Abstract: Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. One of the methods include: forming first color light emitting diodes (LEDs) and respective intermediate metallic layers on a first substrate, integrating the first color LEDs with pixel circuits in a backplane device, injecting laser pulses into particular first color LEDs, such that each particular first color LED is individually separated from the first substrate and locally bonded with a respective pixel circuit through a respective intermediate metallic layer, and removing the first substrate from the backplane device. The backplane device bonded with the particular first color LEDs can be further bonded with other different color LEDs formed on other substrates. Other first color LEDs without exposure of the laser pulses are removed with the first substrate and can be further used to integrate with another backplane device bonded with another color LEDs.

Abstract: Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. One of the methods includes: forming a plurality of light emitting elements on a substrate, each of the light emitting elements including multiple semiconductor layers epitaxially grown on the substrate and being configured to emit light with a single color, integrating the light emitting elements formed on the substrate with a backplane device, such that each of the light emitting elements is bonded and conductively coupled to a respective pixel circuit in the backplane device, and then removing the substrate from the light emitting elements that remain integrated with the backplane device.

Abstract: Methods, systems, and apparatus for encoding data in source images. In one aspect, a method includes: obtaining a source image having a plurality of pixels, obtaining input data to be encoded, determining a respective texture complexity of each pixel area of a plurality of pixel areas of the source image, and encoding the input data as one or more watermark image codes in at least one pixel area of the plurality of pixel areas of the source image based on a corresponding texture complexity of the at least one pixel area.

Abstract: Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. One of the methods includes: forming a plurality of light emitting elements on a substrate, each of the light emitting elements including multiple semiconductor layers epitaxially grown on the substrate and being configured to emit light with a single color, integrating the light emitting elements formed on the substrate with a backplane device, such that each of the light emitting elements is bonded and conductively coupled to a respective pixel circuit in the backplane device, and then removing the substrate from the light emitting elements that remain integrated with the backplane device.

Abstract: Methods of fabricating integrated active-matrix light emitting pixel array based displays are provided. The methods include: forming an array of light emitting elements on a first side of a substrate, forming an array of active-matrix light emitting pixels using the array of light emitting elements, each pixel including at least one light emitting element and at least one non-volatile memory coupled to the at least one light-emitting element, forming conductive interconnects penetrating through the substrate from a second side of the substrate to the first side, and forming one or more integrated circuits on the second side, the one or more integrated circuits being conductively coupled to the array of active-matrix light-emitting pixels through the conductive interconnects. The methods can further include forming an array of active-matrix multi-color display pixels by using the array of active-matrix light emitting pixels.

Abstract: Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. One of the methods include: forming first color light emitting diodes (LEDs) and respective intermediate metallic layers on a first substrate, integrating the first color LEDs with pixel circuits in a backplane device, injecting laser pulses into particular first color LEDs, such that each particular first color LED is individually separated from the first substrate and locally bonded with a respective pixel circuit through a respective intermediate metallic layer, and removing the first substrate from the backplane device. The backplane device bonded with the particular first color LEDs can be further bonded with other different color LEDs formed on other substrates. Other first color LEDs without exposure of the laser pulses are removed with the first substrate and can be further used to integrate with another backplane device bonded with another color LEDs.

Abstract: Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. One of the methods includes: forming a plurality of light emitting elements on a substrate, each of the light emitting elements including multiple semiconductor layers epitaxially grown on the substrate and being configured to emit light with a single color, integrating the light emitting elements formed on the substrate with a backplane device, such that each of the light emitting elements is bonded and conductively coupled to a respective pixel circuit in the backplane device, and then removing the substrate from the light emitting elements that remain integrated with the backplane device.

Abstract: Integrated active-matrix light emitting pixel arrays based displays are provided. An example integrated device includes a backplane including pixel circuits conductively coupled to an array of light-emitting elements through intermediate conductive layers to form an array of active-matrix light-emitting pixels and a transparent conductive layer on the array of the light-emitting elements. Each of the light-emitting elements includes one or more quantum well semiconductor layers between a first contact electrode and a second contact electrode, and the first contact electrodes of the light-emitting elements is respectively bonded and conductively coupled to the pixel circuits in the backplane via the respective intermediate conductive layers.

Abstract: Methods, systems, and apparatus, including steps of obtaining the source image having a plurality of modules, where a module corresponds to a smallest element that can be encoded in the source image; obtaining input data to be encoded; and encoding the input data in one or more modules of the plurality of modules of the source image. For each respective module of the one or more modules, the encoding includes determining, based on a corresponding value of the input data to be encoded in the respective module, a particular intensity level of multiple intensity levels associated with a particular color, where a number of the multiple intensity levels is greater than two; and encoding the particular color having the particular intensity level in the respective module of the source image.

Abstract: Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. One of the methods include: forming first color light emitting diodes (LEDs) and respective intermediate metallic layers on a first substrate, integrating the first color LEDs with pixel circuits in a backplane device, injecting laser pulses into particular first color LEDs, such that each particular first color LED is individually separated from the first substrate and locally bonded with a respective pixel circuit through a respective intermediate metallic layer, and removing the first substrate from the backplane device. The backplane device bonded with the particular first color LEDs can be further bonded with other different color LEDs formed on other substrates. Other first color LEDs without exposure of the laser pulses are removed with the first substrate and can be further used to integrate with another backplane device bonded with another color LEDs.

