Patents by Inventor Seong-Heon Jeong

Seong-Heon Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10411493
    Abstract: Certain aspects of the present disclosure are generally directed to apparatus and techniques for wireless charging. One example apparatus generally includes a plurality of inductive elements and signal generation circuitry coupled to the plurality of inductive elements and configured to generate a plurality of signals, where at least two signals of the plurality of signals have different magnitudes. In certain aspects, the signal generation circuitry is configured to drive the plurality of inductive elements using the plurality of signals, where at least one first inductive element of the plurality of inductive elements is driven using at least one first signal of the plurality of signals having a first phase and at least one second inductive element of the plurality of inductive elements is driven using at least one second signal of the plurality of signals having a second phase different from the first phase.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: September 10, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: William Henry Von Novak, III, Mark White, II, Seong Heon Jeong
  • Publication number: 20190267713
    Abstract: A multi-layer laminate antenna includes: a feed line configured to convey electricity; a radiator coupled to the feed line, comprising metal disposed in a first layer of the antenna, and having an edge of a length to radiate energy at a radiating frequency; and dummy metal disposed in a second layer of the antenna that is different from the first layer of the antenna; where a first portion of the dummy metal is configured such that any linear edge of the first portion of the dummy metal disposed outside an area of the second layer overlapped by the radiator is less than half of a radiating wavelength corresponding to the radiating frequency.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 29, 2019
    Inventors: Seong Heon JEONG, Mohammad Ali TASSOUDJI
  • Patent number: 10390468
    Abstract: The present disclosure describes aspects of a wireless power-transmission shield for a wireless charger. The wireless charger includes a wireless power transmitter configured to generate an alternating magnetic field at a charging frequency. As a result of the alternating magnetic field, a spurious electromagnetic field is further generated at a spurious frequency different than the charging frequency. The wireless charger includes a shield having an associated conductivity or an associated impedance. The shield is configured to be substantially transparent to the alternating magnetic field based on the charging frequency and the associated conductivity of the shield or the associated impedance of the shield. The shield is further configured to be lossy to the spurious electromagnetic field based on the spurious frequency and the associated conductivity of the shield or the associated impedance of the shield.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: August 20, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Seong Heon Jeong
  • Patent number: 10381875
    Abstract: A method and system for providing wireless power transfer through a metal object is provided. In one aspect, an apparatus for wirelessly receiving power via a magnetic field is provided. The apparatus includes a metal cover including an inner portion and an outer portion. The outer portion is configured to form a loop around the inner portion of the metal cover. The outer portion is configured to inductively couple power via the magnetic field. The apparatus includes a receive circuit electrically coupled to the outer portion and configured to receive a current from the outer portion generated in response to the magnetic field. The receive circuit is configured to charge or power a load based on the current.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: August 13, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Mei-Li Chi, Curtis Gong, David George Fern, Francesco Carobolante
  • Publication number: 20190229560
    Abstract: An apparatus is disclosed that implements ultrasonic power transmission with impedance detection. In an example aspect, the apparatus includes an array of ultrasonic transducers and an acoustic-impedance detection system. The acoustic-impedance detection system is configured to transmit an ultrasonic detection pulse from an ultrasonic transducer of the array. Based on the ultrasonic detection pulse, the acoustic-impedance detection system can determine an acoustic impedance at the ultrasonic transducer. Based on the acoustic impedance, the acoustic-impedance detection system can transmit an ultrasonic charging signal.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 25, 2019
    Inventors: William Henry Von Novak, III, Seong Heon Jeong, Cody Wheeland
  • Patent number: 10361588
    Abstract: An electronic device is disclosed, having electronic components and a metal case configured to house the electronic components. A power receiving element may be disposed on the metal case near an edge thereof. The power receiving element may couple with a magnetic field that emanates from the edge of the metal case, when the metal case is exposed to an externally generated magnetic field, to wirelessly receive power from the externally generated magnetic field.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: July 23, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Seong Heon Jeong
