Patents by Inventor Seiji Harada

Seiji Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11041289
    Abstract: A controller acquires an excavation start position at which a work implement starts excavation. When a current landscape includes an upward slope and a downward slope existing ahead of the upward slope and the excavation start position is on the upward slope, the controller determines a first virtual design surface including a first design surface located below the current landscape and inclined at a smaller angle than the upward slope. The controller generates a command signal that causes the work implement to move along the first virtual design surface.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: June 22, 2021
    Assignee: KOMATSU LTD.
    Inventors: Eiji Ishibashi, Junji Harada, Akifumi Inamaru, Seiji Nagano, Yasuhito Yonezawa
  • Patent number: 10546758
    Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a diffusing step of heating the wafer after performing the coating step, thereby diffusing the metal salt on the back side of the wafer to form a gettering layer containing the metal salt on the back side of the wafer, in which the metal salt is diffused in the gettering layer.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: January 28, 2020
    Assignee: DISCO CORPORATION
    Inventors: Daigo Shitabo, Seiji Harada, Hiroki Takeuchi
  • Patent number: 10541149
    Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a drying step of drying the wafer after performing the coating step, thereby forming a gettering layer containing the metal salt on the back side of the wafer.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: January 21, 2020
    Assignee: DISCO CORPORATION
    Inventor: Seiji Harada
  • Patent number: 10157802
    Abstract: A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an area other than the light applied area, measuring the intensity of the microwaves reflected from the light applied area and from the area other than the light applied area, subtracting the intensity of the microwaves reflected from the area other than the light applied area from the intensity of the microwaves reflected from the light applied area to thereby obtain a differential signal, and determining the gettering property of the gettering layer according to the intensity of the differential signal obtained above.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: December 18, 2018
    Assignee: Disco Corporation
    Inventors: Naoya Sukegawa, Seiji Harada
  • Publication number: 20180323081
    Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a diffusing step of heating the wafer after performing the coating step, thereby diffusing the metal salt on the back side of the wafer to form a gettering layer containing the metal salt on the back side of the wafer, in which the metal salt is diffused in the gettering layer.
    Type: Application
    Filed: May 4, 2018
    Publication date: November 8, 2018
    Inventors: Daigo Shitabo, Seiji Harada, Hiroki Takeuchi
  • Publication number: 20180323080
    Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a drying step of drying the wafer after performing the coating step, thereby forming a gettering layer containing the metal salt on the back side of the wafer.
    Type: Application
    Filed: May 4, 2018
    Publication date: November 8, 2018
    Inventor: Seiji Harada
  • Patent number: 9786490
    Abstract: Disclosed herein is a wafer processing method for processing the back side of a wafer having a plurality of devices formed on the front side so as to be separated by a plurality of crossing division lines. The wafer processing method includes a back grinding step of grinding the back side of the wafer to thereby reduce the thickness of the wafer to a predetermined thickness, a back polishing step of polishing the back side of the wafer after performing the back grinding step, thereby removing grinding strain, and a diamond-like carbon film deposition step of forming a diamond-like carbon film on the back side of the wafer after performing the back polishing step.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: October 10, 2017
    Assignee: Disco Corporation
    Inventor: Seiji Harada
  • Publication number: 20170278759
    Abstract: A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an area other than the light applied area, measuring the intensity of the microwaves reflected from the light applied area and from the area other than the light applied area, subtracting the intensity of the microwaves reflected from the area other than the light applied area from the intensity of the microwaves reflected from the light applied area to thereby obtain a differential signal, and determining the gettering property of the gettering layer according to the intensity of the differential signal obtained above.
    Type: Application
    Filed: March 17, 2017
    Publication date: September 28, 2017
    Inventors: Naoya Sukegawa, Seiji Harada
  • Publication number: 20170233609
    Abstract: Disclosed herein is a resin composition for fixing a plate-shaped workpiece. The resin composition includes a composition and a photopolymerization initiator added to the composition. This composition is composed of (meth)acrylate and a plasticizer or a reactive diluent. Preferably, the composition constituting the resin composition contains 30% to 45% by mass of (meth)acrylate having an urethane bond, 5% to 15% by mass of (meth)acrylate not having an urethane bond, and 40% to 65% by mass of plasticizer, which is an ester.
    Type: Application
    Filed: February 3, 2017
    Publication date: August 17, 2017
    Inventors: Seiji Harada, Makoto Shimotani
  • Patent number: 9679820
    Abstract: An evaluation method of a device wafer on which plural devices are formed on a front surface and inside which a gettering layer is formed is provided. In the evaluation method, electromagnetic waves are radiated toward a back surface of the device wafer and excitation light is radiated to generate excess carriers. Furthermore, the gettering capability of the gettering layer formed in the device wafer is determined based on the damping time of reflected electromagnetic waves.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: June 13, 2017
    Assignee: Disco Corporation
    Inventors: Naoya Sukegawa, Seiji Harada
  • Publication number: 20170047221
    Abstract: Disclosed herein is a wafer processing method for processing the back side of a wafer having a plurality of devices formed on the front side so as to be separated by a plurality of crossing division lines. The wafer processing method includes a back grinding step of grinding the back side of the wafer to thereby reduce the thickness of the wafer to a predetermined thickness, a back polishing step of polishing the back side of the wafer after performing the back grinding step, thereby removing grinding strain, and a diamond-like carbon film deposition step of forming a diamond-like carbon film on the back side of the wafer after performing the back polishing step.
