Patents by Inventor Seung Ri Choi
Seung Ri Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942635Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery using a positive electrode containing the positive electrode active material. More particularly, the present invention relates to a positive electrode active material that is able to solve a problem of increased resistance according to an increase in Ni content by forming a charge transport channel in a lithium composite oxide and a lithium secondary battery using a positive electrode containing the positive electrode active material.Type: GrantFiled: September 28, 2020Date of Patent: March 26, 2024Assignee: ECOPRO BM CO., LTD.Inventors: Moon Ho Choi, Jun Won Suh, Jin Kyeong Yun, Jung Han Lee, Mi Hye Yun, Seung Woo Choi, Gwang Seok Choe, Ye Ri Jang, Joong Ho Bae
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Publication number: 20240088347Abstract: A prelithiated negative electrode, and a secondary battery including a prelithiated electrode, including a negative electrode current collector; and a negative electrode active material layer present on at least one surface of the negative electrode current collector. The negative electrode active material layer includes high-capacity artificial graphite having no carbon coating. The negative electrode active material layer is prelithiated, and the content of lithium intercalated to the prelithiated negative electrode active material layer is 3% to 5% based on the lithium content intercalated when the negative electrode is charged to 100%.Type: ApplicationFiled: November 11, 2020Publication date: March 14, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Hee-Won CHOI, Ye-Ri KIM, Chan-Ki PARK, Mi-Ru JO, Oh-Byong CHAE, Seung-Hae HWANG
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Publication number: 20240069269Abstract: A display apparatus including a display panel, a light source configured to emit light, and a light guide disposed on the light source and covering a side of the light source, the light source including a substrate, a light emitter including a light emitting stacked layer and disposed on the substrate, a light blocking layer disposed on a side surface of the light emitting stacked layer, and a reflector disposed between the substrate and the light guide, in which the light emitter has a first length direction and a second length direction, wherein orientation angles of the light emitter in the first and second length directions are different from each other, the substrate includes a first pad electrode and second pad electrode electrically connected to the light emitter, and the first and second pad electrodes are spaced apart from each other by at least 50 ?m.Type: ApplicationFiled: November 7, 2023Publication date: February 29, 2024Inventors: Seung Ri CHOI, Eun Ju KIM, Hee Soo LIM
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Publication number: 20230129439Abstract: A display apparatus including a display panel, a light source configured to emit light, and a light guide disposed on the light source and covering a side of the light source, the light source including a substrate, a light emitter including a light emitting stacked layer and disposed on the substrate, a light blocking layer disposed on a side surface of the light emitting stacked layer, and a reflector disposed between the substrate and the light guide, in which the light emitter has a first length direction and a second length direction, wherein orientation angles of the light emitter in the first and second length directions are different from each other, the substrate includes a first pad electrode and second pad electrode electrically connected to the light emitter, and the first and second pad electrodes are spaced apart from each other by at least 50 µm.Type: ApplicationFiled: December 23, 2022Publication date: April 27, 2023Inventors: Seung Ri CHOI, Eun Ju KIM, Hee Soo LIM
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Patent number: 11536893Abstract: A display apparatus including a display panel, a light source unit configured to provide light to the display panel, and a light guide member disposed between the display panel and the light source unit and covering the light source unit such that the light source unit is buried in the light guide member, the light guide member having a surface roughness on an upper surface thereof to diffuse light and including a substrate, and a light emitting device disposed on the substrate and including a blocking pattern to have an intensity of light emitted in an upward direction to be equal to or less than about 80% of a maximum light intensity of the light emitting device.Type: GrantFiled: March 7, 2021Date of Patent: December 27, 2022Assignee: Seoul Semiconductor Co., Ltd.Inventors: Seung Ri Choi, Eun Ju Kim, Hee Soo Lim
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Publication number: 20220246808Abstract: A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.Type: ApplicationFiled: April 20, 2022Publication date: August 4, 2022Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Seung Ri CHOI, Hyuck Jun KIM, Se Min BANG, Do Choul WOO, Se Won TAE
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Patent number: 11335837Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.Type: GrantFiled: November 2, 2020Date of Patent: May 17, 2022Assignee: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
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Publication number: 20210208329Abstract: A display apparatus including a display panel, a light source unit configured to provide light to the display panel, and a light guide member disposed between the display panel and the light source unit and covering the light source unit such that the light source unit is buried in the light guide member, the light guide member having a surface roughness on an upper surface thereof to diffuse light and including a substrate, and a light emitting device disposed on the substrate and including a blocking pattern to have an intensity of light emitted in an upward direction to be equal to or less than about 80% of a maximum light intensity of the light emitting device.Type: ApplicationFiled: March 7, 2021Publication date: July 8, 2021Inventors: Seung Ri CHOI, Eun Ju KIM, Hee Soo LIM
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Publication number: 20210050492Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.Type: ApplicationFiled: November 2, 2020Publication date: February 18, 2021Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Seung Ri CHOI, Hyuck Jun KIM, Se Min BANG, Do Choul WOO, Se Won TAE
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Patent number: 10825969Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.Type: GrantFiled: October 31, 2019Date of Patent: November 3, 2020Assignee: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
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Patent number: 10615321Abstract: A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.Type: GrantFiled: May 8, 2018Date of Patent: April 7, 2020Assignee: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
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Publication number: 20200066950Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.Type: ApplicationFiled: October 31, 2019Publication date: February 27, 2020Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
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Publication number: 20190058095Abstract: A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.Type: ApplicationFiled: May 8, 2018Publication date: February 21, 2019Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae