Patents by Inventor Seiji Shika

Seiji Shika has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11447658
    Abstract: The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a photo initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line). In the formula (1), R1, R2, and R3 each independently represent an alkyl group or an alkoxy group which may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent, R4 represents an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent, and R5 and R6 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, or a linear or branched alkenyl group having 1 to 6 carbon atoms.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: September 20, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shunsuke Katagiri, Takuya Suzuki, Seiji Shika, Yune Kumazawa
  • Publication number: 20220204694
    Abstract: A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): wherein R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon
    Type: Application
    Filed: June 26, 2020
    Publication date: June 30, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yune KUMAZAWA, Takuya SUZUKI, Seiji SHIKA, Shunsuke KATAGIRI
  • Publication number: 20220204695
    Abstract: The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C). In the formula (1), R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.
    Type: Application
    Filed: June 26, 2020
    Publication date: June 30, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yune KUMAZAWA, Takuya SUZUKI, Seiji SHIKA, Shunsuke KATAGIRI
  • Publication number: 20220204810
    Abstract: The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a photo initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line). In the formula (1), R1, R2, and R3 each independently represent an alkyl group or an alkoxy group which may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent, R4 represents an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent, and R5 and R6 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, or a linear or branched alkenyl group having 1 to 6 carbon atoms.
    Type: Application
    Filed: June 26, 2020
    Publication date: June 30, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shunsuke KATAGIRI, Takuya SUZUKI, Seiji SHIKA, Yune KUMAZAWA
  • Patent number: 11370857
    Abstract: A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: June 28, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yune Kumazawa, Takuya Suzuki, Seiji Shika
  • Publication number: 20220071025
    Abstract: A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
    Type: Application
    Filed: January 17, 2020
    Publication date: March 3, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yune KUMAZAWA, Takuya SUZUKI, Seiji SHIKA
  • Publication number: 20210206892
    Abstract: A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
    Type: Application
    Filed: August 28, 2019
    Publication date: July 8, 2021
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yune KUMAZAWA, Takuya SUZUKI, Seiji SHIKA
  • Patent number: 9351397
    Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: May 24, 2016
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Keiichi Hasebe, Seiji Shika, Naoki Kashima, Yoshinori Mabuchi
  • Publication number: 20150034369
    Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.
    Type: Application
    Filed: July 3, 2012
    Publication date: February 5, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Naoki Kashima, Keiichi Hasebe, Seiji Shika, Yoshinori Mabuchi, Yoshihiro Kato
  • Publication number: 20150014032
    Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.
    Type: Application
    Filed: January 24, 2013
    Publication date: January 15, 2015
    Inventors: Keiichi Hasebe, Seiji Shika, Naoki Kashima, Yoshinori Mabuchi
  • Patent number: 7192651
    Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: March 20, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo, Mitsuru Nozaki, Seiji Shika
  • Publication number: 20050042466
    Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.
    Type: Application
    Filed: August 17, 2004
    Publication date: February 24, 2005
    Inventors: Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo, Mitsuru Nozaki, Seiji Shika