Abstract: A pair of parallel pins abutting against the inner peripheral surface of a hollow shaft are provided to a first arm part of a shank at a predetermined spacing in the longitudinal direction. This prevents the shank from tilting or rattling. Further, an insertion hole of the retaining cap and the cross section of the first arm part each have an elliptical shape, and thus the rotation of the shank with respect to the hollow shaft is restricted and the position of the shank is kept such that the interlocking part points upward.

Abstract: A pair of parallel pins abutting against the inner peripheral surface of a hollow shaft are provided to a first arm part of a shank at a predetermined spacing in the longitudinal direction. This prevents the shank from tilting or rattling. Further, a coil spring restricts the rotation of the shank around the first arm part and keeps the position of the shank such that an interlocking part points upward.

Abstract: A cover apparatus for a vehicle includes: a center cover windup part including a center cover and a center windup shaft part that houses the center cover so as to be drawn therefrom and wound therearound; and side cover windup parts each including a side cover and a side windup shaft part that houses the side cover so as to be drawn therefrom and wound therearound. The center windup shaft part and the side windup shaft parts are supported with axes thereof being displaced from each other and end portions thereof overlapping each other in the axis directions thereof so that side edges of the center cover and side edges of the side covers overlap each other in the state in which center cover and the side covers are drawn.

Abstract: A cargo retaining device for a vehicle includes: a pedestal part having an abutting part configured to be located so as to straddle a pair of guide pieces; an interlocking part provided on the pedestal part for retaining a cargo; a shaft body supported movably along an axis direction by the pedestal part; and a locking part formed into an elongated shape having a width dimension smaller than a width dimension of a slit between the pair of guide pieces and a length dimension larger than the width dimension of the slit, and supported by one end of the shaft body. Further, the cargo retaining device includes a locking lever supported by the other end of the shaft body, and configured so as to change a position between a locked position for pulling the locking part up to the pedestal part side and an unlocked position for causing the locking part to be apart from the pedestal part.

Abstract: A pair of parallel pins abutting against the inner peripheral surface of a hollow shaft are provided to a first arm part of a shank at a predetermined spacing in the longitudinal direction. This prevents the shank from tilting or rattling. Further, an insertion hole of the retaining cap and the cross section of the first arm part each have an elliptical shape, and thus the rotation of the shank with respect to the hollow shaft is restricted and the position of the shank is kept such that the interlocking part points upward.

Abstract: A pair of parallel pins abutting against the inner peripheral surface of a hollow shaft are provided to a first arm part of a shank at a predetermined spacing in the longitudinal direction. This prevents the shank from tilting or rattling. Further, a coil spring restricts the rotation of the shank around the first arm part and keeps the position of the shank such that an interlocking part points upward.

Abstract: A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first of the main surfaces of the circuit board; molding said circuit board and said functional part in a resin with a second main surface of said circuit exposed and forming a battery lodging section in the resin molding defined by the through-hole; and mounting a battery in said battery lodging section and electrically connecting the circuit pattern to the battery.

Abstract: A thin IC card includes a circuit board on which functional parts are mounted and a through-hole defining an edge of a battery lodging section in which a battery is disposed, the circuit board being embedded in a molding-resin section with the reverse surface of the board exposed. The battery lodging section is aligned with the through-hole of the circuit board. Electrical connections between the circuit board and the battery are effected in a recess or cutouts in the circuit board. The battery is embedded in the lodging section using an expandable resin to make the card surface flat.

Abstract: In a semiconductor pressure sensor, a dam which prevents a sheathing resin from flowing into a diaphragm portion during the molding of the sheathing resin is disposed on the outer periphery of piezoresistors and the diaphragm portion on the surface of a semiconductor pressure sensor chip. The volume of the base and that of the semiconductor pressure sensor chip are adjusted so that a tensile force exerted upon the semiconductor pressure sensor chip by the base cancels a compressive force exerted upon the semiconductor pressure sensor by the sheathing resin when the temperature of the semiconductor pressure sensor returns to an ordinary room temperature from a high temperature. As a result, strain is not caused in the semiconductor pressure sensor chip, and therefore measurements of pressure with a high degree of accuracy can be performed.

Abstract: A semiconductor element such as an encapsulated or non-encapsulated semiconductor chip having a multitude of terminals is mounted on one surface of a quadrate substrate. A multitude of connector pins extend from the other surface of the substrate. A plurality of connector lands are formed on a surface of the substrate and electrically connected to the corresponding terminals of the semiconductor element. The connector lands are electrically connected to the connector pins through wiring. The connector pins have a pitch that is larger near the connector lands than at locations farther away from the lands. The pitch between adjacent connector pins is made larger as necessary or desired so as to allow the passage of an increased number of connecting wires between the adjacent connector pins, thus ensuring high density wiring with improved efficiency.

Abstract: A quadrate semiconductor element in the form of a quad flat package, a bare chip, and the like mounted on a substrate has a plurality of first terminals electrically connected through connecting wires to corresponding second terminals which are disposed on the substrate around the semiconductor element. The second terminals are disposed on the substrate such that the number of second terminals per unit area is less at locations near the corners of the quadrate semiconductor element than at the other portions of the substrate. This arrangement enlarges the effective wiring area for the connecting wires at the corners, thus greatly improving wiring efficiency.

Abstract: A semiconductor pressure sensor device that improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole and the outer lead holes, and a link portion positioned between a pair of adjacent outer lead holes and connected to the lead supporting portion for directing the flow of molten resin during encapsulation of the semiconductor chip. The link portion includes an opening or recess. The plurality of leads of the carrier tape are supported on the lead supporting of the film, with one end portion of each lead projecting into the center device hole of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the center device hole, and the leads are electrically connected to respective electrodes of the semiconductor chip.

Abstract: A liquid sealed semiconductor device comprises a base, semiconductor elements which are mounted to the base, a leading pin passing through the base and protruding to the outside of a package, a cap which is jointed to the base and covers the semiconductor elements, liquid filling the package, a sponge provided within the package and an internal cap for fastening the sponge to the inner wall of the package.The sponge absorbs the pressure change due to the expansion or the contraction of the internal liquid so as to prevent the liquid from leaking out of the package and to protect the package from being deformed. Furthermore, the internal cap eliminates the possibility that the sponge would drop down.

Abstract: A manufacturing method for a semiconductor device in which an electrode of a semiconductor chip is electrically connected to an inner lead of a carrier tape. The electrodes of the semiconductor chip are brought into contact with the inner lead of the carrier tape. Bonding is performed with inner lead droop controlled to no more than 80 .mu.m.

Abstract: A semiconductor acceleration sensor and a method of producing the sensor are characterized in that a pedestal on which a semiconductor acceleration sensor chip including a weight is mounted is integral with a stopper for preventing movement of the weight outside a prescribed range. The semiconductor acceleration sensor is not broken even if an acceleration outside the measurement range is applied. In addition, the semiconductor acceleration sensor exhibits high accuracy and is low in cost.

Abstract: A semiconductor pressure sensor device that can improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: There is disclosed an electric blower assembly provided with an air guide structure designed such that the current of air expelled from a rotating impeller under the influence of centrifugal force is guided to the body of an electric motor while being accelerated. The air guide structure comprises an air guide block having front and rear compartments. The front compartment includes a plurality of volute chambers designed such that, during flow of air within the volute chambers, the dynamic pressure can be converted into static pressure. The flow of air under the static pressure is subsequently guided at a relatively low pneumatic velocity into the rear compartment and then into the body of the motor to cool the latter. The air used to cool the motor is thereafter exhausted to the outside of the motor.