Patents by Inventor Seung Mo Park

Seung Mo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963403
    Abstract: A display device includes a first substrate. A transistor is disposed on the first substrate. A light-emitting element is connected to the transistor. An insulating layer is disposed between the transistor and the light-emitting element. A second substrate at least partially overlaps the first substrate. A color conversion layer is disposed on the second substrate. The insulating layer includes a first insulating layer and a second insulating layer. A distance between the first insulating layer and the first substrate is less than a distance between the second insulating layer and the first substrate. The first insulating layer includes a light blocking material.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung Hyun Park, Joo Sun Yoon, Woo Sik Jun, Yun-Mo Chung
  • Publication number: 20240118337
    Abstract: Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 11, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240118335
    Abstract: Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (?m).
    Type: Application
    Filed: October 11, 2023
    Publication date: April 11, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Young Heum EOM
  • Publication number: 20240112968
    Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.
    Type: Application
    Filed: March 23, 2022
    Publication date: April 4, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Patent number: 11942264
    Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: No Il Park, Byung Soo Kang, Seung Mo Lim, Byeong Cheol Moon, Boum Seock Kim, Yong Hui Li, Seung Min Lee
  • Publication number: 20240094248
    Abstract: An electrically conductive contact pin which prevents a fatigue fracture in a void part by distributing stress concentration in the void part is provided. The electrically conductive contact pin includes: a first surface; a second surface facing the first surface; a lateral surface for connecting the first surface and the second surface; and a void part formed inside the electrically conductive contact pin by passing through the first surface and the second surface along the length direction of the electrically conductive contact pin. The void part includes: a center void part; and an end void part communicating with the center void part and extending toward an end side of the electrically conductive contact pin, wherein the width of the end void part is narrower than the width of the center void part.
    Type: Application
    Filed: January 27, 2022
    Publication date: March 21, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Chang Hee HONG
  • Patent number: 11915853
    Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Byung Soo Kang, Ju Hwan Yang, Tai Yon Cho, No Il Park, Tae Jun Choi
  • Publication number: 20230327335
    Abstract: The disclosure relates to an active phased array antenna capable of realizing dual-band and dual polarization. The active phased array antenna is divided into a transmission and reception domain, which has a rectangular shape and in which transmission antenna elements and reception antenna elements are enabled, and a reception domain, which has a rectangular shape and is disposed outside the transmission and reception domain and in which the transmission antenna elements are disabled and the transmission antenna elements are enabled so that one substrate is allowed to simultaneously perform transmission and reception functions, thereby reducing the size of the antenna, and furthermore, improving polarization characteristics and tilt characteristics in a broad band.
    Type: Application
    Filed: September 22, 2022
    Publication date: October 12, 2023
    Applicant: MUTRONICS CO.,LTD
    Inventors: Seung-Mo PARK, SOON WOO CHOI
  • Publication number: 20230307850
    Abstract: The disclosure relates to an active phased array antenna capable of realizing dual-band dual polarization. The active phased array antenna is divided into a transmission and reception domain, which has a rectangular shape and in which transmission antenna elements and reception antenna elements are enabled, and a reception domain, which has a rectangular shape and is disposed outside the transmission and reception domain and in which the transmission antenna elements are disabled and the transmission antenna elements are enabled so that one substrate is allowed to simultaneously perform transmission and reception functions, thereby reducing the size of the antenna, and simultaneously, improving xpolarization characteristics and tilt characteristics in a broad band.
    Type: Application
    Filed: September 20, 2022
    Publication date: September 28, 2023
    Applicant: MUTRONICS CO.,LTD
    Inventors: Seung-Mo PARK, SOON WOO CHOI
  • Publication number: 20230155303
    Abstract: The disclosure relates to an antenna radiation device in which dual band and dual polarization are realized, and according to the disclosure, a high-frequency band antenna radiation device and a low-frequency band antenna radiation device are integrated, and power feeding slot substrates in which a high-frequency power feeding slot, a low-frequency power feeding slot, and a low-frequency radiation slot are formed are stacked, so that a high-frequency signal and a low-frequency signal may be transmitted and received through a single antenna radiation device and dual polarization may be implemented, using electromagnetic wave induction and coupling effects.
    Type: Application
    Filed: September 22, 2022
    Publication date: May 18, 2023
    Applicant: MUTRONICS CO.,LTD
    Inventors: Seung-Mo PARK, SOON WOO CHOI
  • Patent number: 10310070
    Abstract: A radio altimeter includes a voltage controlled oscillator outputting a radio frequency signal through a forward path in a direction from the voltage controlled oscillator to a radio frequency antenna, a path extending unit positioned in the forward path to receive the radio frequency signal to delay the radio frequency signal to generate a delayed radio frequency signal. The radio frequency antenna transmits the delayed radio frequency signal to ground and receives the delayed radio frequency signal reflected from the ground. The radio altimeter also includes a mixer that receives the reflected delayed radio frequency signal through a signal reception path from the radio frequency antenna and the radio frequency signal from the voltage controlled oscillator and mixes the radio frequency signal and the reflected delayed radio frequency signal to output a beat frequency signal which is used to calculate altitude with respect to the ground.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: June 4, 2019
    Assignee: MUTRONICS CO., LTD.