  • Patent number: 10333334
    Abstract: An electronic apparatus may include an electrically conductive body configured to magnetically couple to a first magnetic field. A first tuning element may be connected to the electrically conductive body. An electrically conductive coil may be wound about an opening defined by the electrically conductive body, and configured to magnetically couple to a second magnetic field.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: June 25, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Charles Edward Wheatley, Francesco Carobolante, Mark White, II
  • Patent number: 10333352
    Abstract: Certain aspects of the present disclosure relate to methods and apparatus for controlling a power level of wireless power transfer. Certain aspects provide a wireless power receiver. The wireless power receiver includes an antenna and a rectifier. The rectifier includes a first diode and a second diode. The wireless power receiver further includes a resistor in parallel with the first diode. A first terminal of the resistor is coupled to a first terminal of the first diode. A second terminal of the resistor is coupled to a second terminal of the first diode.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: June 25, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: William Henry Von Novak, III, Linda Stacey Irish, Cody Burton Wheeland, Seong Heon Jeong
  • Patent number: 10333350
    Abstract: An apparatus for wireless power reception in an electronic device may include a casing configured to house electronic components of the electronic device. The casing may include a non-conductive support substrate and a metal layer disposed on the support substrate. The apparatus may include a power receiving element configured to magnetically couple to an externally generated magnetic field to produce power for one or more of the electronic components of the electronic device.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: June 25, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Randy Standke, Seong Heon Jeong
  • Patent number: 10312716
    Abstract: An apparatus may include an electrically conductive body to magnetically couple to a first magnetic field. A first tuning element may be connected to the electrically conductive body. An electrically conductive coil may be wound about an opening in the electrically conductive body, and configured to magnetically couple to a second magnetic field.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: June 4, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Francesco Carobolante, Charles Edward Wheatley, Mark White, II
  • Publication number: 20190159364
    Abstract: Disclosed is a method and apparatus for mitigating temperature spikes and dissipating heat. The apparatus for mitigating temperature spikes and dissipating heat comprises one or more heatsinks, one or more sensors, one or more phase change materials and one or more processors coupled to the one or more sensors. The one or more processors may be configured to obtain one or more sensor measurements and may be configured to determine whether to store heat or dissipate heat based on the one or more sensor measurements. In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks. Furthermore, in response to a determination to store heat, store heat from the one or more processors using the one or more phase change materials.
    Type: Application
    Filed: August 31, 2018
    Publication date: May 23, 2019
    Inventors: Sean Charles ANDREWS, Seong Heon JEONG, William Henry VON NOVAK
  • Patent number: 10275634
    Abstract: Disclosed are methods, devices, apparatuses, and systems for ultrasonic fingerprint sensing with an acoustic shielding structure. One or more layers in an ultrasonic fingerprint sensing system may reflect back ultrasonic waves due to acoustic impedance mismatch that can distort a fingerprint image. An acoustic shielding structure may be configured to absorb, store, trap, or otherwise attenuate ultrasonic waves. The acoustic shielding structure may be positioned underlying an ultrasonic sensor layer. In some implementations, the acoustic shielding structure may include a plurality of periodically spaced apart geometric features or holes in a medium.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: April 30, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Jong Soo Kim
  • Publication number: 20190123425
    Abstract: Methods, systems, and devices for wireless communications are described. An antenna structure for wideband coverage may include a first bowtie antenna disposed in a first plane. The first bowtie antenna may be, for example, an elliptical bowtie antenna or a triangular bowtie antenna. The antenna structure may also include a plurality of additional bowtie antennas, each of the plurality of additional bowtie antennas disposed in a different plane parallel to the first plane. The first bowtie antenna and the plurality of additional bowtie antennas may be stacked in a first direction perpendicular to the first plane to form a bowtie antenna stack. The antenna structure may include a plurality of bowtie antenna stacks. The antenna structure may also include a staggered conductive wall.
