Patents by Inventor Shao-Chin Lo
Shao-Chin Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240088023Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
-
Patent number: 11923243Abstract: A method for manufacturing a semiconductor structure includes preparing a dielectric structure formed with trenches respectively defined by lateral surfaces of the dielectric structure, forming spacer layers on the lateral surfaces, filling an electrically conductive material into the trenches to form electrically conductive features, selectively depositing a blocking layer on the dielectric structure, selectively depositing a dielectric material on the electrically conductive features to form a capping layer, removing the blocking layer and the dielectric structure to form recesses, forming sacrificial features in the recesses, forming a sustaining layer to cover the sacrificial features; and removing the sacrificial features to obtain the semiconductor structure formed with air gaps confined by the sustaining layer and the spacer layers.Type: GrantFiled: August 30, 2021Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue, Hsiao-Kang Chang
-
Patent number: 10224613Abstract: The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.Type: GrantFiled: May 21, 2018Date of Patent: March 5, 2019Assignee: MEDIATEK INC.Inventors: Min-Chung Wu, Shao-Chin Lo
-
Publication number: 20180269562Abstract: The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.Type: ApplicationFiled: May 21, 2018Publication date: September 20, 2018Inventors: Min-Chung WU, Shao-Chin LO
-
Patent number: 9979073Abstract: The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.Type: GrantFiled: July 6, 2016Date of Patent: May 22, 2018Assignee: MEDIATEK INC.Inventors: Min-Chung Wu, Shao-Chin Lo
-
Publication number: 20160315374Abstract: The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.Type: ApplicationFiled: July 6, 2016Publication date: October 27, 2016Inventors: Min-Chung Wu, Shao-Chin Lo
-
Publication number: 20160315375Abstract: The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.Type: ApplicationFiled: July 6, 2016Publication date: October 27, 2016Inventors: Min-Chung Wu, Shao-Chin Lo
-
Patent number: 9413444Abstract: A radio frequency (RF) processing circuit used in a wireless communication device for processing a plurality of wireless signals is disclosed. The RF processing circuit comprises an RF front-end circuit and a control unit. The RF front-end circuit is coupled to a plurality of antennas and a plurality of communication modules and is used for switching connections between the plurality of antennas and the plurality of communication modules according to a control signal. The control unit is coupled to the RF front-end circuit and is used for generating the control signal according to a frequency band and operation conditions of each communication module. The RF front-end circuit further comprises a switch module and a frequency multiplexing module.Type: GrantFiled: August 3, 2012Date of Patent: August 9, 2016Assignee: MEDIATEK INC.Inventors: Cheng-Hao Kuo, Shao-Chin Lo
-
Patent number: 9142874Abstract: The present invention discloses a wireless device. The wireless device includes a housing, formed by a metal material, a wireless module disposed inside the housing, and an antenna, disposed outside the housing, coupled to the wireless module via a external socket interface disposed on the housing, for transmitting and receiving signals corresponding to the wireless module.Type: GrantFiled: March 17, 2011Date of Patent: September 22, 2015Assignee: MEDIATEK INC.Inventors: Min-Chung Wu, Shao-Chin Lo
-
Patent number: 9123980Abstract: A flexible transmission device, for transmitting radio-frequency (RF) signals between a first communication module and a second communication module in a communication device, comprising a flexible substrate; a first metal sheet, formed on a plane of the flexible substrate and coupled between ground terminals of the first communication module and the second communication module; and a second metal sheet, formed on a plane of the flexible substrate different from the first metal sheet, and coupled between signal terminals of the first communication module and the second communication module, for transmitting the RF signals.Type: GrantFiled: July 15, 2014Date of Patent: September 1, 2015Assignee: MEDIATEK INC.Inventors: Min-Chung Wu, Shao-Chin Lo
-
Publication number: 20150188617Abstract: A radio frequency (RF) processing circuit used in a wireless communication device for processing a 10 plurality of wireless signals is disclosed. The RF processing circuit comprises an RF front-end circuit, coupled to a plurality of antennas and a plurality of communication modules for switching connections between the plurality of antennas and the plurality of communication modules according to a control signal; and a control unit, coupled to the RF front-end circuit for generating the control signal according to a frequency band and operation conditions of each communication module; wherein the control unit controls the RF front-end circuit to connect each communication module and one of the plurality of antennas, and the wireless communication modules which are connected to a same antenna correspond to different frequency bands.Type: ApplicationFiled: August 3, 2012Publication date: July 2, 2015Inventors: Cheng-Hao Kuo, Shao-Chin Lo
-
Patent number: 9058152Abstract: The present invention discloses a wireless communication module, comprising a substrate; at least one wireless module, disposed on the substrate; and a module which does not emit wireless signals can be disposed on the substrate as well. The wireless communication module forms a compact structure and removes the need for RF shielded coaxial cables within the communication module. The present invention further discloses a portable device, which comprises a display part comprising a communication module; and a host part coupled to the display part; wherein the communication module is deposited on top of display part for better reception.Type: GrantFiled: November 30, 2009Date of Patent: June 16, 2015Assignee: RALINK TECHNOLOGY CORPORATIONInventors: Shao-Chin Lo, Min-Chung Wu, Xin-Chang Chen
-
