Patents by Inventor Seung-gil JEON
Seung-gil JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240114778Abstract: The present disclosure relates to an organic electroluminescent compound, a plurality of host materials, and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure or by comprising a specific combination of compounds according to the present disclosure as a plurality of host materials, it is possible to produce an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: ApplicationFiled: August 14, 2023Publication date: April 4, 2024Inventors: So-Young JUNG, Hyo-Nim SHIN, Seung-Hyun YOON, Hyun-Ju KANG, Ye-Jin JEON, Tae-Jun HAN, Mi-Ja LEE, Dong-Gil KIM, Sang-Hee CHO
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Patent number: 11424535Abstract: An electronic device is provided. The electronic device includes a cover glass, a rear cover which faces away from the cover glass, and a plurality of communication devices that are interposed between the cover glass and the rear cover. Each of the plurality of communication devices comprises a printed circuit board (PCB), an antenna array positioned at the PCB, a dielectric substance positioned on one surface of the antenna array, a conductor positioned on an opposite surface of the antenna array, and a communication circuit electrically connected with the antenna array. The communication circuit is configured to feed the antenna array and transmit/receive a signal in a specified frequency band based on an electrical path formed through the antenna array.Type: GrantFiled: November 23, 2018Date of Patent: August 23, 2022Assignee: Samsung Electronics Co., Ltd.Inventor: Seung Gil Jeon
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Patent number: 11223102Abstract: An electronic device according to an embodiment of the disclosure may include housing including a rear cover and a cover glass facing away from the rear cover, an antenna array interposed between the rear cover and the cover glass and including at least one or more antenna units, a printed circuit board (PCB) interposed between the antenna array and the cover glass, and a communication circuit disposed on the PCB and feeding the antenna array. Other various embodiments as understood from the specification are also possible.Type: GrantFiled: May 17, 2018Date of Patent: January 11, 2022Assignee: Samsung Electronics Co., LtdInventor: Seung Gil Jeon
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Patent number: 11133571Abstract: An electronic apparatus, according to various embodiments of the present invention, comprises: a first antenna of a first bandwidth; a second antenna of a second bandwidth which partially overlaps with the first bandwidth; a third antenna of the first bandwidth; a fourth antenna of the second bandwidth; a transmission/reception path corresponding to each of a plurality of bandwidths; a reception path corresponding to each of the plurality of bandwidths; and a path formation unit which forms a path such that any one of the first antenna and the third antenna is connected to the transmission/reception path, the other of the first antenna and the third antenna is connected to the reception path, and any one of the second antenna and the fourth antenna is connected to the transmission/reception path, and the other of the second antenna and the fourth antenna is connected to the reception path.Type: GrantFiled: October 5, 2016Date of Patent: September 28, 2021Inventors: Sung-Chul Park, Yeon-Woo Kim, Jong-Hyuk Kim, Seung-Gil Jeon, Young-Ju Kim, Chae-Man Lim
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Patent number: 11075444Abstract: An electronic device is provided. The electronic device includes a housing that includes a front surface, a rear surface facing away from the front surface, and a side surface surrounding a space between the front surface and the rear surface, wherein the front surface includes a dielectric substance having a first permittivity and the rear surface includes a dielectric substance having a second permittivity, an antenna array that is positioned adjacent to the side surface, radiates a millimeter wave signal, the antenna array including at least one antenna element, a communication circuit that is electrically connected with the antenna array and communicates by using the millimeter wave signal, and an electrical element that is positioned to be spaced from the antenna array by a specified distance such that a radiation pattern of the millimeter wave signal radiated from the antenna array has a directivity toward the side surface.Type: GrantFiled: November 26, 2018Date of Patent: July 27, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Seung Gil Jeon, Jeong Heum Lee, Jae Bong Chun
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Patent number: 11005160Abstract: Various embodiments related to a near-field (short-range) communication antenna device, which is used for an electronic device, are disclosed. According to an embodiment, a near-field (short-range) communication antenna device may comprise: an electronic device cover unit; a circuit board provided inside the cover unit; a near-field (short-range) communication module, which is mounted on the circuit board, and which comprises a transmitting module and a receiving module; and first and second dielectric body units that face the transmitting module and the receiving module. In addition, various other embodiments are possible.Type: GrantFiled: November 3, 2016Date of Patent: May 11, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Seung-Gil Jeon, Hyeong-Tae Kim, Jung-Sik Park
