Patents by Inventor Seung Keun OH

Seung Keun OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933944
    Abstract: A microlens is provided with opposite sides thereof each having an aspheric-surface shape. The microlens is configured such that a lens layer having an aspheric-surface shape is provided on each opposite side of the microlens, an optical communication module may be miniaturized and integrated as a working distance (WD) is minimized to 0.160±0.05 mm, and collimating performance is excellent as a value obtained by calculating a paraxial radius (R1) of a first lens layer over a paraxial radius (R2) of a second lens layer is 1.8 to 3.5.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: March 19, 2024
    Assignee: MPNICS CO., LTD.
    Inventors: Sang Do Kang, Seung Keun Oh
  • Publication number: 20240088432
    Abstract: An embodiment sulfur dioxide-based inorganic electrolyte is provided in which the sulfur dioxide-based inorganic electrolyte is represented by a chemical formula M·(A1·Cl(4-x)Fx)z·ySO2. In this formula, M is a first element selected from the group consisting of Li, Na, K, Ca, and Mg, A1 is a second element selected from the group consisting of Al, Fe, Ga, and Cu, x satisfies a first equation 0?x?4, y satisfies a second equation 0?y?6, and z satisfies a third equation 1?z?2.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 14, 2024
    Inventors: Kyu Ju Kwak, Won Keun Kim, Eun Ji Kwon, Samuel Seo, Yeon Jong Oh, Kyoung Han Ryu, Dong Hyun Lee, Han Su Kim, Ji Whan Lee, Seong Hoon Choi, Seung Do Mun
  • Patent number: 11614590
    Abstract: A microlens array according to an embodiment of the present disclosure includes lens layers with a first side thereof having aspheric-surface shapes. The microlens array is configured such that an optical communication module may be miniaturized and integrated as a working distance (WD) is minimized to 1.30±0.05 mm, and collimating performance is excellent as a curvature radius (R1) of each lens layer is 1.1 to 1.5.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: March 28, 2023
    Assignee: MPNICS CO., LTD.
    Inventors: Sang Do Kang, Seung Keun Oh
  • Patent number: 11400669
    Abstract: A method of manufacturing an optical multiplexer, whereby one molded product is formed by using a mold and vertically cut in a row direction, thus efficiently manufacturing multiple optical multiplexers, with a microlens array and an optical block being integrated together. Therefore, the present invention may increase product productivity and realize a size reduction of a product.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: August 2, 2022
    Assignee: MPNICS CO., LTD.
    Inventors: Sang Do Kang, Seung Keun Oh, Hyun Jong Kang, Chang Hoon Ryu
  • Publication number: 20220197021
    Abstract: In a method of manufacturing an achromatic lens according to an embodiment of the present disclosure, the achromatic lens in which a first lens and a second lens are integrally molded is manufactured by using mold processing, so that chromatic aberration correction ability may be improved without using an adhesive or a separate instrument to fix the first lens and the second lens to each other.
    Type: Application
    Filed: July 15, 2021
    Publication date: June 23, 2022
    Inventors: Sang Do KANG, Seung Keun OH, Hun KIM
  • Publication number: 20220179170
    Abstract: A microlens is provided with opposite sides thereof each having an aspheric-surface shape. The microlens is configured such that a lens layer having an aspheric-surface shape is provided on each opposite side of the microlens, an optical communication module may be miniaturized and integrated as a working distance (WD) is minimized to 0.160±0.05 mm, and collimating performance is excellent as a value obtained by calculating a paraxial radius (R1) of a first lens layer over a paraxial radius (R2) of a second lens layer is 1.8 to 3.5.
    Type: Application
    Filed: June 14, 2021
    Publication date: June 9, 2022
    Inventors: Sang Do KANG, Seung Keun OH
  • Publication number: 20220179158
    Abstract: A microlens array according to an embodiment of the present disclosure includes lens layers with a first side thereof having aspheric-surface shapes. The microlens array is configured such that an optical communication module may be miniaturized and integrated as a working distance (WD) is minimized to 1.30±0.05 mm, and collimating performance is excellent as a curvature radius (R1) of each lens layer is 1.1 to 1.5.
    Type: Application
    Filed: June 29, 2021
    Publication date: June 9, 2022
    Inventors: Sang Do KANG, Seung Keun OH
  • Patent number: 11309345
    Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: April 19, 2022
    Assignees: SAMSUNG ELECTRONICS CO., LTD., DONGJIN SEMICHEM CO., LTD.
