Patents by Inventor Seung Cheol Lee
Seung Cheol Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240124404Abstract: The present invention relates to a composition for preventing, improving, or treating diseases related to advanced glycation end products, comprising an indole derivative or a pharmaceutically acceptable salt thereof. Specifically, the composition of the present invention possesses the effect of trapping methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.Type: ApplicationFiled: December 11, 2023Publication date: April 18, 2024Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
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Publication number: 20240123386Abstract: A filter holder comprises: a plurality of filter frames disposed such that at least some thereof are adjacent to each other; and a folding member which supports filter frames, from among the plurality of filter frames, adjacent to each other so as to be rotatable with respect to each other. The folding member comprises: a folding part which has a predetermined thickness and is flexible so as to be foldable by means of rotation of the adjacent filter frames adjacent with respect to each other; and a plurality of edge parts which are connected to the respective sides of the folding part with the folding portion therebetween and rotate together with the adjacent filter frames, and wherein when viewed from a cross-section of the folding member, the edge parts may have a greater thickness than the folding part.Type: ApplicationFiled: January 28, 2022Publication date: April 18, 2024Applicant: COWAY CO.,LTD.Inventors: Yoon Hyuck CHOI, Hyun Kyu LEE, Jong Cheol KIM, Seung Ki KIM, Sung Sil KANG, Ju Hyun BAEK, Chan Jung PARK
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Publication number: 20240124399Abstract: The present invention relates to a novel indole derivative and a use thereof. The novel indole derivative according to the present invention traps methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.Type: ApplicationFiled: December 11, 2023Publication date: April 18, 2024Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
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Publication number: 20240119948Abstract: Provided is an encoding apparatus for integrally encoding and decoding a speech signal and a audio signal, and may include: an input signal analyzer to analyze a characteristic of an input signal; a stereo encoder to down mix the input signal to a mono signal when the input signal is a stereo signal, and to extract stereo sound image information; a frequency band expander to expand a frequency band of the input signal; a sampling rate converter to convert a sampling rate; a speech signal encoder to encode the input signal using a speech encoding module when the input signal is a speech characteristics signal; a audio signal encoder to encode the input signal using a audio encoding module when the input signal is a audio characteristic signal; and a bitstream generator to generate a bitstream.Type: ApplicationFiled: June 21, 2023Publication date: April 11, 2024Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Kwangwoon University Industry-Academic Collaboration FoundationInventors: Tae Jin LEE, Seung-Kwon BAEK, Min Je KIM, Dae Young JANG, Jeongil SEO, Kyeongok KANG, Jin-Woo HONG, Hochong PARK, Young-Cheol PARK
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Publication number: 20240100464Abstract: An air filter comprises: a first filter frame in which a plurality of first chambers are formed; a second filter frame in which a plurality of second chambers are formed and which is arranged at the rear of the first filter frame; and a filter material which is accommodated in the plurality of first chambers and the plurality of second chambers to filter air, wherein the first filter frame and the second filter frame are arranged so that, when seen from the front, the center of each of the plurality of second chambers is out of line with the center of each of the plurality of first chambers, in the vertical direction.Type: ApplicationFiled: January 28, 2022Publication date: March 28, 2024Applicant: COWAY CO., LTD.Inventors: Yoon Hyuck CHOI, Hyun Kyu LEE, Jong Cheol KIM, Seung Ki KIM, Sung Sil KANG, Ju Hyun BAEK, Chan Jung PARK
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Publication number: 20240102611Abstract: A low profile flat bombe for Liquefied Petroleum Gas (LPG) storage and method for manufacturing the same, may include a flat bombe body including an upper plate having a plurality of first piercing holes and a pump installation hole formed therethrough, a lower plate having a plurality of second piercing holes formed therethrough at positions vertically coinciding with the plurality of first piercing holes, and side plates integrally connecting first and second side end portions of the upper and lower plates, end plates mounted at front and rear openings in the flat bombe body, and support pipes, wherein upper end portions of the support pipes are welded to internal circumferential portions of the plurality of first piercing holes and lower end portions thereof are welded to internal circumferential portions of the plurality of second piercing holes to maintain a vertical distance between the upper and lower plates.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HUNG PRECISION IND'L CO., LTD.Inventors: Seong Cheol Cho, Sung Won Lee, Ju Tae Song, Seung Hyun Yeo, Duk Hee Park
