Patents by Inventor Seiji Maruyama

Seiji Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220107142
    Abstract: Provided herein are a heat exchange apparatus intended to achieve compatibility between installation flexibility and durability and a method of manufacturing the heat exchange apparatus. The heat exchange apparatus is a heat exchange apparatus that exchanges heat between a heat storage material and a fluid. The heat exchange apparatus includes a first heat storage module and a second heat storage module, each having the heat storage material and a box-like shape, and a housing containing the first heat storage module and the second heat storage module. The first heat storage module is disposed in the same orientation as that of the second heat storage module.
    Type: Application
    Filed: April 3, 2019
    Publication date: April 7, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Junichi NAKAZONO, Shunkei SUZUKI, Yasumitsu NOMURA, Yoshikazu YAJI, Minoru SATO, Seiji MARUYAMA, Yuichi USUDA, Norihiro YONEDA
  • Publication number: 20200041218
    Abstract: A plate heat exchanger causes heat exchange to be performed using a plurality of heat transfer plates stacked. Each of the heat transfer plates includes a plate body, a first-medium inlet, a first-medium outlet, a second-medium inlet, a second-medium outlet, and a projection that provides a passage. At least one of the first-medium inlet and the first-medium outlet is located at one of two corners at one end of the plate body which the projection contacts. At least one of the second-medium inlet and the second-medium outlet is located at one of two corners at the other end of the plate body from which the projection is separated.
    Type: Application
    Filed: December 13, 2017
    Publication date: February 6, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Junichi NAKAZONO, Shigetoshi IPPOSHI, Masaru SHINOZAKI, Yugo ASAI, Yusuke KIMOTO, Yoshihiro MIYAMA, Yuichi USUDA, Yoshitaka EIJIMA, Seiji MARUYAMA
  • Publication number: 20170034611
    Abstract: An ear-mounted near-ear speaker apparatus includes: an ear hook that is semi-circular when viewed from the side and is hooked onto a root part of a user's auricle; and a speaker where a speaker body is housed in a casing attached to the ear hook. The ear hook includes: a contacting portion that contacts a side of the user's head when the near-ear speaker apparatus is worn by the user and keeps the speaker separated from the auricle; and a joint that enables the ear hook to deform so that a distance between a first end to which the speaker is attached and a second end at an opposite end to the first end changes.
    Type: Application
    Filed: February 27, 2015
    Publication date: February 2, 2017
    Inventor: Seiji MARUYAMA
  • Patent number: 7258760
    Abstract: The invention is to perform operations from sealing of a honeycomb core with a thermosetting sealing material having an adhesive property to its hardening in one step, prevent a resin from flowing into cells of the honeycomb core during resin impregnating operation, and thereby mold low-cost honeycomb sandwich components by using RTM technique which is adopted in molding solid materials, for instance. Dry fabric sheets are stacked on both sides of a honeycomb core with thermosetting sealing members having an adhesive property placed in between, and the sealing members and the dry fabric sheets are heated at the curing temperature of the sealing members to cause initial hardening of the sealing members and to dry the dry fabric sheets. Then, the dry fabric sheets are impregnated with a thermosetting resin and the resin impregnated into the dry fabric sheets is hardened by hot-pressing an entire assembly thus prepared under specific conditions.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: August 21, 2007
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Eikatsu Yamaguchi, Seiji Maruyama
  • Patent number: 7186310
    Abstract: A method for forming a honeycomb sandwich composite panel comprising dry fabrics, an unpermeating-resin film, a non-low-viscosity-resin film, a honeycomb core, a non-low-viscosity resin film, an unpermeating-resin film and dry fabrics, stacked in this order in a mold. The cells of the honeycomb core are sealed by the laminated films. The unpermeating-resin film prevents the excessive permeation of the resin which forms the laminated films into the dry fabrics and to enhance the adhesion of this resin to the honeycomb core by forming proper fillets of the resin of the laminated sealing films. Further, drying process for drying the dry fabrics enables the application of the RTM process to the formation of the honeycomb sandwich composite panel.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: March 6, 2007
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Eikatsu Yamaguchi, Seiji Maruyama
  • Patent number: 7052572
