Patents by Inventor Seung-mun JUNG

Seung-mun JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-entropy alloy for ultra-low temperature
    Patent number: 11168386
    Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at %; Cr: 3-18 at %; Fe: 3-50 at %; Mn: 3-20 at %; Ni: 17-45 at %; V: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at % or less.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: November 9, 2021
    Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY
    Inventors: Byeong-joo Lee, Sung-hak Lee, Hyoung-seop Kim, Young-sang Na, Sun-ig Hong, Won-mi Choi, Chang-woo Jeon, Seung-mun Jung
  • Cr—Fe—Mn—Ni—V-based high-entropy alloy
    Patent number: 10988834
    Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Cr: 3-18 at %; Fe: 3-60 at %; Mn: 3-40 at% ; Ni: 20-80 at %: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: April 27, 2021
    Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY
    Inventors: Byeong-joo Lee, Sung-hak Lee, Hyoung-seop Kim, Young-sang Na, Sun-ig Hong, Won-mi Choi, Chang-woo Jeon, Seung-mun Jung
  • HIGH-ENTROPY ALLOY FOR ULTRA-LOW TEMPERATURE
    Publication number: 20190071755
    Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at %; Cr: 3-18 at %; Fe: 3-50 at %; Mn: 3-20 at %; Ni: 17-45 at %; V: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at % or less.
    Type: Application
    Filed: March 21, 2017
    Publication date: March 7, 2019
    Inventors: Byeong-joo LEE, Sung-hak LEE, Hyoung-seop KIM, Young-sang NA, Sun-ig HONG, Won-mi CHOI, Chang-woo JEON, Seung-mun JUNG