Patents by Inventor Seung Bae Jung

Seung Bae Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240090137
    Abstract: A surface-treated copper foil according to exemplary embodiments includes a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed inside the protrusion layer or around a boundary between the copper foil layer and the protrusion layer. Abnormal growth of the protrusions may be prevented through the pores and thus a bonding force with the insulation layer may be improved.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 14, 2024
    Inventors: Il Hwan YOO, Joo Young JUNG, Myung Ok KYUN, Ji Yeon RYU, Seung Bae OH
  • Patent number: 6038779
    Abstract: An apparatus for measuring thickness and a method therefor are disclosed, in which the precision is improved, the measuring time is shortened, the reliability is upgraded, and the flatness of thickness also can be precisely measured. The apparatus for measuring thickness according to the present invention includes a test piece retaining part for retaining a test piece and for moving it along X, Y and Z axes. The apparatus further includes a sensing part having a sensor retaining part for retaining an upper sensor, and having a test piece retaining part supporting table for supporting the test piece retaining part and having a lower sensor fixed thereon. The test piece retaining part includes: an X axis carrying part capable of moving in the direction of X axis, a Y axis carrying part capable of moving in the direction of Y axis, and a Z axis carrying part capable of moving in the direction of Z axis.
    Type: Grant
    Filed: July 14, 1998
    Date of Patent: March 21, 2000
    Assignees: Pohang Iron & Steel Co., Ltd., Research Institute of Industrial Science & Technology
    Inventors: Eung Suk Lee, Wan Hee Park, June Ho Park, Seung Bae Jung