Patents by Inventor Seung-joo Shin

Seung-joo Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240104464
    Abstract: A system selecting a process key factor in a commercial chemical process, includes: a data extraction unit that extracts tag data in units of a set period; an outlier discrimination unit that discriminates and aggregates outliers by tag by using an outlier extraction reference master; an outlier processing unit that generates an input mart draft excluding the outliers; a derived variable generation unit that generates derived variables for each tag, and generates an advanced input mart having the derived variable added thereto; a yield calculation unit that backs up the result of calculation of a yield by realizing a target value via exclusion and correction of the outliers; and a key factor extraction unit that extracts a yield key factor by calculating importance of each tag, and backs up importance data for each tag.
    Type: Application
    Filed: April 27, 2022
    Publication date: March 28, 2024
    Applicant: SK GAS CO., LTD.
    Inventors: Ung Gi HONG, Sung Joo YEO, Seung Hwan KONG, Min Ho KIM, Hae Bin SHIN, Hee Dong CHOI, Young Gook KYE
  • Publication number: 20240095548
    Abstract: A system for predicting process changes by using key factors in a commercial chemical process, includes: a key factor extraction and individual tag importance backup unit that extracts yield key factors by calculating the importance of each tag, and backs up importance data for each tag; and a yield prediction model training and yield prediction performing unit that performs yield prediction model training by using the importance of each tag accumulated in the key factor extraction and individual tag importance backup unit, and performs yield prediction so as to output a yield prediction result, evaluates performance, and selects an optimal prediction model.
    Type: Application
    Filed: April 27, 2022
    Publication date: March 21, 2024
    Applicant: SK GAS CO., LTD.
    Inventors: Ung Gi HONG, Sung Joo YEO, Seung Hwan KONG, Min Ho KIM, Hae Bin SHIN, Hee Dong CHOI, Young Gook KYE
  • Publication number: 20240082345
    Abstract: Provided is a peptide composition for preventing or treating Alzheimer's dementia. A peptide or a salt substituent thereof according to the presently claimed subject matter exhibits effects such as suppression of LPS-mediated cytokine production, suppression of LPS-induced neuroinflammation, amelioration of cognitive impairment, suppression of beta amyloid or tau protein aggregation, and suppression of neuronal loss. The polypeptide or the salt substituent thereof can permeate the blood-brain barrier, and thus, is expected to be usefully used for preventing or treating Alzheimer's dementia.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 14, 2024
    Applicant: HLB SCIENCE INC.
    Inventors: Yeong Min PARK, Wahn Soo CHOI, Seung-Hyun LEE, In Duk JUNG, Yong Joo KIM, Seung Jun LEE, Sung Min KIM, Mi Suk LEE, Hee Jo PARK, Seung Pyo CHOI, Minho MOON, Soo Jung SHIN, Sujin KIM, Yong Ho PARK, Jae-Yong PARK, Kun Ho LEE
  • Patent number: 11928903
    Abstract: There is provided a method for providing driver's driving information of a user terminal device, including accessing a driving information providing server storing data generated in a driving recording device for a vehicle, receiving driving record data including event record data corresponding to a driving-related event of a driver from the driving information providing server, and displaying a driving-related event occurrence location on a map using the received driving record data. The driving-related event may include at least two or more of a lane departure event, a forward collision possibility event, a rear side collision possibility event, a sudden deceleration event, a sudden acceleration event, a sudden stop event, a sudden start event, and a speeding event.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: March 12, 2024
    Assignee: THINKWARE CORPORATION
    Inventors: Min Suk Kang, Won Jun Heo, Seung Yo Jang, Youn Joo Shin, Tae Kyu Han
  • Patent number: 10749098
    Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: August 18, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Pil Joong Kang, Kwang Su Kim, Jeong Il Lee, Jong Hyeong Song, Hyun Kee Lee, Yun Sung Kang, Seung Joo Shin, Jeong Suong Yang
  • Patent number: 10637436
    Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode disposed on the substrate, and a piezoelectric layer disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: April 28, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Sung Han, Hwa Sun Lee, Seung Joo Shin, Ran Hee Shin
  • Patent number: 10630258
    Abstract: An acoustic wave resonator includes: a first piezoelectric portion of a piezoelectric layer, disposed on a cavity and having a first average thickness; and a second piezoelectric portion of the piezoelectric layer, disposed adjacent to an edge of the first piezoelectric portion and having a second average thickness that is different from the first average thickness.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: April 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Han, Tae Kyung Lee, Sung Sun Kim, Won Han, Hwa Sun Lee, Seung Joo Shin
  • Publication number: 20180278232
    Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode disposed on the substrate, and a piezoelectric layer disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum.
