Patents by Inventor Shang-Chieh Wu

Shang-Chieh Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10429314
    Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: October 1, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Lin Louis Chang, Shang-Chieh Chien, Shang-Ying Wu, Li-Kai Cheng, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng, Anthony Yen, Chia-Chen Chen
  • Publication number: 20190250522
    Abstract: Systems and methods that include providing for measuring a first topographical height of a substrate at a first coordinate on the substrate and measuring a second topographical height of the substrate at a second coordinate on the substrate are provided. The measured first and second topographical heights may be provided as a wafer map. An exposure process is then performed on the substrate using the wafer map. The exposure process can include using a first focal point when exposing the first coordinate on the substrate and using a second focal plane when exposing the second coordinate on the substrate. The first focal point is determined using the first topographical height and the second focal point is determined using the second topographical height.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Inventors: Jui-Ching WU, Jeng-Horng CHEN, Chia-Chen CHEN, Shu-Hao CHANG, Shang-Chieh CHIEN, Ming-Chin CHIEN, Anthony YEN
  • Patent number: 10375104
    Abstract: According to one embodiment, a computer-implemented method performed by a computing device comprising at least one processor, the method comprising determining a threat score for a user action in a computer application and calculating a decayed threat score based on the determined threat score and a damping factor. The threat score being indicative of a risk presented by the user action, the decayed threat score being a modified threat score for the user action, and the damping factor being a constant value used to reduce the determined threat score.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: August 6, 2019
    Assignee: SYMANTEC CORPORATION
    Inventors: Shang-Chieh Wu, Ranjani Gunupudi, Rehan Jalil
  • Publication number: 20190237454
    Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.
    Type: Application
    Filed: August 1, 2018
    Publication date: August 1, 2019
    Inventors: Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang, Hsing-Kuo Hsia, Chih-Chieh Hung, Ying-Ching Shih, Chin-Fu Kao, Wen-Hsin Wei, Li-Chung Kuo, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20190155179
    Abstract: A method for a lithography exposure process is provided. The method includes irradiating a target droplet with a laser beam to create an extreme ultraviolet (EUV) light. The method further includes reflecting the EUV light with a collector. The method also includes discharging a cleaning gas over the collector through a gas distributor positioned next to the collector. A portion of the cleaning gas is converted to free radicals before the cleaning gas leaves the gas distributor, and the free radicals are discharged over the collector along with the cleaning gas.
    Type: Application
    Filed: August 30, 2018
    Publication date: May 23, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Ying WU, Shang-Chieh CHIEN, Bo-Tsun LIU, Li-Jui CHEN, Po-Chung CHENG
  • Patent number: 10192058
    Abstract: According to one embodiment, a computer-implemented method comprises determining a first threat score and a second threat score respectively corresponding to a first user action and a second user action on one or more computer applications and calculating an aggregate threat score for the determined threat scores. Calculating the aggregate threat score comprises summing together the first threat score and a contribution of the second threat score, wherein the contribution of the second threat score is determined based on the second threat score and a margin corresponding to the difference between a maximum threat score and the first threat score.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: January 29, 2019
    Assignee: SYMANTEC CORPORATION
    Inventors: Rehan Jalil, Shoukat Ali, Shang-Chieh Wu