Patents by Inventor Seiji Kobayashi

Seiji Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12270917
    Abstract: An information processing apparatus includes an acquisition unit that acquires first position information indicating a position of a target object in a target region and a generation unit that generates, on the basis of the first position information, second position information including area mesh information that indicates a target area mesh containing the target object and included in plural area meshes produced by dividing the target region in a first direction and a second direction such that a division number in the second direction varies for each position in the first direction in the target region and relative position information that indicates a position of the target object in the target area mesh. The present technology is applicable to a transmission device and a reception device.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: April 8, 2025
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Toshihiro Fujiki, Seiji Kobayashi
  • Patent number: 12269980
    Abstract: A silicon etching solution includes a mixed solution comprising a quaternary alkylammonium hydroxide and water and further comprises a compound represented by the following formula (1): R1O—(CmH2mO)n—R2??(1) wherein R1 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, R2 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, m is an integer of 2 to 6, and n is 1 or 2.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: April 8, 2025
    Assignees: Tokuyama Corporation, SCREEN Holdings Co., Ltd.
    Inventors: Yoshiki Seike, Seiji Tono, Kenji Kobayashi, Sei Negoro
  • Patent number: 12270548
    Abstract: In this method for mounting a combustor component, a component hanging step for attaching a string material to a hanging jig mounted on a combustor component and hanging the combustor component with the string material together with the hanging jig, and a component mounting step for mounting a mounting flange of the combustor component at a combustor mounting position of a gas turbine casing are executed. The hanging jig has a hanging tool having a portion which becomes a suspension point contacted by the string material when the string material is attached and hanging the combustor component. The suspension point is positioned on the distal end side of the center of gravity of the combustor component in the combustor axial line direction when the hanging jig has been mounted to the mounting flange.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: April 8, 2025
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Satoru Higuchi, Shigeharu Yasuda, Seiji Kobayashi
  • Publication number: 20250100610
    Abstract: A vehicle steering handle, comprising: a steering wheel that is an isosceles trapezoidal annular body composed of an upper bottom portion, a lower bottom portion longer than the upper bottom portion, and left and right leg portions; an accelerator lever attached to the right leg portion; and a brake lever attached to the left leg portion and the right leg portion.
    Type: Application
    Filed: September 18, 2024
    Publication date: March 27, 2025
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Keita MORITSU, Mari SATO, Yoshito WATANABE, Yutaro YAMAMOTO, Ryutaro MISUMI, Kazuyoshi SHIRAI, Takatoshi OHYA, Kohei NOHARA, Yasuhiko FUKUZUMI, Ryunosuke YAMADA, Sei KOBAYASHI, Akihiro SUZUKI, Go TANAKA, Seiji TORIU, Minoru TAKAYAMA, Hiromasa OKADOME, Kazunari ABE, Yuta KAMIYA
  • Patent number: 12234181
    Abstract: A supporting glass substrate includes a compression stress layer on a surface thereof, and has an average thermal expansion coefficient at 50° C. to 200° C. that is 7 ppm/° C. to 15 ppm/° C., an internal tensile stress that is 5 MPa to 55 MPa, and a depth of the compression stress layer that is 10 ?m to 60 ?m.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: February 25, 2025
    Assignee: AGC INC.
    Inventors: Yusuke Kobayashi, Izuru Kashima, Kazutaka Ono, Seiji Inaba, Hirofumi Yamamoto, Kiyoshi Tamai
  • Patent number: 12157157
    Abstract: A pressing which a ram repeats an up-and-down motion for press working machine that performs a continuous operation in by a press die held by a die holding portion of a bolster and a die holding portion of the ram includes: a die positioning portion that positions the press die in a first direction being a moving direction of the ram; a position adjustment mechanism having a servomotor as a drive source and optionally changing a position where the press die is positioned by the die positioning portion; and a drive control unit driving, when position change data is given during the continuous operation, the servomotor such that the position where the press die is positioned by the die positioning portion is changed to a position corresponding to the position change data when reaction force of the press working not applied to the die positioning portion during continuous operation.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: December 3, 2024
    Assignee: ASAHI-SEIKI MANUFACTURING CO., LTD.