    Inventors: Myoung-chul Eum, Hye-kyoung Lee, Chang-kun Kang, Jae-hyun Kim, Kyeong-il Oh, Seung-keun Oh, Chi-hwan Lee
  • Publication number: 20220066102
    Abstract: An optical multiplexer (MUX) according to an embodiment of the present disclosure includes a base part having a plate-shape having a first surface and a second surface opposite to the first surface, a microarray lens layer integrally formed on the first surface of the base part, the microarray lens layer including microlens layers being multiple aspherical surface-shaped, and multiple optical blocks integrally formed on the second surface of the base part and formed at respective positions corresponding to the microlens layers.
    Type: Application
    Filed: November 9, 2021
    Publication date: March 3, 2022
    Inventors: Sang Do KANG, Seung Keun OH, Hyun Jong KANG, Chang Hoon RYU
  • Publication number: 20210333476
    Abstract: A method of manufacturing an optical multiplexer, whereby one molded product is formed by using a mold and vertically cut in a row direction, thus efficiently manufacturing multiple optical multiplexers, with a microlens array and an optical block being integrated together. Therefore, the present invention may increase product productivity and realize a size reduction of a product.
    Type: Application
    Filed: July 19, 2019
    Publication date: October 28, 2021
    Inventors: Sang Do KANG, Seung Keun OH, Hyun Jong KANG, Chang Hoon RYU
  • Publication number: 20210057480
    Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and cis amole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 25, 2021
    Applicant: DONGJIN SEMICHEM CO., LTD.
    Inventors: Myoung-chul Eum, Hye-kyoung Lee, Chang-kun Kang, Jae-hyun Kim, Kyeong-il Oh, Seung-keun Oh, Chi-hwan Lee
  • Patent number: 10854666
    Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: December 1, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., DONGJIN SEMICHEM CO., LTD.
    Inventors: Myoung-chul Eum, Hye-kyoung Lee, Chang-kun Kang, Jae-hyun Kim, Kyeong-il Oh, Seung-keun Oh, Chi-hwan Lee
  • Publication number: 20190245003
    Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.
    Type: Application
    Filed: December 21, 2018
    Publication date: August 8, 2019
    Applicant: DONGJIN SEMICHEM CO., LTD.
    Inventors: Myoung-chul Eum, Hye-kyoung Lee, Chang-kun Kang, Jae-hyun Kim, Kyeong-il Oh, Seung-keun Oh, Chi-hwan Lee
  • Publication number: 20190079278
    Abstract: Disclosed are a lens module for an endoscope and an endoscope using the same. The lens module includes: a case that is shaped as a tube and has a holding space formed therein, and a plurality of lenses arranged inside the case; wherein the plurality of lenses include a first lens and a second lens that are positioned adjacently and are separated by a particular distance in-between; and the first lens comprises a first forward-direction protrusion protruding towards the second lens from an edge region of a radial direction, with the first forward-direction protrusion formed as an integrated body with the first lens to control the distance between the first lens and the second lens. Thus, the lens module can be fabricated by sequentially inserting the lenses without having to insert a separate spacer or form a step or curb in the inner wall of the case.
    Type: Application
    Filed: November 28, 2017
    Publication date: March 14, 2019
    Applicant: MPNICS CO., LTD.
    Inventors: Seung Keun OH, Sang Do KANG
  • Publication number: 20170212281
    Abstract: A method of manufacturing a microarray lens having a plurality of microlenses includes preparing a substrate having a plurality of depressions on a side, and forming a lens layer corresponding to shapes of the depressions by depositing a lens raw material on the side of the substrate on which the depressions are formed. The method is able to form a plurality of depression in precise aspheric shapes on a substrate and to easily adjust or change the number and the gaps of lenses by forming depressions on a substrate using a probe and depositing a lens layer on the substrate with the depressions.
    Type: Application
    Filed: October 15, 2014
    Publication date: July 27, 2017
    Applicant: MPNICS CO., LTD.
    Inventors: Sang Do KANG, Hyung Jun KWON, Seung Jun BAEK, Seung Keun OH
  • Patent number: D908759
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: January 26, 2021
    Assignee: MPNICS CO., LTD.
    Inventors: Sang Do Kang, Seung Keun Oh, Hun Kim, Hyun Jong Kang
  • Patent number: D918981
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: May 11, 2021
    Assignee: MPNICS CO., LTD.
    Inventors: Sang Do Kang, Seung Keun Oh, Hun Kim, Hyun Jong Kang
  • Patent number: D994744
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: August 8, 2023
    Assignee: MPNICS CO., LTD.
    Inventors: Sang Do Kang, Seung Keun Oh, Hyun Jong Kang