Abstract: A carrier-attached ultra-thin copper foil and a method for producing the same are provided. The carrier-attached ultra-thin copper foil includes a copper foil carrier, a release layer, and an ultra-thin copper foil layer. The release layer is formed on a side surface of the copper foil carrier. The release layer contains a copper-containing organic compound, and a chemical structure of the copper-containing organic compound has at least a copper-nitrogen bond (Cu—N bond). The ultra-thin copper foil layer is formed on a side surface of the release layer away from the copper foil carrier. The copper foil carrier is capable of being separated from the ultra-thin copper foil layer through the release layer.

Abstract: A photochromic polypropylene fiber is provided. The photochromic polypropylene fiber includes about 98 to 99 parts by weight of polypropylene, about 0.2 to 0.8 parts by weight of a photochromic agent, about 0.1 to 1 parts by weight of an ultraviolet absorber, and about 0.1 to 1 parts by weight of a light stabilizer. The ultraviolet absorber includes and the light stabilizer includes wherein n is 10-14. A preparation method of the photochromic polypropylene fiber is further provided.

Abstract: A display device includes a button, a first data transmission port, a second data transmission port, a first image transmission port, a second image transmission port, and a microcontroller. The first data transmission port is coupled to a first electronic device. The second data transmission port is coupled to a second electronic device. The first image transmission port is coupled to the first electronic device. The second image transmission port is coupled to the second electronic device. The microcontroller selects the first image transmission port, the second image transmission port, or both to generate a video signal. When the button is pressed, if the microcontroller selects the first image transmission port, the microcontroller switches the first data transmission port to the second data transmission port, and receives image-transmission-port information stored in the second electronic device through the second data transmission port.

Abstract: A manufacturing method of a roughened copper foil includes the following steps. A copper foil is provided. An electrolytic process is performed to form a roughening layer on the copper foil. An electrolyte solution in the electrolysis process includes copper ions in a range from 0.1 g/L to 20 g/L, sulfate ions in a range from 30 g/L to 120 g/L, and a coordination compound in a range from 0.1 g/L to 10 g/L.

Abstract: A release carrier structure includes a carrier layer, a first release layer, and a second release layer. A weight ratio of organic matter in the second release layer is greater than a weight ratio of organic matter in the first release layer.

Abstract: A lithium battery positive material includes lithium nickel manganese oxide (LNMO) doped with copper, titanium, nitrogen, and carbon. In addition, a manufacturing method of the lithium battery positive material is also provided.

Abstract: A display device includes a plurality of display units, a plurality of display unit fixing members, a plurality of first adhering members and a second adhering member. The display units are arranged in an array to function as a display surface of the display device, and a splicing area exists between two adjacent display units. The display unit fixing members are disposed on the display units. The first adhering members are disposed on the splicing area, and two ends of a corresponding first adhering member respectively contact with the two adjacent display units. The second adhering member is disposed between the corresponding first adhering member and the display unit fixing members. A portion of the second adhering member overlaps with the corresponding first adhering member.

Abstract: An antenna system, an antenna device, and an antenna structure are provided. The antenna structure includes a ring-shaped segment, a bandwidth adjustment segment, and a frequency adjustment segment. The ring-shaped segment has a first end portion, a second end portion spaced apart from the first end portion, and a surrounding portion connected between the first end portion and the second end portion. The bandwidth adjustment segment is connected to the first end portion and a part of the surrounding portion adjacent to the first end portion and has a first length along a first direction. The frequency adjustment segment is connected to the bandwidth adjustment segment and has a second length along the first direction and greater than the first length. The antenna structure is configured to generate a three-dimensional sensing space for obtaining signals from at least one sensor located in the three-dimensional sensing space.

Abstract: A complex ionic compound includes a carrier, a bridging agent, and an adsorbent. The bridging agent is grafted to the carrier, and the adsorbent is grafted to the bridging agent.

