Patents by Inventor Seung-ok Jung

Seung-ok Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME
    Publication number: 20240090137
    Abstract: A surface-treated copper foil according to exemplary embodiments includes a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed inside the protrusion layer or around a boundary between the copper foil layer and the protrusion layer. Abnormal growth of the protrusions may be prevented through the pores and thus a bonding force with the insulation layer may be improved.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 14, 2024
    Inventors: Il Hwan YOO, Joo Young JUNG, Myung Ok KYUN, Ji Yeon RYU, Seung Bae OH
  • Methods of Forming Integrated Circuit Devices Including Insulating Support Layers and Related Structures
    Publication number: 20090315143
    Abstract: An integrated circuit device may include a substrate, a plurality of storage electrode landing pads on the substrate, and a plurality of storage electrodes. Each of the plurality of storage electrodes may be on a portion of a respective one of the plurality of storage electrode landing pads. In addition, an insulating support layer may be on the substrate, on portions of the storage electrode landing pads that are free of the storage electrodes, and on portions of sidewalls of storage electrodes. Moreover, portions of sidewalls of the storage electrodes may be free of the insulating support layer. Related methods and structures are also discussed.
    Type: Application
    Filed: June 25, 2009
    Publication date: December 24, 2009
    Inventors: Seung-ok Jung, Il-young Moon
  • Integrated circuit devices including insulating support layers
    Patent number: 7582925
    Abstract: An integrated circuit device may include a substrate, a plurality of storage electrode landing pads on the substrate, and a plurality of storage electrodes. Each of the plurality of storage electrodes may be on a portion of a respective one of the plurality of storage electrode landing pads. In addition, an insulating support layer may be on the substrate, on portions of the storage electrode landing pads that are free of the storage electrodes, and on portions of sidewalls of storage electrodes. Moreover, portions of sidewalls of the storage electrodes may be free of the insulating support layer. Related methods and structures are also discussed.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: September 1, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-ok Jung, Il-young Moon
  • Integrated circuit devices including insulating support layers and related methods and structures
    Publication number: 20060292812
    Abstract: An integrated circuit device may include a substrate, a plurality of storage electrode landing pads on the substrate, and a plurality of storage electrodes. Each of the plurality of storage electrodes may be on a portion of a respective one of the plurality of storage electrode landing pads. In addition, an insulating support layer may be on the substrate, on portions of the storage electrode landing pads that are free of the storage electrodes, and on portions of sidewalls of storage electrodes. Moreover, portions of sidewalls of the storage electrodes may be free of the insulating support layer. Related methods and structures are also discussed.
    Type: Application
    Filed: June 28, 2006
    Publication date: December 28, 2006
    Inventors: Seung-ok Jung, II-young Moon