Publication number: 20140320380Abstract: A flexible transmission device, for transmitting radio-frequency (RF) signals between a first communication module and a second communication module in a communication device, comprising a flexible substrate; a first metal sheet, formed on a plane of the flexible substrate and coupled between ground terminals of the first communication module and the second communication module; and a second metal sheet, formed on a plane of the flexible substrate different from the first metal sheet, and coupled between signal terminals of the first communication module and the second communication module, for transmitting the RF signals.Type: ApplicationFiled: July 15, 2014Publication date: October 30, 2014Inventors: Min-Chung Wu, Shao-Chin Lo
-
Publication number: 20140300527Abstract: The present invention discloses an antenna for a wireless communication device, including a radiator including a first fixing segment, and a first connecting unit including a first fixture unit and a second fixture unit for holding the first fixing segment such that the radiator is electrically connect to a circuit.Type: ApplicationFiled: April 3, 2013Publication date: October 9, 2014Applicant: RALINK TECHNOLOGY CORP.Inventors: Shao-Chin Lo, Cheng-Hao Kuo
-
Patent number: 8838176Abstract: The present invention discloses a high gain antenna. The high gain antenna includes a first dipole antenna, formed on a substrate; a parallel reflection metal sheet, formed on the substrate and in parallel with the first dipole antenna; a first vertical reflection metal sheet, vertically disposed on a front side of the substrate and behind the first dipole antenna; and a second vertical reflection metal sheet, vertically disposed on a back side of the substrate and behind the first dipole antenna.Type: GrantFiled: January 10, 2012Date of Patent: September 16, 2014Assignee: Mediatek Inc.Inventors: Cheng-Hao Kuo, Hsiao-Ting Huang, Shao-Chin Lo
-
Patent number: 8816910Abstract: The present invention discloses a flexible transmission device, for transmitting radio-frequency (RF) signals between a first communication module and a second communication module in a communication device. The flexible transmission device includes a flexible substrate; a first metal sheet, formed on the flexible substrate and coupled between ground terminals of the first communication module and the second communication module; a second metal sheet, formed on the flexible substrate and coupled between the ground terminals of the first communication module and the second communication module; and a third metal sheet, formed on the flexible substrate and between the first metal sheet and the second metal sheet, and coupled between signal terminals of the first communication module and the second communication module, for transmitting the RF signals.Type: GrantFiled: June 20, 2012Date of Patent: August 26, 2014Assignee: Mediatek Inc.Inventors: Min-Chung Wu, Shao-Chin Lo
-
Patent number: 8711054Abstract: An electronic device with an embedded three-dimensional antenna is disclosed. The electronic device includes a printed circuit board (PCB) and an embedded three-dimensional antenna. The embedded three-dimensional antenna includes a radiation element and a connection element. The connection element includes a first connection part and a second connection part. The first and second connection parts are coupled to the PCB, and utilized for transferring signals of the embedded three-dimensional antenna to the PCB. The first and second connection parts further clamp the PCB to attach the embedded three-dimensional antenna on the PCB.Type: GrantFiled: August 8, 2013Date of Patent: April 29, 2014Assignee: Ralink Technology Corp.Inventors: Min-Chung Wu, Shao-Chin Lo
-
Patent number: 8674878Abstract: The present invention discloses a smart antenna system for a portable device. The smart antenna system includes a plurality of directional antennas, disposed at a plurality of positions of the portable device, having a plurality of directional radiation patterns corresponding to a plurality of areas; wherein all of the plurality of directional radiation patterns substantially form an omni directional radiation pattern.Type: GrantFiled: February 14, 2011Date of Patent: March 18, 2014Assignee: Ralink Technology Corp.Inventors: Min-Chung Wu, Shao-Chin Lo
-
Patent number: 8666450Abstract: A antenna for transmitting radio signals of a lower frequency and a higher frequency includes a driven element comprising two first radiating units for a lower frequency band and two radiating units for a higher frequency band, and a reflector element comprising a first reflecting unit for the lower frequency band and a second reflecting unit for the higher frequency band. The second radiating units are disposed at a side of the first radiating units and respectively coupled to a corresponding first radiating unit. The first reflecting unit is disposed at the other side of the first radiating units, and the second reflecting unit is disposed between the first radiating units and the first reflecting unit.Type: GrantFiled: January 3, 2011Date of Patent: March 4, 2014Assignee: Ralink Technology Corp.Inventors: Hsiao-Ting Huang, Shao-Chin Lo
-
Publication number: 20130342410Abstract: The present invention discloses a flexible transmission device, for transmitting radio-frequency (RF) signals between a first communication module and a second communication module in a communication device. The flexible transmission device includes a flexible substrate; a first metal sheet, formed on the flexible substrate and coupled between ground terminals of the first communication module and the second communication module; a second metal sheet, formed on the flexible substrate and coupled between the ground terminals of the first communication module and the second communication module; and a third metal sheet, formed on the flexible substrate and between the first metal sheet and the second metal sheet, and coupled between signal terminals of the first communication module and the second communication module, for transmitting the RF signals.Type: ApplicationFiled: June 20, 2012Publication date: December 26, 2013Inventors: Min-Chung Wu, Shao-Chin Lo