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Patent number: 10950949Abstract: An electronic device is provided. The electronic device includes a housing that includes a first surface, a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces, a printed circuit board (PCB) that is arranged inside the housing and includes at least one antenna unit, and a communication circuit that is arranged inside the PCB or between the PCB and the housing.Type: GrantFiled: September 13, 2018Date of Patent: March 16, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Seung Gil Jeon, Hyung Wook Kim, Jeong Heum Lee, Jong Hwan Lee, Ho Young Im
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Patent number: 10693215Abstract: An electronic device is provided. The electronic device includes a housing, a communication circuit disposed on one side of the housing, a multi-layered printed circuit board (PCB) disposed on one side of the housing and electrically connected to the communication circuit and an antenna radiator disposed on one side of the housing or defining at least a portion of an outer surface of the housing, and is electrically connected to the communication circuit and the multi-layered printed circuit board, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and is electrically isolated from the first conductive pattern and the second conductive pattern.Type: GrantFiled: January 20, 2017Date of Patent: June 23, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Jung Sik Park, Seung Gil Jeon, Jung Su Ha
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Publication number: 20200076055Abstract: An electronic device according to an embodiment of the disclosure may include housing including a rear cover and a cover glass facing away from the rear cover, an antenna array interposed between the rear cover and the cover glass and including at least one or more antenna units, a printed circuit board (PCB) interposed between the antenna array and the cover glass, and a communication circuit disposed on the PCB and feeding the antenna array. Other various embodiments as understood from the specification are also possible.Type: ApplicationFiled: May 17, 2018Publication date: March 5, 2020Inventor: Seung Gil JEON
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Patent number: 10374286Abstract: An electronic device comprising: a housing; a wireless communication transceiver provided within the housing; an antenna radiator provided within the housing; and a cover arranged to cover at least a portion of the antenna radiator and form at least a portion of a surface of the housing, wherein the cover includes a conductive material, and the cover is at least partially detachable from the housing.Type: GrantFiled: November 19, 2015Date of Patent: August 6, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Jung-Sik Park, Yeon-Woo Kim, Woo-Sup Lee, Seung-Gil Jeon, Ju-Seok Noh, Jae-Bong Chun, Hyun-Ju Hong
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Publication number: 20190165452Abstract: An electronic device is provided. The electronic device includes a housing that includes a front surface, a rear surface facing away from the front surface, and a side surface surrounding a space between the front surface and the rear surface, wherein the front surface includes a dielectric substance having a first permittivity and the rear surface includes a dielectric substance having a second permittivity, an antenna array that is positioned adjacent to the side surface, radiates a millimeter wave signal, the antenna array including at least one antenna element, a communication circuit that is electrically connected with the antenna array and communicates by using the millimeter wave signal, and an electrical element that is positioned to be spaced from the antenna array by a specified distance such that a radiation pattern of the millimeter wave signal radiated from the antenna array has a directivity toward the side surface.Type: ApplicationFiled: November 26, 2018Publication date: May 30, 2019Inventors: Seung Gil JEON, Jeong Heum LEE, Jae Bong CHUN
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Publication number: 20190165470Abstract: An electronic device is provided. The electronic device includes a cover glass, a rear cover which faces away from the cover glass, and a plurality of communication devices that are interposed between the cover glass and the rear cover. Each of the plurality of communication devices comprises a printed circuit board (PCB), an antenna array positioned at the PCB, a dielectric substance positioned on one surface of the antenna array, a conductor positioned on an opposite surface of the antenna array, and a communication circuit electrically connected with the antenna array. The communication circuit is configured to feed the antenna array and transmit/receive a signal in a specified frequency band based on an electrical path formed through the antenna array.Type: ApplicationFiled: November 23, 2018Publication date: May 30, 2019Inventor: Seung Gil JEON
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Publication number: 20190081404Abstract: An electronic device is provided. The electronic device includes a housing that includes a first surface, a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces, a printed circuit board (PCB) that is arranged inside the housing and includes at least one antenna unit, and a communication circuit that is arranged inside the PCB or between the PCB and the housing.Type: ApplicationFiled: September 13, 2018Publication date: March 14, 2019Inventors: Seung Gil JEON, Hyung Wook KIM, Jeong Heum LEE, Jong Hwan LEE, Ho Young IM