    Type: Application
    Filed: August 1, 2016
    Publication date: February 16, 2017
    Inventor: Seiji Harada
  • Patent number: 9543189
    Abstract: A method of processing a laminated wafer in which a first wafer is laminated on a second wafer, the method including: a laminated wafer forming step of forming the laminated wafer by laminating the first wafer on the second wafer; a modified layer forming step of forming a modified layer within the first wafer by positioning a focusing point of a laser beam within the first wafer and moving the first wafer in a horizontal direction relative to the focusing point while applying the laser beam, the modified layer forming step being performed before or after the laminated wafer forming step is performed; and a separating step of separating part of the first wafer from the laminated wafer with the modified layer as a boundary, the separating step being performed after the laminated wafer forming step and the modified layer forming step are performed.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: January 10, 2017
    Assignee: Disco Corporation
    Inventors: Seiji Harada, Satoshi Kobayashi, Yasuyoshi Yubira
  • Publication number: 20150377779
    Abstract: An evaluation method of a device wafer on which plural devices are formed on a front surface and inside which a gettering layer is formed is provided. In the evaluation method, electromagnetic waves are radiated toward a back surface of the device wafer and excitation light is radiated to generate excess carriers. Furthermore, the gettering capability of the gettering layer formed in the device wafer is determined based on the damping time of reflected electromagnetic waves.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 31, 2015
    Inventors: Naoya Sukegawa, Seiji Harada
  • Publication number: 20150037962
    Abstract: A method of processing a laminated wafer in which a first wafer is laminated on a second wafer, the method including: a laminated wafer forming step of forming the laminated wafer by laminating the first wafer on the second wafer; a modified layer forming step of forming a modified layer within the first wafer by positioning a focusing point of a laser beam within the first wafer and moving the first wafer in a horizontal direction relative to the focusing point while applying the laser beam, the modified layer forming step being performed before or after the laminated wafer forming step is performed; and a separating step of separating part of the first wafer from the laminated wafer with the modified layer as a boundary, the separating step being performed after the laminated wafer forming step and the modified layer forming step are performed.
    Type: Application
    Filed: July 29, 2014
    Publication date: February 5, 2015
    Inventors: Seiji Harada, Satoshi Kobayashi, Yasuyoshi Yubira
  • Patent number: 8930943
    Abstract: A software installing method for installing software to a computer includes searching printers that are installed in a network environment and displaying a list of found printers on a single searched printer screen. The found printers are listed in rows with each row comprising a checkbox and an identification name associated with the listed printers, and marking the checkbox in one of the rows and an operation for highlighting the identification name in the same row are independently acceptable. The method further includes displaying an image of at least one listed printer on the single searched printer screen whose identification name is highlighted on the single searched printer screen by a user and installing onto the computer the printer driver software that corresponds to the at least one listed printer where the checkbox associated with the printer is marked by the user.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: January 6, 2015
    Assignee: Konica Minolta, Inc.
    Inventor: Seiji Harada
  • Patent number: 8896878
    Abstract: Disclose is an image forming apparatus, which makes it possible to easily change the display magnification factor of the print preview image, by conducting intuitive operations.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: November 25, 2014
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventor: Seiji Harada
  • Publication number: 20140175070
    Abstract: A laser processing method including the steps of covering the back side of a workpiece with fine particles having absorptivity to the wavelength of a laser beam to be applied to the workpiece, thereby forming a fine particle layer on the back side of the workpiece, and next applying the laser beam through the fine particle layer to the back side of the workpiece to thereby perform ablation to the workpiece. The laser beam applied to the workpiece is absorbed by the fine particle layer to thereby suppress the scattering of the energy of the laser beam and the reflection of the laser beam, so that the ablation to the workpiece can be efficiently performed.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 26, 2014
    Applicant: Disco Corporation
    Inventors: Yukinobu Ohura, Daigo Shitabo, Nobuyasu Kitahara, Seiji Harada
  • Patent number: 8707207
    Abstract: There are described a method and a computer executable program of the same, each of which makes it possible to provide registered items for a predetermined processing, which is established in advance corresponding to user's demands. The method includes: displaying a list of plural registrable items on a display section, which can be registered in order to provide at least one of the plural registrable items for the predetermined processing; accepting a registration instruction for registering said at least one of the plural registrable items, which includes an attribute value that indicates a status of its registration, based on an operation conducted by a user; providing the registered item for the predetermined processing according to the attribute value of the registration concerned; and when the registration instruction is accepted, displaying an attached image, which corresponds to the attribute value of the registration concerned, associating with one of the registrable items.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: April 22, 2014
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventors: Yoshiyuki Harada, Seiji Harada
  • Publication number: 20130268928
    Abstract: Disclosed a software installing method to a computer including the steps of: installing a software program to the computer, the software program corresponding to an equipment connected to the computer; acquiring equipment information of the equipment from the equipment connected to the computer; and displaying the acquired equipment information of the equipment on the display section prior to the installing step.
    Type: Application
    Filed: May 29, 2013
    Publication date: October 10, 2013
    Applicant: KONICA MINOLTA BUSINESS TECHNOLOGIES, INC.
    Inventor: Seiji Harada
  • Patent number: 8526064
    Abstract: Disclosed is a computer readable storage medium storing a program to make a computer realize functions of an image storage unit to store image data for generating a tint block image, a tint block image generation unit to generate the tint block image based on the image data, a script generation unit to generate a script for forming the tint block image based on the tint block image generated by the generation unit, a script adding unit to add the script to print data and a print data input unit to input the print data in which the script is added by the adding unit to an image forming apparatus.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: September 3, 2013
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventors: Seiji Harada, Rei Yokoyama