Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

Abstract: The present application relates to an optical device and a use thereof. The optical device of the present application is a member in which transmittance can vary depending on whether or not an external action is present, and has excellent durability.

Abstract: There is provided a display apparatus with an improved viewing angle. The display apparatus includes a display panel configured to receive light from a light source module, wherein the display panel includes: a liquid crystal panel; a first polarizing plate positioned on a rear side of the liquid crystal panel and a second polarizing plate positioned on a front side of the liquid crystal panel; and an optical layer positioned on a front surface of the second polarizing plate, wherein the optical layer includes: a resin layer having a first refractive index, and including an accommodating groove in which a light adjusting portion is disposed, the resin layer further including a light refractive pattern protruding toward a rear direction of the display panel; and an adhesive layer having a second refractive index different from the first refractive index, and bonding the resin layer with the second polarizing plate.

Abstract: A display apparatus includes a bottom chassis, a display panel provided in front of the bottom chassis, and a cover film configured to cover the display panel and being fixable to the bottom chassis. With this configuration, a bezel may be minimized (e.g., reduced in size) or eliminated, and the display efficiency may be improved.

Abstract: The present application relates to an optical device and a use thereof. The optical device of the present application is a member in which transmittance can vary depending on whether or not an external action is present, and has excellent durability.

Abstract: A semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, an encapsulant encapsulating at least a portion of the semiconductor chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer and a via electrically connected to the connection pads of the semiconductor chip, wherein at least a portion of the redistribution layer and the via is formed of a metal layer having a concave portion depressed from a lower surface thereof and filled with an insulating material.

Abstract: An optical device and a use thereof are provided. The optical device is a member in which transmittance can vary depending on whether or not an external action is present, and has excellent durability.

Abstract: A semiconductor package includes a semiconductor chip having a connection pad; an encapsulant covering at least a portion of the semiconductor chip; and an interconnect structure disposed on the semiconductor chip and the encapsulant. The interconnect structure includes a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, the first redistribution layer is electrically connected to the connection pad, and when a thickness of the first redistribution layer is a, and a gap between patterns of the first redistribution layer is b, b/a is 4 or less.

Abstract: There is provided a display apparatus with an improved viewing angle. The display apparatus includes a display panel configured to receive light from a light source module, wherein the display panel includes: a liquid crystal panel; a first polarizing plate positioned on a rear side of the liquid crystal panel and a second polarizing plate positioned on a front side of the liquid crystal panel; and an optical layer positioned on a front surface of the second polarizing plate, wherein the optical layer includes: a resin layer having a first refractive index, and including an accommodating groove in which a light adjusting portion is disposed, the resin layer further including a light refractive pattern protruding toward a rear direction of the display panel; and an adhesive layer having a second refractive index different from the first refractive index, and bonding the resin layer with the second polarizing plate.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

Abstract: A semiconductor package includes a semiconductor, a passive component disposed in parallel with the semiconductor chip and having a connection electrode, and a connection structure on a lower surface of the passive component. The connection structure includes a first metal layer electrically connected to the connection electrode, a second metal layer on the same level as the first metal layer and disposed adjacent to the first metal layer, and a wiring insulating layer having an insulating region filling the first and second metal layers and extending in one direction. A minimum width of the insulating region is referred to as a first width, and a shortest distance between one end of the passive component and one end of the insulating region on the same level is referred to as a spacing distance, and the spacing distance may be twice or more than the first width.

Abstract: Provided is a display apparatus including a liquid crystal panel and a shutter panel, wherein the shutter panel includes a shutter layer configured to change a polarizing axis of light transmitted through a selected area, a shutter polarizing layer disposed on a front surface of the shutter layer, and configured to transmit light having the polarizing axis changed by the shutter layer, and a quantum rod layer disposed on a rear surface of the shutter layer, and configured to convert a wavelength of light that is incident to the shutter panel, and to transmit light having a polarizing axis of a predetermined direction to the shutter layer. Therefore, the display apparatus may implement a local dimming structure and improve the optical efficiency.

Abstract: A display apparatus having enhanced color reproduction, and a display apparatus including a light absorption sheet that absorbs light having a wavelength corresponding to yellow light and/or orange light in the light are provided. The display apparatus includes: a backlight unit; a liquid crystal panel configured to selectively block light emitted from the backlight according to an electric field; and a light absorption sheet disposed on a front side of the liquid crystal panel for absorbing light having a predetermined range of wavelength.

Abstract: A display apparatus includes: a display panel; a light source package configured to supply light; and a light guide plate configured to receive the light supplied by the light source package and guide the light to the display panel. The light source package includes: a light source configured to generate the light; a first reflector disposed around the light source; a light converter disposed between the light source and the light guide plate, the light converter being configured to convert properties of the light directed toward the light guide plate; and a second reflector protruding from the light converter toward the light source, the second reflector being configured to reflect the light generated by the light source toward the first reflector, and to reflect light reflected by the light converter toward the light guide plate.

Abstract: A display device including a backlight unit; and an image forming unit configured to transmit or block light emitted from the backlight unit to create an image, wherein the backlight unit includes a light source, a reflector sheet configured to absorb light having a predetermined wavelength range among light emitted from the light source, and to reflect non-absorbed light, and an optical sheet configured to absorb light having the predetermined wavelength range among the light emitted from the light source, and to transmit non-absorbed light.

Abstract: A semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, an encapsulant encapsulating at least a portion of the semiconductor chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer and a via electrically connected to the connection pads of the semiconductor chip, wherein at least a portion of the redistribution layer and the via is formed of a metal layer having a concave portion depressed from a lower surface thereof and filled with an insulating material.

Abstract: Disclosed herein are a quantum dot unit having an improved structure for improving color reproducibility, a quantum dot sheet having the same, and a display device having the quantum dot unit or the quantum dot sheet. The display device includes a display panel configured to display an image, a light source provided to emit light to the display panel, a light guide plate provided to guide the light emitted from the light source to the display panel, and a quantum dot unit disposed between the light source and the light guide plate to change a wavelength of the light emitted from the light source and having ductility, wherein the quantum dot unit includes a glass fiber having a hollow portion and a quantum dot accommodated in the hollow portion.

Abstract: A display apparatus may include a back light unit including a light source and a selective light absorption sheet configured to absorb light of a predetermined wavelength range among light emitted from the light source and an image forming unit configured to transmit or block light emitted from the back light unit to form an image. The selective light absorption sheet may include a selective light absorption film configured to absorb light of a predetermined wavelength range among light emitted from the light source, at least one light blocking film configured to absorb at least one of UV light and IR light, and at least one barrier film configured to block at least one of oxygen and moisture.