Patents by Inventor Shantinath Ghongadi
Shantinath Ghongadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240055282Abstract: Methods provided herein may include illuminating a region on a wafer within a semiconductor processing tool, the wafer having a layer of a material that is at least semi-transparent to light and has a measurable extinction coefficient, and the region being a first fraction of the wafer's surface, detecting light reflected off the material and off a surface underneath the material using one or more detectors and generating optical data corresponding to the detected light, generating a metric associated with a property of the material on the wafer by applying the optical data to a transfer function that relates the optical data to the metric associated with the property of the material on the wafer, determining an adjustment to one or more processing parameters for a processing module, and performing or modifying a processing operation in the processing module according to the adjusted one or more processing parameters.Type: ApplicationFiled: January 4, 2022Publication date: February 15, 2024Inventors: Liu Yang, Mengping LI, Shantinath Ghongadi, Andrew James Pfau
-
Patent number: 11859300Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.Type: GrantFiled: June 27, 2022Date of Patent: January 2, 2024Assignee: Lam Research CorporationInventors: Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
-
Publication number: 20230313408Abstract: An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath. The plating cup includes a contact ring. The contact ring includes contacts. The contacts are immersed in the plating bath. The controller is configured to apply a voltage signal across the contact ring and the electrode to remove residual from the contacts. The voltage signal includes a plating-de-plating waveform. The plating-de-plating waveform includes multiple cycles. Each of the cycles includes a pair of pulses with different polarity.Type: ApplicationFiled: August 13, 2021Publication date: October 5, 2023Inventors: Liu YANG, Quan MA, Zhian HE, Shantinath GHONGADI
-
Publication number: 20230260837Abstract: Various embodiments include methods and apparatuses to moisturize a substrate prior to an electrochemical deposition process. In one embodiment, a method to control substrate wettability includes placing a substrate in a humidification environment, controlling the humidification environment to moisturize a surface of the substrate; and placing the substrate into a plating cell. Other methods and systems are disclosed.Type: ApplicationFiled: May 3, 2021Publication date: August 17, 2023Inventors: Hyungjun Hur, Pooja Tilak, Shantinath Ghongadi, Cian Sweeney
-
Publication number: 20230076493Abstract: Disclosed are cup assemblies for holding, sealing, and providing electrical power to a semiconductor substrate during electroplating which may include a cup bottom element having a main body portion and a moment arm, an elastomeric sealing element disposed on the moment arm, and an electrical contact element disposed on the elastomeric sealing element. The main body portion may be such that it does not substantially flex when a substrate is pressed against the moment arm, and it may be rigidly affixed to another feature of the cup structure. The ratio of the average vertical thickness of the main body portion to that of the moment arm may be greater than about 5. The electrical contact element may have a substantially flat but flexible contact portion disposed upon a substantially horizontal portion of the sealing element. The elastomeric sealing element may be integrated with the cup bottom element during manufacturing.Type: ApplicationFiled: October 26, 2022Publication date: March 9, 2023Inventors: Jingbin FENG, Robert Marshall STOWELL, Shantinath GHONGADI, Ashwin RAMESH
-
Patent number: 11512408Abstract: Disclosed are cup assemblies for holding, sealing, and providing electrical power to a semiconductor substrate during electroplating which may include a cup bottom element having a main body portion and a moment arm, an elastomeric sealing element disposed on the moment arm, and an electrical contact element disposed on the elastomeric sealing element. The main body portion may be such that it does not substantially flex when a substrate is pressed against the moment arm, and it may be rigidly affixed to another feature of the cup structure. The ratio of the average vertical thickness of the main body portion to that of the moment arm may be greater than about 5. The electrical contact element may have a substantially flat but flexible contact portion disposed upon a substantially horizontal portion of the sealing element. The elastomeric sealing element may be integrated with the cup bottom element during manufacturing.Type: GrantFiled: May 18, 2018Date of Patent: November 29, 2022Assignee: Novellus Systems, Inc.Inventors: Jingbin Feng, Robert Marshall Stowell, Shantinath Ghongadi, Ashwin Ramesh
-
Publication number: 20220349850Abstract: In some examples, a Vacuum Pre-treatment Module (VPM) metrology system is provided for measuring a sheet resistance of a layer on a substrate. The system may comprise an eddy sensor including a sender sensor and a receiver sensor defining a gap between them for accepting an edge of a substrate to be tested. A sensor controller receives measurement signals from the eddy sensor. A data processor processes the measurement signals and generates sheet resistance values for the layer on the substrate.Type: ApplicationFiled: September 29, 2020Publication date: November 3, 2022Inventors: Manish Ranjan, Andrew James Pfau, Douglas Hill, Douglas Koeller, Burton Williams, Shantinath Ghongadi
-
