Abstract: Described herein are electronic devices that includes a display stack having a cover component atop a lightguide component and a display component below the lightguide component. In some instances, the cover component including an antiglare etching applied to a top surface of a coverglass and a touch pattern applied to a bottom surface of the coverglass. In some cases, an optically clear adhesive layer formed from two types of optically clear adhesive may be located between the cover component and the lightguide component and a ring adhesive may be applied to around an outer edge of the cover component, the optically clear adhesive and the lightguide component.

Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a semiconductor die has a back side and a front side opposite the back side. The back side has a semiconductor substrate and the front side has components formed over the semiconductor substrate in front side layers. A backside layer is formed over the backside of the semiconductor die to resist warpage of the die when the die is heated and a plurality of contacts are formed on the front side of the die to attach to a substrate.

Abstract: An example method includes positioning a mass at a height opposite a modulator characterized by a particular strain rate and support by a carrier moveably disposed opposite the mass. The method also includes releasing the mass such that the mass impacts the modulator, and an additional component connected to the carrier causes failure of a sample of material. The method further includes determining a displacement of the carrier corresponding to failure of the sample, determining a force applied to the modulator by the mass and resulting in failure of the sample, and determining at least one of a dynamic strength of the sample and a dynamic modulus of the sample. In such a method, the dynamic strength is based on the force applied to the modulator and the strain rate. Additionally, the dynamic modulus is based on the displacement of the carrier and the strain rate.

Abstract: Describe herein are electronic devices that includes a display stack having a composite cover component atop a display component. In some instances, the composite cover component includes a top layer and a bottom layer formed from an inorganic material and at least one inner layer formed from an organic material. In other instances, the composite cover component includes a top layer and a bottom layer formed from an organic material and at least one inner layer formed from an inorganic material.

Abstract: A housing of a computing device, such as a computer, laptop computer, cellular phone, personal digital assistant (PDA), tablet computer, electronic reader or e-reader, or other mobile device constructed using a combination of a metal material and a lightweight core material. The housing includes a front housing component including a display and a rear housing coupled to the front housing component with an internal side of the rear housing facing the front housing. The rear housing component includes a core material and a structural material coupled to the core material at strategic locations. For example, the structural material may be located around a periphery of the rear housing, around connection ports of the electronic device, and diagonally across the external side to provide strength and stiffness to the rear housing.

Abstract: Portable multimedia devices, and techniques for their manufacture, are provided that feature functional parts embedded with a resin matrix that obviates the need for traditional structural components such as midframes and/or outer casings. The resin matrix may be provided through the use of a flowable liquid resin that is flowed around the functional components within a mold cavity. The liquid resin may then be cured into the resin matrix.

Abstract: Portable multimedia devices, and techniques for their manufacture, are provided that feature functional parts embedded with a resin matrix that obviates the need for traditional structural components such as midframes and/or outer casings. The resin matrix may be provided through the use of a flowable liquid resin that is flowed around the functional components within a mold cavity. The liquid resin may then be cured into the resin matrix.

Abstract: Portable multimedia devices, and techniques for their manufacture, are provided that feature functional parts embedded with a resin matrix that obviates the need for traditional structural components such as midframes and/or outer casings. The resin matrix may be provided through the use of a flowable liquid resin that is flowed around the functional components within a mold cavity. The liquid resin may then be cured into the resin matrix.

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a semiconductor die has a back side and a front side opposite the back side. The back side has a semiconductor substrate and the front side has components formed over the semiconductor substrate in front side layers. A backside layer is formed over the backside of the semiconductor die to resist warpage of the die when the die is heated and a plurality of contacts are formed on the front side of the die to attach to a substrate.

Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract: A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract: Methods for fabricating a layer or layers for use in package substrates and die spacers are described. In one implementation the layer or layers are fabricated to include a plurality of ceramic wells lying within a plane and separated by metallic via with recesses within the ceramic wells being occupied by a dielectric filler material.

Abstract: A microelectronic package comprises a die (110) having a front side (111) containing active circuitry (115) and a back side (112) opposite the front side and a film (120) on the back side of the die. The film has a thickness (121) of at least 20 micrometers, a Young's modulus of at least 10 GPa, and a post-cure glass transition temperature of at least 100° Celsius.

Abstract: A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.

Abstract: A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.

Abstract: A linear coefficient of thermal expansion (CTE) mismatch between two materials, such as between a microelectronic die and a mounting substrate, may induce stress at the interface of the materials. The temperature changes present during the process of attaching a die to a mounting substrate can cause cracking and failure in the electrical connections used to connect the die and mounting substrate. A material with a CTE approximately matching the die CTE is introduced in the mounting substrate to reduce the stress and cracking at the electrical connections between the die and mounting substrate. Additionally, this material may comprise thin film capacitors useful for decoupling power supplies.