Moriya, Seiichi Tajima, Fumikachi Kurosawa, Shinichiro Hayashi