Abstract: Disclosed herein is a cooling system for two-dimensional array power converters. The cooling system includes: a plurality of power converters arranged in two-dimension; a compressor configured to generate compressed air; vortex tubes each installed in the respective power converters, the vortex tubes configured to generate low-temperature air based on compressed air from the compressor; valves installed between the compressor and the vortex tubes; temperature sensors each installed in the respective power converters to measure temperature inside the power converters; and a controller configured to determine whether to supply the low-temperature air into the power converters by using the vortex tubes, based on the temperature measured by the temperature sensors, and to control the valves depending on a result of the determination.

Abstract: Disclosed herein is a cooling system for two-dimensional array power converters. The cooling system includes: a plurality of power converters arranged in two-dimension; a compressor configured to generate compressed air; vortex tubes each installed in the respective power converters, the vortex tubes configured to generate low-temperature air based on compressed air from the compressor; valves installed between the compressor and the vortex tubes; temperature sensors each installed in the respective power converters to measure temperature inside the power converters; and a controller configured to determine whether to supply the low-temperature air into the power converters by using the vortex tubes, based on the temperature measured by the temperature sensors, and to control the valves depending on a result of the determination.

Abstract: In some embodiments, a cabinet for electric device and, more particularly, a closed cabinet for electric devices which has a heat pipe capable of efficiently dissipating heat generated from internal devices, implementing compact design of the cabinet and enhancing durability of the internal devices. In some embodiments, the cabinet includes a device accommodation space providing a closed space to accommodate the electric device, a heat dissipation duct provided separately from the device accommodation space to dissipate heat generated from the device accommodation space, and a heat dissipator including a heat sink attached to a heating element of the device accommodation space; a heat dissipation fin disposed in the heat dissipation duct; a heat pipe configured to transfer heat of the heat sink to the heat dissipation fin.

Abstract: Provided is a cabinet for a power electronic apparatus, including: an external case that accommodates a module accommodation unit; a duct that is formed as a section divided in one side wall of the external case; an intake hole that is formed in the lower portion of the duct; a circulation pan that is provided in the upper portion of the duct; a heat dissipation plate that is fastened to one side of an power electronic module that is accommodated in the module accommodation unit; and an oscillating capillary tube heat pipe unit that is mounted on the heat dissipation plate.