Patents by Inventor Shang-Yun Tu

Shang-Yun Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130093079
    Abstract: A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.
    Type: Application
    Filed: October 18, 2011
    Publication date: April 18, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen