Patents by Inventor Seog-woo Hong

Seog-woo Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10093534
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: October 9, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Publication number: 20180201501
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo HONG, Seok-whan CHUNG, Chang-jung KIM
  • Patent number: 9957155
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: May 1, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Patent number: 9596528
    Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: March 14, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Patent number: 9525948
    Abstract: An electro-acoustic transducer includes a plurality of elements that each includes a plurality of cells. The plurality of cells includes at least two membranes that have different thicknesses. The respective frequency bands of the plurality of elements are broader than respective frequency bands of the plurality of cells that configure the plurality of elements.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: December 20, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-ha Park, Sung-chan Kang, Dong-kyun Kim, Seog-woo Hong
  • Patent number: 9475092
    Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: October 25, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Patent number: 9319800
    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: April 19, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo Hong, Hyung-jae Shin, Dong-sik Shim, Byung-gil Jeong, Seok-whan Chung
  • Patent number: 9206038
    Abstract: A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having a plurality of ultrasonic transducers by bonding an electrode pad wafer supplying electricity to the plurality of ultrasonic transducers and the device wafer, and dicing the ultrasonic transducer wafer to form the plurality of ultrasonic transducers by cutting the plurality of ultrasonic transducer structures on the first trench and the electrode pad wafer below the first trench.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: December 8, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung-gil Jeong, Seog-woo Hong
  • Patent number: 9120126
    Abstract: Electro-acoustic transducers and methods of manufacturing the electro-acoustic transducer are provided. An electro-acoustic transducer includes: a first wafer including a first substrate in which a plurality of electro-acoustic transducer cells are formed; and a second wafer disposed in a lower portion of the first wafer, and including a second substrate in which a plurality of through wafer vias are formed. A method of manufacturing an electro-acoustic transducer includes: forming a plurality of electro-acoustic transducer cells in a first substrate of a first wafer; forming a plurality of through wafer vias in a second substrate of a second wafer; and bonding the first and second wafers to each other.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: September 1, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seog-woo Hong
  • Patent number: 9120127
    Abstract: An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 1, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung-gil Jeong, Seog-woo Hong, Dong-kyun Kim, Seok-whan Chung, Hyung-jae Shin
  • Publication number: 20150230029
    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
    Type: Application
    Filed: June 27, 2014
    Publication date: August 13, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo HONG, Hyung-jae SHIN, Dong-sik SHIM, Byung-gil JEONG, Seok-whan CHUNG
  • Patent number: 9096418
    Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo Hong, Dong-kyun Kim, Byung-gil Jeong, Seok-whan Chung
  • Patent number: 9090458
    Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a conductive substrate, a projection which is disposed on the conductive substrate and which forms a cavity therein, a via hole which penetrates the projection and conductive substrate, a first electrode which includes a metal and which fills the via hole, a second electrode which is provided on a bottom of the conductive substrate, a membrane which is provided on the projection and which covers the cavity, and an upper electrode which is provided on the membrane and which contacts the first electrode.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: July 28, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seog-woo Hong
  • Publication number: 20150163599
    Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.
    Type: Application
    Filed: May 27, 2014
    Publication date: June 11, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo Hong, Seok-whan Chung, Chang-jung Kim
  • Publication number: 20150156571
    Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.
    Type: Application
    Filed: May 19, 2014
    Publication date: June 4, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo HONG, Seok-whan CHUNG, Chang-jung KIM
  • Publication number: 20150139452
    Abstract: An electro-acoustic transducer includes a plurality of elements that each includes a plurality of cells. The plurality of cells includes at least two membranes that have different thicknesses. The respective frequency bands of the plurality of elements are broader than respective frequency bands of the plurality of cells that configure the plurality of elements.
    Type: Application
    Filed: April 28, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-ha PARK, Sung-chan KANG, Dong-kyun KIM, Seog-woo HONG
  • Publication number: 20150137285
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Application
    Filed: May 23, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo HONG, Seok-whan CHUNG, Chang-jung KIM
  • Publication number: 20150054095
    Abstract: A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having a plurality of ultrasonic transducers by bonding an electrode pad wafer supplying electricity to the plurality of ultrasonic transducers and the device wafer, and dicing the ultrasonic transducer wafer to form the plurality of ultrasonic transducers by cutting the plurality of ultrasonic transducer structures on the first trench and the electrode pad wafer below the first trench.
    Type: Application
    Filed: June 6, 2014
    Publication date: February 26, 2015
    Inventors: Byung-gil JEONG, Seog-woo HONG
  • Patent number: 8764320
    Abstract: A light screening apparatus and a method of fabricating the same are provided. The light screening apparatus includes: a base plate including a first electrode; at least one material layer on the base plate; a rollup blade including a second electrode and configured to be disposed corresponding to a light transmitting portion of the base plate; a driving unit configured to be electrically connected to the first electrode and the second electrode; and a sticking prevention structure which prevents sticking between the rollup blade and the material layer. The sticking prevention structure may refer to a surface structure of at least one of the rollup blade and the material layer or a sticking prevention layer or a sticking prevention pattern which is additionally formed on at least one of an outer circumference surface of the rollup blade and a surface of the material layer.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: July 1, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seog-Woo Hong, Che-Heung Kim
  • Publication number: 20140145275
    Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a conductive substrate, a projection which is disposed on the conductive substrate and which forms a cavity therein, a via hole which penetrates the projection and conductive substrate, a first electrode which includes a metal and which fills the via hole, a second electrode which is provided on a bottom of the conductive substrate, a membrane which is provided on the projection and which covers the cavity, and an upper electrode which is provided on the membrane and which contacts the first electrode.
    Type: Application
    Filed: August 7, 2013
    Publication date: May 29, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seog-woo HONG