Patents by Inventor Seon Goo Lee
Seon Goo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240101810Abstract: The present invention relates to a composition for forming a composite polymer film, a method for preparing the composition for forming a composite polymer film, a composite polymer film and a method for preparing the composite polymer film. The composition for forming a composite polymer film comprises: a fluorine-based polymer solution comprising a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the fluorine-based polymer solution. The method for preparing the composition for forming a composite polymer film comprises the steps of: preparing a fluorine-based polymer solution comprising a fluorine-based polymer; and dispersing polyvinylidene fluoride nanoparticles in the fluorine-based polymer solution. The composite polymer film comprises: a polymer matrix formed from a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the polymer matrix.Type: ApplicationFiled: September 4, 2020Publication date: March 28, 2024Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGYInventors: Eun Ho SOHN, Shin Hong YOOK, Hong Suk KANG, In Joon PARK, Sang Goo LEE, Soo Bok LEE, Won Wook SO, Hyeon Jun HEO, Dong Je HAN, Seon Woo KIM
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Patent number: 8324646Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.Type: GrantFiled: July 23, 2010Date of Patent: December 4, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Seon Goo Lee, Kyung Taeg Han, Seong Yeon Han
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Patent number: 8202746Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.Type: GrantFiled: September 4, 2008Date of Patent: June 19, 2012Assignee: Samsung LED Co., Ltd.Inventors: Seon Goo Lee, Geun Chang Ryo, Dong Yeoul Lee, Yong Tae Kim, Young Jae Song
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Patent number: 8169128Abstract: The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.Type: GrantFiled: August 8, 2006Date of Patent: May 1, 2012Assignee: Samsung LED Co., Ltd.Inventors: Seon Goo Lee, Chang Ho Song, Kyung Taeg Han
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Patent number: 8105854Abstract: A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.Type: GrantFiled: November 4, 2009Date of Patent: January 31, 2012Assignee: Samsung LED Co., Ltd.Inventors: Seon Goo Lee, Hun Joo Hahm, Dae Yeon Kim
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Patent number: 8013352Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.Type: GrantFiled: January 8, 2010Date of Patent: September 6, 2011Assignee: Samsung LED Co., Ltd.Inventors: Seon Goo Lee, Kyung Taeg Han, Seong Yeon Han
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Patent number: 7903410Abstract: A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.Type: GrantFiled: January 30, 2008Date of Patent: March 8, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Min-Sang Lee, Seon-Goo Lee, Han-Seo Cho
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Patent number: 7875476Abstract: An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.Type: GrantFiled: November 4, 2009Date of Patent: January 25, 2011Assignee: Samsung Led Co., Ltd.Inventors: Seon Goo Lee, Hun Joo Hahm, Jung Kyu Park, Kyung Taeg Han, Seong Yeon Han, Dae Yeon Kim, Young Sam Park
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Patent number: 7846752Abstract: An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.Type: GrantFiled: October 28, 2008Date of Patent: December 7, 2010Assignee: Samsung Electro-Mechanics., Ltd.Inventors: Chang Wook Kim, Seon Goo Lee
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Publication number: 20100289051Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.Type: ApplicationFiled: July 23, 2010Publication date: November 18, 2010Applicant: Samsung LED Co., Ltd.Inventors: Seon Goo LEE, Kyung Taeg Han, Seong Yeon Han
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Patent number: 7833811Abstract: The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.Type: GrantFiled: June 12, 2008Date of Patent: November 16, 2010Assignee: Samsung LED Co., Ltd.Inventors: Kyung Taeg Han, Myoung Soo Choi, Seon Goo Lee, Hun Joo Hahm, Seong Yeon Han, Chang Ho Song, Young Sam Park
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Patent number: 7795052Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.Type: GrantFiled: January 8, 2010Date of Patent: September 14, 2010Assignee: Samsung Led Co., Ltd.Inventors: Seon Goo Lee, Kyung Taeg Han, Seong Yeon Han
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Patent number: 7790482Abstract: The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.Type: GrantFiled: February 12, 2009Date of Patent: September 7, 2010Assignee: Samsung Led Co., Ltd.Inventors: Seong Yeon Han, Seon Goo Lee, Chang Ho Song, Jung Kyu Park, Young Sam Park, Kyung Taeg Han
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Patent number: 7714342Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.Type: GrantFiled: January 10, 2007Date of Patent: May 11, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon Goo Lee, Kyung Taeg Han, Seong Yeon Han
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Publication number: 20100112735Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.Type: ApplicationFiled: January 8, 2010Publication date: May 6, 2010Applicant: Samsung Electro-Mechanics Co., LtdInventors: Seon Goo Lee, Kyung Taeg Han, Seong Yeon Han
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Publication number: 20100109040Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.Type: ApplicationFiled: January 8, 2010Publication date: May 6, 2010Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon Goo LEE, Kyung Taeg Han, Seong Yeon Han
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Patent number: RE43200Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess.Type: GrantFiled: February 11, 2008Date of Patent: February 21, 2012Assignee: Samsung LED Co., Ltd.Inventors: Seon Goo Lee, Chang Wook Kim, Kyung Taeg Han
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Patent number: RE44811Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess.Type: GrantFiled: December 19, 2011Date of Patent: March 18, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Seon Goo Lee, Chang Wook Kim, Kyung Taeg Han
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Patent number: RE45596Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess.Type: GrantFiled: November 11, 2011Date of Patent: June 30, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seon Goo Lee, Chang Wook Kim, Kyung Taeg
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Patent number: RE46851Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess.Type: GrantFiled: May 12, 2015Date of Patent: May 15, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seon Goo Lee, Chang Wook Kim, Kyung Taeg Han