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Publication number: 20180309188Abstract: Various embodiments related to a near-field (short-range) communication antenna device, which is used for an electronic device, are disclosed. According to an embodiment, a near-field (short-range) communication antenna device may comprise: an electronic device cover unit; a circuit board provided inside the cover unit; a near-field (short-range) communication module, which is mounted on the circuit board, and which comprises a transmitting module and a receiving module; and first and second dielectric body units that face the transmitting module and the receiving module. In addition, various other embodiments are possible.Type: ApplicationFiled: November 3, 2016Publication date: October 25, 2018Inventors: Seung-Gil JEON, Hyeong-Tae KIM, Jung-Sik PARK
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Publication number: 20180294547Abstract: An electronic apparatus, according to various embodiments of the present invention, comprises: a first antenna of a first bandwidth; a second antenna of a second bandwidth which partially overlaps with the first bandwidth; a third antenna of the first bandwidth; a fourth antenna of the second bandwidth; a transmission/reception path corresponding to each of a plurality of bandwidths; a reception path corresponding to each of the plurality of bandwidths; and a path formation unit which forms a path such that any one of the first antenna and the third antenna is connected to the transmission/reception path, the other of the first antenna and the third antenna is connected to the reception path, and any one of the second antenna and the fourth antenna is connected to the transmission/reception path, and the other of the second antenna and the fourth antenna is connected to the reception path.Type: ApplicationFiled: October 5, 2016Publication date: October 11, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: Sung-Chul PARK, Yeon-Woo KIM, Jong-Hyuk KIM, Seung-Gil JEON, Young-Ju KIM, Chae-Man LIM
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Patent number: 9972888Abstract: A wireless communication device having a stable capacity of an antenna even if a terminal is bent or folded is disclosed. The wireless communication device includes an antenna, a first ground portion to which the antenna is grounded, and a second ground portion that is electrically separated from the first ground portion, and the wireless communication device is bent around a boundary between the first ground portion and the second ground portion.Type: GrantFiled: June 25, 2014Date of Patent: May 15, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung-gil Jeon, Sang-uk Park, Sang-hoon Park, Seung-kee Yang
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Patent number: 9923264Abstract: An antenna is provided. The antenna includes a carrier having a via hole penetrating an outer surface and an inner surface thereof, a first antenna radiator formed on the outer surface of the carrier and at least a part of a surface of the carrier that defines the via hole, a second antenna radiator formed on an inner surface of the carrier and electrically contacting the first antenna radiator through the via hole, and a coupling member configured to electrically connect the second antenna radiator with a circuit board provided in the electronic device.Type: GrantFiled: May 4, 2016Date of Patent: March 20, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Yeon Woo Kim, Jung Sik Park, Seung Gil Jeon
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Publication number: 20170214123Abstract: An electronic device is provided. The electronic device includes a housing, a communication circuit disposed on one side of the housing, a multi-layered printed circuit board (PCB) disposed on one side of the housing and electrically connected to the communication circuit and an antenna radiator disposed on one side of the housing or defining at least a portion of an outer surface of the housing, and is electrically connected to the communication circuit and the multi-layered printed circuit board, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and is electrically isolated from the first conductive pattern and the second conductive pattern.Type: ApplicationFiled: January 20, 2017Publication date: July 27, 2017Inventors: Jung Sik Park, Seung Gil Jeon, Jung Su Ha
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Publication number: 20160329628Abstract: An antenna is provided. The antenna includes a carrier having a via hole penetrating an outer surface and an inner surface thereof, a first antenna radiator formed on the outer surface of the carrier and at least a part of a surface of the carrier that defines the via hole, a second antenna radiator formed on an inner surface of the carrier and electrically contacting the first antenna radiator through the via hole, and a coupling member configured to electrically connect the second antenna radiator with a circuit board provided in the electronic device.Type: ApplicationFiled: May 4, 2016Publication date: November 10, 2016Inventors: Yeon Woo KIM, Jung Sik PARK, Seung Gil JEON
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Publication number: 20160149290Abstract: An electronic device comprising: a housing; a wireless communication transceiver provided within the housing; an antenna radiator provided within the housing; and a cover arranged to cover at least a portion of the antenna radiator and form at least a portion of a surface of the housing, wherein the cover includes a conductive material, and the cover is at least partially detachable from the housing.Type: ApplicationFiled: November 19, 2015Publication date: May 26, 2016Inventors: Jung-Sik PARK, Yeon-Woo KIM, Woo-Sup LEE, Seung-Gil JEON, Ju-Seok NOH, Jae-Bong CHUN, Hyun-Ju HONG