    Type: Application
    Filed: October 17, 2018
    Publication date: April 25, 2019
    Inventors: Seong Heon Jeong, Mohammad Ali Tassoudji, Alireza Mohammadian, Jorge Fabrega Sanchez, Taesik Yang
  • Publication number: 20190103653
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong KIM, II, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO
  • Patent number: 10243411
    Abstract: The present disclosure pertains to wireless chargers. In one embodiment, a 2×2 array of conductive coils produces magnetic fields. Adjacent coils receive current having different directions to cancel magnetic fields around a periphery of the array. A wireless charging platform may include at least four such coils. Regions between and above the coils may include magnetic fields approximately parallel to the surface of the platform so that electronic devices may be charged while standing up during operation by a user with reduced exposure to magnetic radiation. An electronic device may also be placed flat on each coil for charging.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: March 26, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Jeong Il Kim
  • Patent number: 10224753
    Abstract: A wireless power transmitter includes a power transmit coil configured to generate a magnetic field for wirelessly coupling charging power to one or more receiver devices, the magnetic field having a magnetic field distribution over an area defining a charging region, a circuit configured to alter the magnetic field generated by the power transmit coil to alter the magnetic field distribution, and a controller operably coupled to the circuit, the controller configured to control the circuit to alter the magnetic field distribution responsive to a detected characteristic of the one or more receiver devices.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: March 5, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: William Henry Von Novak, III, Edward Kenneth Kallal, Cody Burton Wheeland, Seong Heon Jeong
  • Publication number: 20190059832
    Abstract: Disclosed herein are techniques for providing a status of an implant device during or after the implantation of the implant device using reconfigurable indicators. In one embodiment, an implant device includes a reconfigurable indicator and a controller comprising or coupled to the reconfigurable indicator. The reconfigurable indicator is implantable, and is reconfigurable to a plurality of states by the controller. The reconfigurable indicator is configured to be visible by an imaging system when the reconfigurable indicator is implanted and set to a first state of the plurality of states.
    Type: Application
    Filed: August 28, 2017
    Publication date: February 28, 2019
    Inventors: William Henry Von Novak, III, Seong Heon Jeong, Michael Harris
  • Publication number: 20190067221
    Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.
    Type: Application
    Filed: December 12, 2017
    Publication date: February 28, 2019
    Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad Ali TASSOUDJI, Vladimir APARIN, Seong Heon JEONG, Jeremy DUNWORTH, Alireza MOHAMMADIAN, Mario Francisco VELEZ, Chin-Kwan KIM
  • Publication number: 20190069452
    Abstract: The present disclosure describes aspects of a wireless power-transmission shield for a wireless charger. The wireless charger includes a wireless power transmitter configured to generate an alternating magnetic field at a charging frequency. As a result of the alternating magnetic field, a spurious electromagnetic field is further generated at a spurious frequency different than the charging frequency. The wireless charger includes a shield having an associated conductivity or an associated impedance. The shield is configured to be substantially transparent to the alternating magnetic field based on the charging frequency and the associated conductivity of the shield or the associated impedance of the shield. The shield is further configured to be lossy to the spurious electromagnetic field based on the spurious frequency and the associated conductivity of the shield or the associated impedance of the shield.
    Type: Application
    Filed: August 25, 2017
    Publication date: February 28, 2019
    Inventor: Seong Heon Jeong
  • Patent number: 10181757
    Abstract: Methods and apparatus are disclosed for wirelessly transmitting power. In one aspect, an apparatus for wireless transmitting power is provided. The apparatus comprises a first metal sheet having a shape that defines a plurality of slots, the plurality of slots inwardly extending from a periphery of the first metal sheet. The apparatus further comprises a coil configured to generate a magnetic field sufficient to charge or power a load, wherein the first metal sheet extends over a width and a length of the coil, and wherein the plurality of slots are configured to at least partially cancel eddy currents generated in the first metal sheet via the magnetic field.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: January 15, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Seong Heon Jeong