    Type: Application
    Filed: May 30, 2018
    Publication date: September 27, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Sung HAN, Hwa Sun LEE, Seung Joo SHIN, Ran Hee SHIN
  • Patent number: 10068820
    Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: September 4, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Pil Joong Kang, Kwang Su Kim, Ji Hye Nam, Jeong Il Lee, Jong Hyeong Song, Yun Sung Kang, Seung Joo Shin, Nam Jung Lee
  • Patent number: 10009007
    Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode disposed on the substrate, and a piezoelectric layer disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: June 26, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Sung Han, Hwa Sun Lee, Seung Joo Shin, Ran Hee Shin
  • Publication number: 20180083597
    Abstract: An acoustic wave resonator includes: a first piezoelectric portion of a piezoelectric layer, disposed on a cavity and having a first average thickness; and a second piezoelectric portion of the piezoelectric layer, disposed adjacent to an edge of the first piezoelectric portion and having a second average thickness that is different from the first average thickness.
    Type: Application
    Filed: March 15, 2017
    Publication date: March 22, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung HAN, Tae Kyung LEE, Sung Sun KIM, Won HAN, Hwa Sun LEE, Seung Joo SHIN
  • Publication number: 20180068915
    Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
    Type: Application
    Filed: November 9, 2017
    Publication date: March 8, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Pil Joong KANG, Kwang Su KIM, Ji Hye NAM, Jeong Il LEE, Jong Hyeong SONG, Yun Sung KANG, Seung Joo SHIN, Nam Jung LEE
  • Patent number: 9842787
    Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: December 12, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Pil Joong Kang, Kwang Su Kim, Ji Hye Nam, Jeong Il Lee, Jong Hyeong Song, Yun Sung Kang, Seung Joo Shin, Nam Jung Lee
  • Publication number: 20170288641
    Abstract: A bulk acoustic wave (BAW) filter includes: a substrate including a first mounting region and a second mounting region which are spaced apart from each other; a first fixing member disposed adjacent to the first mounting region; a second fixing member disposed adjacent to the second mounting region; a Tx filter mounted on the first mounting region and fixed by the first fixing member; and an Rx filter mounted on the second mounting region and fixed by the second fixing member.
    Type: Application
    Filed: January 31, 2017
    Publication date: October 5, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Tae KIM, Hyun Min HWANG, Jong Beom KIM, Seung Joo SHIN
  • Publication number: 20170271222
    Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
    Type: Application
    Filed: September 26, 2016
    Publication date: September 21, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Pil Joong KANG, Kwang Su KIM, Ji Hye NAM, Jeong Il LEE, Jong Hyeong SONG, Yun Sung KANG, Seung Joo SHIN, Nam Jung LEE
  • Publication number: 20170271573
    Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.
    Type: Application
    Filed: September 22, 2016
    Publication date: September 21, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Pil Joong KANG, Kwang Su KIM, Jeong Il LEE, Jong Hyeong SONG, Hyun Kee LEE, Yun Sung KANG, Seung Joo SHIN, Jeong Suong YANG
  • Patent number: 9631927
    Abstract: Disclosed herein is an angular velocity sensor. The angular velocity sensor according to an embodiment of the present invention is configured to include a mass body, a first frame disposed at an outer side of the mass body so as to be spaced apart from the mass body, a first flexible part connecting the mass body to the first frame in an X-axis direction, a second flexible part connecting the mass body with the first frame in a Y-axis direction, a second frame disposed at an outer side of the first frame so as to be spaced apart from the first frame, a third flexible part connecting the first frame with the second frame in an X-axis direction, and a fourth flexible part connecting the first frame with the second frame in a Y-axis direction.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: April 25, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woon Kim, Jung Won Lee, Seung Joo Shin, Won Kyu Jeung
  • Patent number: 9625484
    Abstract: An angular velocity sensor comprises a mass body part including a first mass body and a second mass body, an internal frame supporting the first mass body and the second mass body, one or more first flexible parts connecting the first mass body or the second mass body to the internal frame, one or more second flexible parts connecting the first mass body or the second mass body to the internal frame, an external frame supporting the internal frame, at least one third flexible part connecting the internal frame to the external frame, and at least one fourth flexible part connecting the internal frame to the external frame. At least one of the second flexible parts is connected to the first mass body in line with the center of gravity of the first mass body. At least one other of the second flexible parts is connected to an eccentric portion of the second mass body.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: April 18, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woon Kim, Jung Won Lee, Seung Joo Shin, Won Kyu Jeung
  • Publication number: 20160373083
    Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode disposed on the substrate, and a piezoelectric layer disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 22, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Sung HAN, Hwa Sun LEE, Seung Joo SHIN, Ran Hee SHIN
  • Patent number: 9523705
    Abstract: Disclosed herein is an acceleration sensor, including: a mass body part including a first mass body and a second mass body; a frame supporting the first mass body and the second mass body; first flexible parts each connecting the first mass body and the second mass body to the frame; and second flexible parts each connecting the first mass body and the second mass body to the frame, wherein the first mass body and the second mass body are each connected to the frame so as to be eccentric by the second flexible part.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: December 20, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woon Kim, Jung Won Lee, Seung Joo Shin, Won Kyu Jeung