Publication number: 20220342387Abstract: In one embodiment, the disclosed apparatus is an in-situ, closed-loop bubble and foam detection and reduction system that includes a liquid-level sensor to determine a volume of a liquid in a fluid reservoir, a mass-detection device to determine a mass of the fluid reservoir and any liquid contained within the fluid reservoir, a processor electrically coupled to the liquid-level sensor and the mass-detection device to determine an actual volume of the liquid within the fluid reservoir, and a showerhead coupled to the processor and positioned above the fluid reservoir. The showerhead is activated by the processor when a volume of the liquid determined by the liquid-level sensor exceeds the actual volume of the liquid by a predetermined amount. Other apparatuses and methods are disclosed.Type: ApplicationFiled: August 11, 2020Publication date: October 27, 2022Inventors: Yu Ding, Quan Ma, Gerranine S. Manuguid, Shantinath Ghongadi, Robert Marshallbert Stowell
-
Publication number: 20220333267Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.Type: ApplicationFiled: June 27, 2022Publication date: October 20, 2022Inventors: Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
-
Patent number: 11401623Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.Type: GrantFiled: January 11, 2021Date of Patent: August 2, 2022Assignee: Lam Research CorporationInventors: Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
-
Publication number: 20220228287Abstract: An electrochemical deposition system includes: an electrochemical deposition chamber including an electrolyte for electrochemical deposition; a substrate holder configured to hold a substrate and including a first cathode that is electrically connected to the substrate; a first actuator configured to adjust a vertical position of the substrate holder within the electrochemical deposition chamber; an anode submerged in the electrolyte; a second cathode arranged between the first cathode and the anode; a first optical probe configured to measure a first reflectivity of the substrate at a first distance from a center of the substrate while the substrate is submerged within the electrolyte during the electrochemical deposition; and a controller configured to, based on the first reflectivity, selectively adjust at least one of power applied to the first cathode, power applied to the second cathode, power applied to the anode, and the vertical position of the substrate holder.Type: ApplicationFiled: May 19, 2020Publication date: July 21, 2022Inventors: Andrew James PFAU, Shantinath GHONGADI, Zhian HE, Manish RANJAN
-
Patent number: 11225727Abstract: Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.Type: GrantFiled: May 19, 2020Date of Patent: January 18, 2022Assignee: Lam Research CorporationInventors: Zhian He, Ashwin Ramesh, Shantinath Ghongadi
-
Patent number: 11208732Abstract: Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.Type: GrantFiled: September 6, 2019Date of Patent: December 28, 2021Assignee: Lam Research CorporationInventors: Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Shantinath Ghongadi, Jonathan David Reid, Manish Ranjan, Bryan Pennington, Clifford Raymond Berry
-
Publication number: 20210366768Abstract: Various embodiments include methods and apparatuses to moisturize a substrate prior to an electrochemical deposition process. In one embodiment, a method to control substrate wettability includes placing a substrate in a pre-treatment chamber, controlling an environment of the pre-treatment chamber to moisturize a surface of the substrate; and placing the substrate into a plating cell. Other methods and systems are disclosed.Type: ApplicationFiled: April 29, 2019Publication date: November 25, 2021Inventors: Zhian HE, Shantinath GHONGADI, Hyungjun HUR, Ludan HUANG, Jingbin FENG, Douglas HILL, Thomas BURKE, Manish RANJAN, Andrew James PFAU
-
Publication number: 20210130976Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.Type: ApplicationFiled: January 11, 2021Publication date: May 6, 2021Applicant: Lam Research CorporationInventors: Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
-
Patent number: 10968531Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.Type: GrantFiled: January 26, 2017Date of Patent: April 6, 2021Assignee: Novellus Systems, Inc.Inventors: Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew
-
Patent number: 10927475Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.Type: GrantFiled: November 1, 2018Date of Patent: February 23, 2021Assignee: Lam Research CorporationInventors: Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
-
Publication number: 20200277708Abstract: Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.Type: ApplicationFiled: May 19, 2020Publication date: September 3, 2020Inventors: Zhian He, Ashwin Ramesh, Shantinath Ghongadi
-
Patent number: 10745817Abstract: In one aspect, an apparatus includes a plating cell, a degassing device configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell; an oxidation station configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and a controller. The controller includes program instructions for causing a process that includes operations of: reducing an oxygen concentration of the plating solution where the plating solution contains a plating accelerator; then, contacting a wafer substrate with the plating solution having reduced oxygen concentration and electroplating a metal such that the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; then increasing the oxidizing strength of the plating solution causing a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell.Type: GrantFiled: October 16, 2017Date of Patent: August 18, 2020Assignee: Novellus Systems, Inc.Inventors: Kousik Ganesan, Tighe A. Spurlin, Jonathan David Reid, Shantinath Ghongadi, Andrew John McKerrow, James E. Duncan
-
Patent number: 10689774Abstract: Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.Type: GrantFiled: January 10, 2019Date of Patent: June 23, 2020Assignee: Lam Research CorporationInventors: Zhian He, Ashwin Ramesh, Shantinath Ghongadi