Patents by Inventor Seog Ho Lim
Seog Ho Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11133443Abstract: A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 ?m or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.Type: GrantFiled: July 10, 2019Date of Patent: September 28, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chi-Goo Kang, Young-Kyung Kim, Young-Ho Park, Jong-Won Park, Seog-Ho Lim
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Publication number: 20200243731Abstract: A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 ?m or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.Type: ApplicationFiled: July 10, 2019Publication date: July 30, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chi-Goo KANG, Young-Kyung KIM, Young-Ho PARK, Jong-Won PARK, Seog-Ho LIM
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Patent number: 10529699Abstract: Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.Type: GrantFiled: April 28, 2017Date of Patent: January 7, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae-jun Bang, Seog-ho Lim, Chang-ho Shin, Dong-soo Lee, Sun Kim
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Patent number: 10509159Abstract: A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.Type: GrantFiled: January 17, 2017Date of Patent: December 17, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-soo Lee, Seog-ho Lim, Chang-ho Shin, Sun Kim, Myoung-sun Ha, Jae-jun Bang
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Patent number: 10332865Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.Type: GrantFiled: April 4, 2017Date of Patent: June 25, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Kim, Jae Jun Bang, Chang Ho Shin, Dong Soo Lee, Seog Ho Lim, Myoung Sun Ha
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Publication number: 20180052275Abstract: A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.Type: ApplicationFiled: January 17, 2017Publication date: February 22, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: Dong-soo LEE, Seog-ho LIM, Chang-ho SHIN, Sun KIM, Myoung-sun HA, Jae-jun BANG
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Publication number: 20180053750Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.Type: ApplicationFiled: April 4, 2017Publication date: February 22, 2018Inventors: Sun KIM, Jae Jun BANG, Chang Ho SHIN, Dong Soo LEE, Seog Ho LIM, Myoung Sun HA
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Publication number: 20180047712Abstract: Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.Type: ApplicationFiled: April 28, 2017Publication date: February 15, 2018Inventors: Jae-jun BANG, Seog-ho LIM, Chang-ho SHIN, Dong-soo LEE, Sun KIM
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Patent number: 9664842Abstract: A light source module is provided. The light source module includes a substrate having a first surface on which a circuit portion is disposed, and a second surface disposed opposite thereto. The light source module further includes a plurality of light emitting devices mounted on the first surface of the substrate and electrically connected to the circuit portion, wherein the substrate is provided with a groove portion in the second surface thereof, and has a structure bent along the groove portion.Type: GrantFiled: May 19, 2015Date of Patent: May 30, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young Kyung Kim, Seog Ho Lim, Ji Hyun Lim
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Publication number: 20160062033Abstract: A light source module is provided. The light source module includes a substrate having a first surface on which a circuit portion is disposed, and a second surface disposed opposite thereto. The light source module further includes a plurality of light emitting devices mounted on the first surface of the substrate and electrically connected to the circuit portion, wherein the substrate is provided with a groove portion in the second surface thereof, and has a structure bent along the groove portion.Type: ApplicationFiled: May 19, 2015Publication date: March 3, 2016Inventors: Young Kyung KIM, Seog Ho LIM, Ji Hyun LIM
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Publication number: 20150176819Abstract: A metal copper clad laminate (MCCL) includes a metal base, an insulating layer and a copper foil. The metal base has at least one recess defined in one surface thereof. The insulating layer is laminated on the one surface of the metal base and has a first opening exposing the at least one recess. The copper foil is laminated on the insulating layer and has a second opening exposing the at least one recess and the first opening.Type: ApplicationFiled: August 28, 2014Publication date: June 25, 2015Inventors: Young Kyung KIM, Jae Wook KWON, Seog Ho LIM, Seok Chan HONG
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Patent number: 7628527Abstract: There is provided a back light unit having a light guide buffer plate. The back light unit having a light guide buffer plate includes a light source for generating the light when a power source is applied; a light guide panel whose light-receiving vertical surface that the light emitted from the light source enters is provided with a first prism pattern and whose bottom surface is provided with a refraction pattern, thereby converting the incident light from the light-receiving vertical surface into a surface light source; a reflection unit disposed in a bottom surface of the light guide panel to reflect light toward the light guide panel; and a buffer disposed between the light source and the light guide panel and whose light-emitting vertical surface corresponding to the light-receiving vertical surface of the light guide panel is provided with a second prism pattern.Type: GrantFiled: November 29, 2007Date of Patent: December 8, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Do Hun Kim, Myoung Soo Choi, Choul Ho Lee, Seog Ho Lim, Sung Min Yang
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Patent number: 7499228Abstract: A lens includes a convex surface formed in an outer surface thereof facing away from a light source to uniformly distribute light emitted from the light source; a concave surface concaved inward from an inner region of the convex surface, around an optical axis; and a convex portion convexed outward from a central region of the concave surface, which the optical axis intersects, in order to enhance quantity of light around the optical axis. The lens refracts light beams falling onto the respective areas thereof at different angles, thereby producing a uniform light distribution within a specific lighting range, but does not create a dark area around an optical axis.Type: GrantFiled: November 15, 2006Date of Patent: March 3, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young June Jeong, Seog Ho Lim, Bum Jin Kim, Sung Min Yang
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Publication number: 20080137374Abstract: There is provided a back light unit having a light guide buffer plate. The back light unit having a light guide buffer plate includes a light source for generating the light when a power source is applied; a light guide panel whose light-receiving vertical surface that the light emitted from the light source enters is provided with a first prism pattern and whose bottom surface is provided with a refraction pattern, thereby converting the incident light from the light-receiving vertical surface into a surface light source; a reflection unit disposed in a bottom surface of the light guide panel to reflect light toward the light guide panel; and a buffer disposed between the light source and the light guide panel and whose light-emitting vertical surface corresponding to the light-receiving vertical surface of the light guide panel is provided with a second prism pattern.Type: ApplicationFiled: November 29, 2007Publication date: June 12, 2008Inventors: Do Hun Kim, Myoung Soo Choi, Choul Ho Lee, Seog Ho Lim, Sung Min Yang