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Publication number: 20240105194Abstract: Disclosed is an LPC residual signal encoding/decoding apparatus of an MDCT based unified voice and audio encoding device. The LPC residual signal encoding apparatus analyzes a property of an input signal, selects an encoding method of an LPC filtered signal, and encode the LPC residual signal based on one of a real filterbank, a complex filterbank, and an algebraic code excited linear prediction (ACELP).Type: ApplicationFiled: December 5, 2023Publication date: March 28, 2024Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seung Kwon BEACK, Tae Jin LEE, Min Je KIM, Kyeongok KANG, Dae Young JANG, Jin Woo HONG, Jeongil SEO, Chieteuk AHN, Hochong PARK, Young-Cheol PARK
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Patent number: 11937765Abstract: A cleaning apparatus including a vacuum cleaner and a docking station is provided. The cleaning apparatus includes a vacuum cleaner including a dust collecting chamber in which foreign substances are collected, and a docking station configured to be connected to the dust collecting chamber to remove the foreign substances collected in the dust collecting chamber. The dust collecting chamber is configured to collect foreign substances through centrifugation, and configured to be docked to the docking station, and the docking station includes a suction device configured to suction the foreign substances and air in the dust collecting chamber docked to the docking station.Type: GrantFiled: December 12, 2019Date of Patent: March 26, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: See Hyun Kim, In Gyu Choi, Ki Hwan Kwon, Shin Kim, Hyeon Cheol Kim, Do Kyung Lee, Hyun Ju Lee, Yun Soo Jang, Seung Ryong Cha, Jung Gyun Han
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Patent number: 11942264Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.Type: GrantFiled: December 8, 2020Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: No Il Park, Byung Soo Kang, Seung Mo Lim, Byeong Cheol Moon, Boum Seock Kim, Yong Hui Li, Seung Min Lee
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Patent number: 11915853Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.Type: GrantFiled: November 6, 2020Date of Patent: February 27, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Byung Soo Kang, Ju Hwan Yang, Tai Yon Cho, No Il Park, Tae Jun Choi
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Publication number: 20230293487Abstract: The present disclosure relates to a pharmaceutical composition for preventing or treating an inflammatory disease, comprising a benzofuran-based N-acylhydrazone compound, a stereoisomer thereof, or a pharmaceutically acceptable salt thereof. The benzofuran-based N-acylhydrazone compound according to the present disclosure inhibits the activity of NF-?B, which is a major signal transmitter in the inflammatory response, thereby disrupting the initial pathway and process of the biological inflammatory response system and inhibiting inflammatory immune cells and inflammatory cytokines, and thus can prevent and treat various pathological diseases caused by the inflammatory response.Type: ApplicationFiled: July 21, 2021Publication date: September 21, 2023Inventors: Joon Sung Hwang, Bo Yeon Kim, Nak Kyun Soung, Kyung Ho Lee, Seung Cheol Lee, Hyun Joo Cha
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Publication number: 20230129758Abstract: A method of manufacturing a semiconductor memory device includes alternately stacking sacrificial layers and interlayer insulating layers over a lower structure, forming a slit passing through the sacrificial layers and the interlayer insulating layers, removing the sacrificial layers through the slit through a wet etching process, and removing, through a dry etching process, a byproduct that is produced at ends of the interlayer insulating layers during the wet etching process.Type: ApplicationFiled: March 3, 2022Publication date: April 27, 2023Applicant: SK hynix Inc.Inventors: Seung Cheol LEE, Dae Min KIM, Dae Sung KIM, Sang Seob LEE, Hyun Woo JIN
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Patent number: 10938963Abstract: An electronic device includes at least one communication circuit, and a processor electrically connected with the at least one communication circuit. The processor may be configured to select an external electronic device in response to a user input, broadcast, through the at least one communication circuit using a first protocol, a connection request for a second protocol-based communication with the external electronic device, receive a response to the connection request from the external electronic device through the at least one communication circuit, and perform communication with the external electronic device through the at least one communication circuit using a second protocol, based on connection information about the external electronic device for the second protocol-based communication, the connection information being contained in the response.Type: GrantFiled: July 13, 2018Date of Patent: March 2, 2021Inventors: Jong-Sung Joo, Seung-Cheol Lee, Je-Hyun Lee, Ki-Ho Cho, Hyoung-Tak Cho, A-Reum Choi, In-Young Choi, Dong-Il Son, Pil-Joo Yoon, Sun-Min Hwang
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Patent number: 10756112Abstract: Provided herein is a semiconductor device and a method of manufacturing the same. The method includes alternately forming sacrificial layers and interlayer insulating layers on a semiconductor substrate. The method further includes forming a slit to expose the sacrificial layers by etching through the sacrificial layers and the interlayer insulating layers and forming interlayer openings by removing the exposed sacrificial layers. The method also includes depositing a conductive material in the interlayer openings and forming seams in which core patterns are deposited. The method additionally includes oxidizing a portion of the conductive material in the interlayer openings using a wet etching process and forming conductive patterns by removing the oxidized portion of the conductive material from the interlayer openings while leaving the seams intact.Type: GrantFiled: January 3, 2020Date of Patent: August 25, 2020Assignee: SK hynix Inc.Inventors: Seung Cheol Lee, Woo Jae Chung, Choung Sik Song