    Inventors: Fujio Mori, Seiji Kobayashi, Akihiro Shiino, Katsuyuki Inoue, Ken Hibino
  • Publication number: 20240377435
    Abstract: A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Atsushi YAMADA, Kyohei YOSHIMITSU, Hiroyuki MITA, Sachio IIDA, Seiji KOBAYASHI, Toshiyuki HIROI
  • Patent number: 12108423
    Abstract: The present disclosure relates to a transmission apparatus, a transmission method, a reception apparatus, and a reception method that can ensure a reduced processing burden on a receiving side in LPWA (Low Power Wide Area) communication. Communication data is sent and received at a communication time of day and a communication frequency based on group identification information set for groups into which a plurality of transmission apparatuses is divided and communication interval information shared by the transmission apparatuses and a reception apparatus, rather than individual identification information. The present disclosure is applicable to an LPWA communication system.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: October 1, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Nobuo Kato, Seiji Kobayashi
  • Patent number: 12081994
    Abstract: A communication device includes an acquisition unit configured to acquire first information for communication in which a first frequency band has been used, the first frequency band being an unlicensed band in which a plurality of communication schemes can be mixed, from a second frequency band different from the first frequency band, and a communication control unit configured to control communication in a predetermined communication scheme in which the first frequency band has been used, on the basis of the first information.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: September 3, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke Yoneyama, Toshihiro Fujiki, Katsuyuki Tanaka, Seiji Kobayashi
  • Patent number: 12066461
    Abstract: A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: August 20, 2024
    Assignees: Sony Group Corporation, Sony Semiconductor Solutions Corporation
    Inventors: Atsushi Yamada, Kyohei Yoshimitsu, Hiroyuki Mita, Sachio Iida, Seiji Kobayashi, Toshiyuki Hiroi
  • Patent number: 11927569
    Abstract: Ultrasonic flaw detection uses a phased-array ultrasonic-flaw-detection probe. The flaw detection probe is placed such that the center of curvature of the flaw detection probe coincides with a reference center of curvature of a subject. The flaw detection probe is translated along a scan direction. The flaw detection probe emits an ultrasonic beam such that the position upon which the ultrasonic beam converges coincides with the center of curvature of the curve of the outline of the cross section of the subject at the scan position, receives the resulting reflected beam, and estimates the length of a flaw in the circumferential direction of the subject. In addition, the estimated length of the flaw is corrected using a correction coefficient corresponding to the distance between the center of curvature of the reference scan position and the center of curvature of the scan position in the thickness direction of the subject.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 12, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hiroshi Takemoto, Mitsuyoshi Uematsu, Seiji Kobayashi, Takahito Shimomukai, Naoya Iwata
  • Patent number: 11848770
    Abstract: To extend the number of bits of an identifier without affecting the number of data bits to be transmitted. The present disclosure provides a receiving apparatus (1102) that identifies a transmitting apparatus (1101) based on a first identifier (10) having been individually given to each transmitting apparatus in order to identify the transmitting apparatus and a second identifier (20) which is for identifying the transmitting apparatus and which is shared among a plurality of transmitting apparatuses. According to this configuration, the number of bits of an identifier can be extended without affecting the number of data bits.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: December 19, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Toshihiro Fujiki, Seiji Kobayashi, Katsuki Hirabayashi
  • Publication number: 20220373183
    Abstract: In this method for mounting a combustor component, a component hanging step for attaching a string material to a hanging jig mounted on a combustor component and hanging the combustor component with the string material together with the hanging jig, and a component mounting step for mounting a mounting flange of the combustor component at a combustor mounting position of a gas turbine casing are executed. The hanging jig has a hanging tool having a portion which becomes a suspension point contacted by the string material when the string material is attached and hanging the combustor component. The suspension point is positioned on the distal end side of the center of gravity of the combustor component in the combustor axial line direction when the hanging jig has been mounted to the mounting flange.
