Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.

Abstract: A method for fabricating a thinned flat plate heat pipe, including forming a body part having a flat plate shape by using an extrusion process, forming a through-hole in the longitudinal direction of the body part, and forming one or more grooves on at least one side of an inner wall of the through-hole to allow a working fluid to flow.

Abstract: Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.

Abstract: Provided is a method of manufacturing a nitride semiconductor device. The method includes forming a plurality of electrodes on a growth substrate on which first and second nitride semiconductor layers are sequentially stacked, forming upper metal layers on the plurality of electrodes respectively, removing the growth substrate to expose a lower surface of the first nitride semiconductor layer, and forming a third nitride semiconductor layer and a lower metal layer sequentially on the exposed lower surface of the first nitride semiconductor layer.

Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.

Abstract: The present invention relates to a concentrated photovoltaic module and, more particularly, to a concentrated photovoltaic module that is capable of efficiently dissipating the heat generated in a solar cell to the atmosphere. The concentrated photovoltaic module according to the present invention includes: a concentrated lens array module having at least one condenser lens; a solar cell positioned at the lower end of the condenser lens; a substrate positioned at the lower end of the solar cell and supplied with the heat generated in the solar cell; a flat plate-type heat pipe positioned at the lower end of the substrate; a flat plate-type heat sink positioned at the lower end of the flat plate-type heat pipe; and a condenser lens array structure fixing the condenser lens array module to the substrate.

Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.

Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: an active region provided on a substrate; an inlet channel formed as a single cavity buried in one side of the substrate; an outlet channel formed as a single cavity buried in the other side of the substrate; a micro channel array comprising a plurality of micro channels, wherein the plurality of micro channels are formed as a plurality of cavities buried in the substrate, and one end of the micro channel array is connected to a side of the inlet channel and the other end of the micro channel array is connected to a side of the outlet channel; and a micro heat sink array separating the micro channels from one another.

Abstract: Provided is a method of manufacturing a nitride semiconductor device. The method includes forming a plurality of electrodes on a growth substrate on which first and second nitride semiconductor layers are sequentially stacked, forming upper metal layers on the plurality of electrodes respectively, removing the growth substrate to expose a lower surface of the first nitride semiconductor layer, and forming a third nitride semiconductor layer and a lower metal layer sequentially on the exposed lower surface of the first nitride semiconductor layer.

Abstract: The present inventive concept discloses an impact-type piezoelectric micro power generator. The impact-type piezoelectric micro power generator may comprise a base having a cavity and at least one stop area adjacent to the cavity; a frame fastened to the base; a vibrating body comprising a plurality of first vibrating beams extended from the frame toward a top of the cavity, an impact beam connected to between first tips of the plurality of first vibrating beams and extended onto the stop area, and a second vibrating beam extended from the impact beam to between the plurality of first vibrating beams, the second vibrating beam having a second tip; and a piezoelectric device disposed on one of a top and a bottom of the second vibrating beam and the impact beam, the piezoelectric device generating electric power according to impacts of the vibrating body to the stop area and bending of the impact beam and the second vibrating beam.

Abstract: Provided is a solar cell module. The solar cell module includes a heat sink, a light guide plate on the heat sink, a cooling part passing through a center of the light guide plate between the light guiding plate and the heat sink, the cooling part extending from a center of the heat sink up to each of edges of the heat sink, solar cells fixed to the cooling part, and a light concentrating plate disposed on the solar cells, cooling part, and the light guiding plate to concentrate solar light onto the light guide plate and the solar cells.

Abstract: Provided is a terahertz health checker. The terahertz health checker includes a terahertz wave transmitter generating terahertz waves in a terahertz band, a lens outputting the terahertz waves and receiving terahertz waves reflected from the outputted terahertz waves, an imaging chip connected to the lens, detecting the received terahertz waves, and generating a digital image signal based on the detected terahertz waves, a readout circuit reading out the digital image signal, and a transceiver outputting the read-out digital image signal to the outside.

Abstract: The present inventive concept discloses an impact-type piezoelectric micro power generator. The impact-type piezoelectric micro power generator may comprise a base having a cavity and at least one stop area adjacent to the cavity; a frame fastened to the base; a vibrating body comprising a plurality of first vibrating beams extended from the frame toward a top of the cavity, an impact beam connected to between first tips of the plurality of first vibrating beams and extended onto the stop area, and a second vibrating beam extended from the impact beam to between the plurality of first vibrating beams, the second vibrating beam having a second tip; and a piezoelectric device disposed on one of a top and a bottom of the second vibrating beam and the impact beam, the piezoelectric device generating electric power according to impacts of the vibrating body to the stop area and bending of the impact beam and the second vibrating beam.

Abstract: Provided is a mobile e-binder system including at least one display configured to display data, a docking system electrically connected to the at least one display to exchange the data using a standardized communication protocol, and a computing device configured to store and process the data and send the data to the at least one display. The at least one display may be configured to be attachable and detachable to the docking system.

Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.

Abstract: The present disclosure relates to a flat heat pipe in which a plurality of minute wires is inserted and a fabrication method thereof. A flat heat pipe according to an exemplary embodiment of the present disclosure includes a through hole which is formed in a flat panel shaped body in a longitudinal direction one or more grooves which are formed above an inner wall of the through hole, and a plurality of wires which is inserted below the inner wall of the through hole in the longitudinal direction.

Abstract: Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.

Abstract: There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of the plates includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transporting heat generated by a heat source.

Abstract: Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.

Abstract: Provided is a sunlight complex module, which includes a photovoltaic conversion part that generates electrical energy from sunlight, a heat collector board attached to a bottom of the photovoltaic conversion part to collect heat from a portion of the sunlight, which has a wavelength to pass through the photovoltaic conversion part, a heat pipe attached to the heat collector board, and transferring thermal energy collected in the heat collector board, to an outside thereof, and a mold sealed to maintain a vacuum therein. The photovoltaic conversion part, the heat collector board, and the heat pipe are accommodated in the mold.