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Publication number: 20200144289Abstract: Provided herein is a semiconductor device and a method of manufacturing the same. The method includes alternately forming sacrificial layers and interlayer insulating layers on a semiconductor substrate. The method further includes forming a slit to expose the sacrificial layers by etching through the sacrificial layers and the interlayer insulating layers and forming interlayer openings by removing the exposed sacrificial layers. The method also includes depositing a conductive material in the interlayer openings and forming seams in which core patterns are deposited. The method additionally includes oxidizing a portion of the conductive material in the interlayer openings using a wet etching process and forming conductive patterns by removing the oxidized portion of the conductive material from the interlayer openings while leaving the seams intact.Type: ApplicationFiled: January 3, 2020Publication date: May 7, 2020Applicant: SK hynix Inc.Inventors: Seung Cheol LEE, Woo Jae CHUNG, Choung Sik SONG
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Patent number: 10573663Abstract: Provided herein is a semiconductor device and a method of manufacturing the same. The method includes alternately forming sacrificial layers and interlayer insulating layers on a semiconductor substrate. The method further includes forming a slit to expose the sacrificial layers by etching through the sacrificial layers and the interlayer insulating layers and forming interlayer openings by removing the exposed sacrificial layers. The method also includes depositing a conductive material in the interlayer openings and forming seams in which core patterns are deposited. The method additionally includes oxidizing a portion of the conductive material in the interlayer openings using a wet etching process and forming conductive patterns by removing the oxidized portion of the conductive material from the interlayer openings while leaving the seams intact.Type: GrantFiled: May 13, 2019Date of Patent: February 25, 2020Assignee: SK hynix Inc.Inventors: Seung Cheol Lee, Woo Jae Chung, Choung sik Song
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Patent number: 10572398Abstract: A universal serial bus (USB) multi-host device includes a plurality of upstream ports connected to a first host and a second host, a storage for storing data to be transmitted from the first host to the second host through the upstream ports, and a controller, and if the storage receives the data, the controller transmitting a signal based on the received data to the second host, and transmitting the stored data to the second host.Type: GrantFiled: December 15, 2016Date of Patent: February 25, 2020Assignee: Hyundai Motor CompanyInventor: Seung-Cheol Lee
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Patent number: 10430648Abstract: A method for processing content in an electronic device and an electronic device for doing the same are provided. The method includes acquiring content including at least one character, and performing at least one of classifying the acquired content into at least one of a plurality of categories by analyzing the acquired content or generating vector images including a vector image corresponding to the at least one character based on the acquired content and displaying at least a part of the vector images on a display functionally connected to the electronic device.Type: GrantFiled: April 15, 2015Date of Patent: October 1, 2019Assignee: Samsung Electronics Co., LtdInventors: Ki-Huk Lee, Seung-Cheol Lee, Jin-Hong Jeong, Tae-Gun Park, Sang-Keun Yoo, Sung-Ho Yoon
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Patent number: 10424597Abstract: A semiconductor device includes a first semiconductor layer, a second semiconductor layer spaced apart from the first semiconductor layer and disposed on the first semiconductor layer, a gate stack structure disposed on the second semiconductor layer, a third semiconductor layer positioned between the first and second semiconductor layers, and a channel pillar passing through the gate stack structure, the second semiconductor layer and the third semiconductor layer and extending into the first semiconductor layer.Type: GrantFiled: February 25, 2019Date of Patent: September 24, 2019Assignee: SK hynix Inc.Inventors: Kang Sik Choi, Bong Hoon Lee, Seung Cheol Lee
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Publication number: 20190267395Abstract: Provided herein is a semiconductor device and a method of manufacturing the same. The method includes alternately forming sacrificial layers and interlayer insulating layers on a semiconductor substrate. The method further includes forming a slit to expose the sacrificial layers by etching through the sacrificial layers and the interlayer insulating layers and forming interlayer openings by removing the exposed sacrificial layers. The method also includes depositing a conductive material in the interlayer openings and forming seams in which core patterns are deposited. The method additionally includes oxidizing a portion of the conductive material in the interlayer openings using a wet etching process and forming conductive patterns by removing the oxidized portion of the conductive material from the interlayer openings while leaving the seams intact.Type: ApplicationFiled: May 13, 2019Publication date: August 29, 2019Applicant: SK hynix Inc.Inventors: Seung Cheol LEE, Woo Jae CHUNG, Choung Sik SONG