    Type: Application
    Filed: February 19, 2021
    Publication date: November 24, 2022
    Inventors: Satoru HIGUCHI, Shigeharu YASUDA, Seiji KOBAYASHI
  • Patent number: 11470578
    Abstract: The present technology relates to a transmission device, a transmission method, a reception device, a reception method, and a communication method capable of shortening a pause time of data transmission. According to an aspect of the present technology, a transmission device classifies channels usable for data transmission into a plurality of groups, selects the channels that are used in transmission units and that continue on a time axis from the channels of the different groups in accordance with an identifier, and performs the data transmission of the transmission units by using the selected channels. It is possible to make application to a communication system transmitting data through one-way communication from a transmission device to a reception device.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: October 11, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Seiji Kobayashi, Toshihiro Fujiki, Nobuo Kato, Yusuke Yoneyama
  • Patent number: 11452150
    Abstract: The present technology relates to an information processing device, an information processing method, a transmitter, a transmission method, a receiver, and a reception method which can provide setting information necessary for each receiver. An information processing device of one aspect of the present technology holds non-common setting information that is not common setting information among setting information used in transmitters for setting for transmitting information in association with identification information of the respective transmitters. In addition, the information processing device transmits, to a receiver that has received identification information transmitted from a predetermined transmitter using common setting information that is setting information common in the plurality of transmitters, the non-common setting information associated with the identification information received by the receiver.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: September 20, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroyuki Okumura, Toshihiro Fujiki, Kentaro Nakahara, Seiji Kobayashi
  • Patent number: 11428714
    Abstract: A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: August 30, 2022
    Assignees: Sony Corporation, Sony Semiconductor Solutions Corporation
    Inventors: Atsushi Yamada, Kyohei Yoshimitsu, Hiroyuki Mita, Sachio Iida, Seiji Kobayashi, Toshiyuki Hiroi
  • Publication number: 20220241835
    Abstract: A pressing which a ram repeats an up-and-down motion for press working machine that performs a continuous operation in by a press die held by a die holding portion of a bolster and a die holding portion of the ram includes: a die positioning portion that positions the press die in a first direction being a moving direction of the ram; a position adjustment mechanism having a servomotor as a drive source and optionally changing a position where the press die is positioned by the die positioning portion; and a drive control unit driving, when position change data is given during the continuous operation, the servomotor such that the position where the press die is positioned by the die positioning portion is changed to a position corresponding to the position change data when reaction force of the press working not applied to the die positioning portion during continuous operation.
    Type: Application
    Filed: January 19, 2021
    Publication date: August 4, 2022
    Applicant: ASAHI-SEIKI MANUFACTURING CO., LTD.
    Inventors: Fujio MORI, Seiji KOBAYASHI, Akihiro SHIINO, Katsuyuki INOUE, Ken HIBINO
  • Publication number: 20220150714
    Abstract: A communication device includes an acquisition unit configured to acquire first information for communication in which a first frequency band has been used, the first frequency band being an unlicensed band in which a plurality of communication schemes can be mixed, from a second frequency band different from the first frequency band, and a communication control unit configured to control communication in a predetermined communication scheme in which the first frequency band has been used, on the basis of the first information.
    Type: Application
    Filed: February 3, 2020
    Publication date: May 12, 2022
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke YONEYAMA, Toshihiro FUJIKI, Katsuyuki TANAKA, Seiji KOBAYASHI
  • Patent number: 11310628
    Abstract: An object of the present invention is to secure a relative relationship when positions are displayed by use of position information transmitted from a plurality of wireless communication devices. Each of the wireless communication devices of the present invention includes a position information acquisition unit and a transmission unit. The position information acquisition unit acquires the position information of the wireless communication devices by the GPS, for example. At that time, the position information acquisition unit also acquires time information when the position information is acquired. The transmission unit transmits transmission data including the position information and the time information when the position information is acquired in a predetermined transmission slot.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: April 19, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Seiji Kobayashi, Shinichi Kitazono, Toshihiro Fujiki
  • Patent number: D1018173
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: March 19, 2024
    Assignee: TOKAI CHEMICAL INDUSTRIES, LTD.
    Inventors: Seiji Kobayashi, Toshiharu Tsuzuki