Patents by Inventor Seth REIGHTLER

Seth REIGHTLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal features of an electronic device and method for forming an electronic device including thermal features
    Patent number: 10156874
    Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: December 18, 2018
    Assignee: Apple Inc.
    Inventors: Lee E. Hooton, Ian A. Spraggs, Marwan Rammah, Seth Reightler, Tyler Kakuda
  • THERMAL FEATURES OF A MOBILE DEVICE
    Publication number: 20170068292
    Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.
    Type: Application
    Filed: May 4, 2016
    Publication date: March 9, 2017
    Inventors: Lee E. HOOTON, Ian A. SPRAGGS, Marwan RAMMAH, Seth REIGHTLER, Tyler KAKUDA