Abstract: An apparatus for mounting on a circuit board is provided. The apparatus may include a circuit board mount packaging and a battery. The circuit board mount packaging may include a cavity, a first internal lead, and a second internal lead. The first internal lead may be connect to a first external pin and the second internal lead may be connected to a second external pin. The battery may be disposed within the cavity of the circuit board mount packaging. The battery may comprise an anode and a cathode. The anode may be wire bond connected to the first internal lead and the cathode may be wire bond connected to the second internal lead.

Abstract: A multispectral imager includes processing circuitry, an illumination assembly, a detector assembly, and a focusing assembly. The illumination assembly includes an array of illumination elements controlled by the processing circuitry to illuminate a scene. The detector assembly includes a detector array controlled by the processing circuitry to capture images from the scene at different wavelengths. The focusing assembly includes a lens and is controlled by the processing circuitry to adjust a focal point for the detector array. The processing circuitry generates and processes the images from the scene, taken at different wavelengths and focal points, combines the images to form a multispectral image cube for the scene, and determines a composition of an object within the scene based on a spectral profile of the multispectral image cube.

Abstract: A multispectral imager includes processing circuitry, an illumination assembly, a detector assembly, and a focusing assembly. The illumination assembly includes an array of illumination elements controlled by the processing circuitry to illuminate a scene. The detector assembly includes a detector array controlled by the processing circuitry to capture images from the scene at different wavelengths. The focusing assembly includes a lens and is controlled by the processing circuitry to adjust a focal point for the detector array. The processing circuitry generates and processes the images from the scene, taken at different wavelengths and focal points, combines the images to form a multispectral image cube for the scene, and determines a composition of an object within the scene based on a spectral profile of the multispectral image cube.

Abstract: A multi-chip module is provided including a multiplier configured to multiply a frequency of an input signal into a predetermined Ka-band frequency center channel, a modulator configured to modulate the center channel, and an amplifier configured to amplify a modulated signal for output.

Abstract: A multi-chip module is provided including a multiplier configured to multiply a frequency of an input signal into a predetermined Ka-band frequency center channel, a modulator configured to modulate the center channel, and an amplifier configured to amplify a modulated signal for output.

Abstract: A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.

Abstract: A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.

Abstract: A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.

Abstract: A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.