Patents by Inventor Shao-Yang LU

Shao-Yang LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma Torch Device Using Moving Magnets
    Publication number: 20130161298
    Abstract: The present invention provides a plasma torch device. The device comprises a front electrode, a back electrode and a vortex flow generator. The torch roots of the back electrode are moved by fixed magnets. By controlling the magnets coordinated with vortex air flow, the torch roots are moved back and forth periodically on inner surface of the back electrode. The torch roots do not stay at the same place for long for preventing increasing local heat burden of the electrode. Thus, life time and maintenance cycle of the electrode is prolonged with reduced operational cost of plasma torch and enhanced reliability of the device.
    Type: Application
    Filed: August 22, 2012
    Publication date: June 27, 2013
    Applicant: ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Jyh-Ming Yan, Ming-Song Yang, Chin-Ching Tzeng, Yo-Ming Chang, Kuo-Chao Liang, Chen-Yuan Hsu, Shao-Yang Lu
  • Supporting substrate and method for fabricating the same
    Patent number: 8450624
    Abstract: The invention provides a supporting substrate and method for fabricating the same. The supporting substrate includes: a substrate; a first surface metal layer formed on the substrate, wherein the first surface metal layer has a first opening; a second surface metal layer formed on the substrate and disposed oppositely to the first surface metal layer, wherein the substrate has a through hole, and the through hole is formed along the first opening to expose the second surface metal layer; a protective layer formed on the first surface metal layer and the second surface metal layer, wherein the protective layer has a second opening which exposes the through hole; and a conductive bump formed in the through hole, the first opening and the second opening, wherein the conductive bump is electrically connected to the second surface metal layer.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: May 28, 2013
    Assignee: Nan Ya PCB Corp.
    Inventors: Meng-Han Lee, Shao-Yang Lu, Bor-Shyang Liao
  • SUPPORTING SUBSTRATE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20110253440
    Abstract: The invention provides a supporting substrate and method for fabricating the same. The supporting substrate includes: a substrate; a first surface metal layer formed on the substrate, wherein the first surface metal layer has a first opening; a second surface metal layer formed on the substrate and disposed oppositely to the first surface metal layer, wherein the substrate has a through hole, and the through hole is formed along the first opening to expose the second surface metal layer; a protective layer formed on the first surface metal layer and the second surface metal layer, wherein the protective layer has a second opening which exposes the through hole; and a conductive bump formed in the through hole, the first opening and the second opening, wherein the conductive bump is electrically connected to the second surface metal layer.
    Type: Application
    Filed: August 10, 2010
    Publication date: October 20, 2011
    Applicant: NAN YA PCB CORP.
    Inventors: Meng-Han LEE, Shao-Yang LU, Bor-Shyang LIAO