Abstract: Disclosed is an organic light emitting display having reduced thickness and weight. The organic light emitting display with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensor including a touch sensing line and a touch driving line and a color filter on the encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.

Abstract: The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

Abstract: Disclosed is an organic light emitting display having reduced thickness and weight. The organic light emitting display with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensor including a touch sensing line and a touch driving line and a color filter on the encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.

Abstract: The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Abstract: Disclosed is an organic light emitting display having reduced thickness and weight. The organic light emitting display with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensor including a touch sensing line and a touch driving line and a color filter on the encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

Abstract: Disclosed is an organic light emitting display having reduced thickness and weight. The organic light emitting display with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensor including a touch sensing line and a touch driving line and a color filter on the encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.

Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

Abstract: Disclosed are an organic light emitting display device and a method of manufacturing the same to reduce thickness and weight. The organic light emitting display device with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensing electrode and a touch driving electrode arranged in parallel and a color filter on an encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.

Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Abstract: Disclosed is a display device having touch sensors which may reduce parasitic capacitance and a method of manufacturing the same. The display device includes a plurality of touch sensing lines respectively arranged so as to traverse a plurality of common electrode blocks forming an electric field with pixel electrodes, a lower planarization layer having openings in regions overlapping drain electrodes of thin film transistors, an upper planarization layer arranged between one of the pixel electrodes and the common electrode blocks, and the touch sensing lines so as to cover a side surface of the lower planarization layer, and an upper protective film arranged between the pixel electrodes and the common electrode blocks, and, thus, parasitic capacitance generated between the touch sensing lines and the common electrode blocks may be reduced without reduction in liquid crystal capacitance and storage capacitance.

Abstract: The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of ?10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Abstract: A display device includes: thin film transistors (TFTs) on a substrate, pixel electrodes (PEs) respectively connected to the TFTs, common electrode blocks (CEBs) on the substrate, each CEB forming an electric field with a respective PE, touch sensing lines (TSLs) respectively connected to the CEBs, a lower planarization layer (PL) between the TFTs and the TSLs, an upper PL between the TSLs and one of: the PEs and the CEBs, an upper protective film between the PEs and the CEBs, and pixel contact holes extending through the lower PL and the upper PL to expose respective drain electrodes of the TFTs, wherein a side surface of each of the lower PL and the upper PL, exposed through the pixel contact holes, contacts one of: the upper protective film and the PEs.

Abstract: There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: The present disclosure relates to a polarizing plate including an adhesive layer, a primer layer and a polyethylene terephthalate film which are sequentially formed on at least one side of a polarizer, wherein the adhesive layer in the present disclosure is formed by an active energy ray-curable adhesive including a first epoxy compound of which a homopolymer has a glass transition temperature of 120° C. or higher, a second epoxy compound of which a homopolymer has a glass transition temperature of 60° C. or lower, and a cationic photopolymerization initiator, and wherein the primer layer is formed by a primer composition including one or more binder resins selected from the group consisting of polyester and polyvinyl alcohol-based resins, and one or more cross-linking agents selected from the group consisting of acrylic cross-linking agents, epoxy-based cross-linking agents and polyvinyl alcohol-based cross-linking agents.

Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of: applying a voltage to the polymer film at a temperature of 5° C. to 250° C., while one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of applying a voltage to the polymer film, while at least one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Abstract: Disclosed is a display device having touch sensors which may reduce parasitic capacitance and a method of manufacturing the same. The display device includes a plurality of touch sensing lines respectively arranged so as to traverse a plurality of common electrode blocks forming an electric field with pixel electrodes, a lower planarization layer having openings in regions overlapping drain electrodes of thin film transistors, an upper planarization layer arranged between one of the pixel electrodes and the common electrode blocks, and the touch sensing lines so as to cover a side surface of the lower planarization layer, and an upper protective film arranged between the pixel electrodes and the common electrode blocks, and, thus, parasitic capacitance generated between the touch sensing lines and the common electrode blocks may be reduced without reduction in liquid crystal capacitance and storage capacitance.