    Abstract: There is provided a method for manufacturing a structural body comprising: a structural body formation step of forming the structural body by combining a plurality of constituent members through a bonding adhesive; a closed space formation step of disposing the structural body into a pressurizing or heating unit, forming a closed space with at least one of the structural body and the pressurizing or heating unit, and charging an elastic body into the closed space; a hardening step of fixing or hardening the bonding adhesive through the elastic body by the pressurizing or heating unit; and a discharge step of discharging the elastic body from the closed space.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: May 30, 2006
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Junji Miura, Atsushi Harada, Seiji Maruyama, Eikatsu Yamaguchi, Yasuhiro Toi
  • Publication number: 20040200571
    Abstract: The invention is to perform operations from sealing of a honeycomb core with a thermosetting sealing material having an adhesive property to its hardening in one step, prevent a resin from flowing into cells of the honeycomb core during resin impregnating operation, and thereby mold low-cost honeycomb sandwich components by using RTM technique which is adopted in molding solid materials, for instance. Dry fabric sheets are stacked on both sides of a honeycomb core with thermosetting sealing members having an adhesive property placed in between, and the sealing members and the dry fabric sheets are heated at the curing temperature of the sealing members to cause initial hardening of the sealing members and to dry the dry fabric sheets. Then, the dry fabric sheets are impregnated with a thermosetting resin and the resin impregnated into the dry fabric sheets is hardened by hot-pressing an entire assembly thus prepared under specific conditions.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 14, 2004
    Inventors: Eikatsu Yamaguchi, Seiji Maruyama
  • Patent number: 6776865
    Abstract: The invention is to perform operations from sealing of a honeycomb core with a thermosetting sealing material having an adhesive property to its hardening in one step, prevent a resin from flowing into cells of the honeycomb core during resin impregnating operation, and thereby mold low-cost honeycomb sandwich components by using RTM technique which is adopted in molding solid materials, for instance. Dry fabric sheets are stacked on both sides of a honeycomb core with thermosetting sealing members having an adhesive property placed in between, and the sealing members and the dry fabric sheets are heated at the curing temperature of the sealing members to cause initial hardening of the sealing members and to dry the dry fabric sheets. Then, the dry fabric sheets are impregnated with a thermosetting resin and the resin impregnated into the dry fabric sheets is hardened by hot-pressing an entire assembly thus prepared under specific conditions.
    Type: Grant
    Filed: December 2, 1999
    Date of Patent: August 17, 2004
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Eikatsu Yamaguchi, Seiji Maruyama
  • Publication number: 20030077410
    Abstract: A method for forming a honeycomb sandwich composite panel comprising dry fabrics, an unpermeating-resin film, a non-low-viscosity-resin film, a honeycomb core, a non-low-viscosity resin film, an unpermeating-resin film and dry fabrics, stacked in this order in a mold. The cells of the honeycomb core are sealed by the laminated films. The unpermeating-resin film prevents the excessive permeation of the resin which forms the laminated films into the dry fabrics and to enhance the adhesion of this resin to the honeycomb core by forming proper fillets of the resin of the laminated sealing films. Further, drying process for drying the dry fabrics enables the application of the RTM process to the formation of the honeycomb sandwich composite panel.
    Type: Application
    Filed: August 1, 2002
    Publication date: April 24, 2003
    Inventors: Eikatsu Yamaguchi, Seiji Maruyama
  • Publication number: 20030034588
    Abstract: There is provided a method for manufacturing a structural body comprising: a structural body formation step of forming the structural body by combining a plurality of constituent members through a bonding adhesive; a closed space formation step of disposing the structural body into a pressurizing or heating unit, forming a closed space with at least one of the structural body and the pressurizing or heating unit, and charging an elastic body into the closed space; a hardening step of fixing or hardening the bonding adhesive through the elastic body by the pressurizing or heating unit; and a discharge step of discharging the elastic body from the closed space.
    Type: Application
    Filed: July 30, 2002
    Publication date: February 20, 2003
    Applicant: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Junji Miura, Atsushi Harada, Seiji Maruyama, Eikatsu Yamaguchi, Yasushiro Toi