Abstract: The present disclosure provides an adjustable filter and a method for manufacturing the same, and belongs to the technical field of electronics. The tunable filter includes: a base substrate having a first surface and a second surface opposite to each other in a thickness direction of the base substrate; wherein the base substrate is provided with first connecting vias extending through the base substrate along the thickness direction of the base substrate; and at least one inductor and at least one capacitor integrated on the base substrate; wherein each of the at least one inductor includes first sub-structures on the first surface, second sub-structures on the second surface, and first connection electrodes in the first connecting vias, and the first connection electrodes connect the first sub-structures to the second sub-structures, respectively, to form a coil structure of the inductor.

Abstract: A method includes: positioning a wafer on an electrostatic chuck of a physical vapor deposition apparatus, the wafer including an opening exposing a conductive feature; setting a temperature of the wafer to a room temperature; forming a tungsten thin film in the opening by the physical vapor deposition apparatus, the tungsten thin film including a bottom portion that is on an upper surface of the conductive feature exposed by the opening, a top portion that is on an upper surface of a dielectric layer through which the opening extends and a sidewall portion that is on a sidewall of the dielectric layer exposed by the opening; removing the top portion and the sidewall portion of the tungsten thin film from over the opening; and forming a tungsten plug in the opening on the bottom portion by selectively depositing tungsten by a chemical vapor deposition operation.

Abstract: An end-connecting type hydraulic loader to solve the difficult loading and assembly on the same side in closed power closed testing in planetary gearbox, includes a transmission shaft (3), an internal output inner gear sleeve (1) on a left end of the transmission shaft (3), a thrust shaft (5) rotatably mounted on the transmission shaft (3) and positioned on a right side of internal output inner gear sleeve (1), an external output inner gear sleeve (2) coaxially installed on the internal output inner gear sleeve (1) and connected to the thrust shaft (5), a spiral floating cylinder (9) on a right end of the thrust shaft (5) and a siding assembly on the transmission shaft (3) meshed with the spiral floating cylinder (9) having a left and right sliding movement along the transmission shaft (3) under a hydraulic oil circuit action of the transmission shaft.

Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.

Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.

Abstract: A method for fabricating a semiconductor product includes forming a dielectric layer over a top level metallization layer of a semiconductor process wafer. The dielectric layer is patterned using a grayscale mask process to define a contact pad opening in the dielectric layer, thereby producing a patterned dielectric layer in which the contact pad opening is aligned to a contact pad defined in the top level metallization layer. A metal layer is deposited over the patterned dielectric layer, including within the contact pad opening. A portion of the metal layer is removed by a chemical mechanical polishing (CMP) process, with a remaining portion of the metal layer having a sloped sidewall.

Abstract: Systems and methods are provided for implementing inter-coded resolution-adaptive video coding supported by resizing motion information of a current frame during motion prediction, reducing extensive computational costs and computing time that would be incurred as a result of extensive application of interpolation filters to generate picture information of a reference frame to sub-pixel granularity, and thus reducing computational cost and computing time of decoding as a whole.

Abstract: A sensing and controlling module of airflow for an active aerosol suction device has a tube, a sensing membrane, a sensing coil, a controlling membrane, a controlling coil, and a magnetic unit. The sensing membrane is mounted in the tube. The controlling membrane is disposed at an air inlet of the tube. The sensing membrane and the controlling membrane are capable of bending deformation. The sensing coil is adhered to and spread on the surface of the sensing membrane, and the controlling coil is adhered to and spread on the surface of the controlling membrane. The magnetic unit is disposed at a spaced interval from the sensing membrane and the controlling membrane. With the sensing membrane and the controlling membrane, the sensing and controlling module is capable of sensing and controlling airflow rate.

Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.

Abstract: A method of forming a microelectronic device includes forming positive tone photoresist on the microelectronic device, filling a trench, extending over a top surface adjacent to the trench, and covering a thickness monitor on a substrate containing the microelectronic device. The photoresist in and over the trench is exposed at a trench energy dose, and the photoresist in the monitor area is exposed at a monitor energy dose that is less than the trench energy dose. The photoresist is developed, leaving photoresist in the trench having an in-trench thickness less than the depth of the trench and leaving an in-monitor thickness of the photoresist on the monitor area less than an unexposed thickness. The in-monitor thickness of the photoresist on the monitor area may be measured and the measured thickness value may be used with a calibration chart to estimate the in-trench thickness of the photoresist.

Abstract: In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.