    Inventors: Tae-Wook Lim, Jae-Hong Lim, Seung-Mo Park, Kwang-Won Lee
  • Patent number: 10197509
    Abstract: An apparatus for processing a signal by means of electromagnetic waves according to one embodiment of the present invention can, when a radio frequency (RF) signal is radiated onto a medium through any one of a plurality of channels, simultaneously receive the radiated RF signals which have been reflected or scattered by the medium or have penetrated the medium through the plurality of channels other than the channel through which the RF signal has been radiated.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: February 5, 2019
    Assignee: MUTRONICS CO., LTD.
    Inventors: Seung-Mo Park, Tae-Wook Lim, Jae-Hong Lim, Kwang-Won Lee, Sang-Jin Kim
  • Publication number: 20180299542
    Abstract: A radio altimeter includes a voltage controlled oscillator outputting a radio frequency signal through a forward path in a direction from the voltage controlled oscillator to a radio frequency antenna, a path extending unit positioned in the forward path to receive the radio frequency signal to delay the radio frequency signal to generate a delayed radio frequency signal. The radio frequency antenna transmits the delayed radio frequency signal to ground and receives the delayed radio frequency signal reflected from the ground. The radio altimeter also includes a mixer that receives the reflected delayed radio frequency signal through a signal reception path from the radio frequency antenna and the radio frequency signal from the voltage controlled oscillator and mixes the radio frequency signal and the reflected delayed radio frequency signal to output a beat frequency signal which is used to calculate altitude with respect to the ground.
    Type: Application
    Filed: June 26, 2018
    Publication date: October 18, 2018
    Applicant: MUTRONICS CO., LTD.
    Inventors: Tae-Wook LIM, Jae-Hong LIM, Seung-Mo PARK, Kwang-Won LEE
  • Patent number: 10036807
    Abstract: The present disclosure relates to a radio altimeter including a path extending unit positioned in a signal transmission path or a signal reception path of the radio altimeter, wherein the path extending unit delays a signal received from the outside to reduce a dynamic range of the radio altimeter.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: July 31, 2018
    Assignee: MUTRONICS CO., LTD.
    Inventors: Tae-Wook Lim, Jae-Hong Lim, Seung-Mo Park, Kwang-Won Lee
  • Publication number: 20170284946
    Abstract: An apparatus for processing a signal by means of electromagnetic waves according to one embodiment of the present invention can, when a radio frequency (RF) signal is radiated onto a medium through any one of a plurality of channels, simultaneously receive the radiated RF signals which have been reflected or scattered by the medium or have penetrated the medium through the plurality of channels other than the channel through which the RF signal has been radiated.
    Type: Application
    Filed: October 5, 2015
    Publication date: October 5, 2017
    Applicant: MUTRONICS CO., LTD
    Inventors: Seung-Mo PARK, Tae-Wook LIM, Jae-Hong LIM, Kwang-Won LEE, Sang-Jin KIM
  • Publication number: 20150145715
    Abstract: The present disclosure relates to a radio altimeter including a path extending unit positioned in a signal transmission path or a signal reception path of the radio altimeter, wherein the path extending unit delays a signal received from the outside to reduce a dynamic range of the radio altimeter.
    Type: Application
    Filed: June 12, 2013
    Publication date: May 28, 2015
    Inventors: Tae-Wook Lim, Jae-Hong Lim, Seung-Mo Park, Kwang-Won Lee
  • Patent number: 8022888
    Abstract: An antenna device includes a first radiator receiving a first feed signal, a second radiator spaced apart from the first radiator at a predetermined distance and capacitively coupled with the first radiator, a feed line connected to a feed terminal of the first radiator, and a phase shifter diverging from the feed line, connected to a feed terminal of the second radiator, and supplying a second feed signal having a predetermined phase difference with the first feed signal to the second radiator.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: September 20, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyung Kim, Tae Wook Lim, Seung Mo Park, Tae Sung Kim, Jae Suk Sung
  • Publication number: 20090224996
    Abstract: An antenna device includes a first radiator receiving a first feed signal, a second radiator spaced apart from the first radiator at a predetermined distance and capacitively coupled with the first radiator, a feed line connected to a feed terminal of the first radiator, and a phase shifter diverging from the feed line, connected to a feed terminal of the second radiator, and supplying a second feed signal having a predetermined phase difference with the first feed signal to the second radiator.
    Type: Application
    Filed: December 10, 2008
    Publication date: September 10, 2009
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyung Kim, Tae Wook Lim, Seung Mo Park, Tae Sung Kim, Jae Suk Sung
  • Patent number: 7102283
    Abstract: A full-color light emitting device includes four leads and three light emitting diode chips which have different light emission wavelengths and can be individually controlled to realize emission of light beams of more diverse colors. The device has a simplified connection structure, so that it can be implemented even when a limited bonding area is provided.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: September 5, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Chil Choi, Seung Mo Park, Kyung Taeg Han
  • Publication number: 20050199884
    Abstract: A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.
    Type: Application
    Filed: July 14, 2004
    Publication date: September 15, 2005
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon Goo Lee, Seung Mo Park, Chan Wang Park, Jung Kyu Park