Abstract: Integrated laser arrays based devices and systems and methods of forming the integrated laser arrays based devices and systems are provided. In one aspect, an integrated display includes a semiconductor substrate including a first side and a second side, an array of active-matrix light-emitting pixels, each of the pixels including one or more light-emitting elements formed on the first side and at least one non-volatile memory coupled to the one or more light-emitting elements, each of the light-emitting elements including a lasing structure that has an optical resonator and one or more semiconductor layers in the optical resonator and is operable to emit a laser light, one or more integrated circuits formed on the second side, and conductive interconnects penetrating from the second side through the semiconductor substrate and conductively coupling the one or more integrated circuits to the light-emitting elements.

Abstract: Integrated active-matrix light-emitting pixel arrays based devices and methods of forming the integrated pixel arrays based devices are provided. In one aspect, a device includes a semiconductor substrate having a first side and a second side opposite to the first side and an array of active-matrix light-emitting pixels formed on the first side, each of the light-emitting pixels including at least one light-emitting element and at least one non-volatile memory coupled to the at least one light-emitting element. The at least non-volatile memory includes at least one transistor, and the at least one light-emitting element includes multiple layers epitaxially grown on a semiconductor surface of the semiconductor substrate on the first side. The device can further include scanning drivers and data drivers formed on the first side of the semiconductor substrate and coupled to the light-emitting pixels through corresponding word lines and data lines formed on the first side.

Abstract: Integrated active-matrix multi-color light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. An example integrated device includes a backplane device and different color light emitting diodes (LEDs) devices arranged in different height planar layers on the backplane device. The backplane device includes at least one backplane having a number of pixel circuits. Each LED device includes an array of LEDs each operable to emit light with a particular color and conductively coupled to respective pixel circuits in the backplane to form active-matrix LED sub-pixels. The different color LED sub-pixels form an array of active-matrix multi-color display pixels. Plug vias can be arranged in different planar layers to conductively couple upper-level LEDs to respective pixel circuits in respective regions over the backplane device. The plug vias can extend from an upper planar layer into a lower planar layer to fix the two planar layers together.

Abstract: Integrated laser arrays based devices and systems and methods of forming the integrated laser arrays based devices and systems are provided. In one aspect, an integrated display includes a semiconductor substrate including a first side and a second side, an array of active-matrix light-emitting pixels, each of the pixels including one or more light-emitting elements formed on the first side and at least one non-volatile memory coupled to the one or more light-emitting elements, each of the light-emitting elements including a lasing structure that has an optical resonator and one or more semiconductor layers in the optical resonator and is operable to emit a laser light, one or more integrated circuits formed on the second side, and conductive interconnects penetrating from the second side through the semiconductor substrate and conductively coupling the one or more integrated circuits to the light-emitting elements.

Abstract: Integrated light-emitting diode (LED) arrays based devices or systems and methods of forming the integrated LED arrays based devices or systems are provided. In one aspect, an integrated active-matrix LED display includes a silicon substrate including a first side and a second side, an array of active-matrix LED pixels formed on the first side, each LED pixel including at least one LED and at least one non-volatile memory coupled to the at least one LED, display drivers formed on the first side and coupled to the LED pixels, integrated circuits formed on the second side, and conductive electrodes penetrating through the silicon substrate and coupling the display drivers to the integrated circuits. The integrated circuits transmit image/video data to the display drivers via the conductive electrodes, and the display drivers select particular LED pixels and control the particular LED pixels to emit light based on the image/video data.

Abstract: Integrated active-matrix light-emitting pixel arrays based devices and methods of forming the integrated pixel arrays based devices are provided. In one aspect, a device includes a semiconductor substrate having a first side and a second side opposite to the first side and an array of active-matrix light-emitting pixels formed on the first side, each of the light-emitting pixels including at least one light-emitting element and at least one non-volatile memory coupled to the at least one light-emitting element. The at least non-volatile memory includes at least one transistor, and the at least one light-emitting element includes multiple layers epitaxially grown on a semiconductor surface of the semiconductor substrate on the first side. The device can further include scanning drivers and data drivers formed on the first side of the semiconductor substrate and coupled to the light-emitting pixels through corresponding word lines and data lines formed on the first side.

Abstract: Integrated active-matrix light emitting pixel arrays based displays are provided. An example integrated device includes a backplane including pixel circuits conductively coupled to an array of light-emitting elements through intermediate conductive layers to form an array of active-matrix light-emitting pixels and a transparent conductive layer on the array of the light-emitting elements. Each of the light-emitting elements includes one or more quantum well semiconductor layers between a first contact electrode and a second contact electrode, and the first contact electrodes of the light-emitting elements is respectively bonded and conductively coupled to the pixel circuits in the backplane via the respective intermediate conductive layers.

Abstract: Integrated active-matrix multi-color light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. An example integrated device includes a backplane device and different color light emitting diodes (LEDs) devices arranged in different height planar layers on the backplane device. The backplane device includes at least one backplane having a number of pixel circuits. Each LED device includes an array of LEDs each operable to emit light with a particular color and conductively coupled to respective pixel circuits in the backplane to form active-matrix LED sub-pixels. The different color LED sub-pixels form an array of active-matrix multi-color display pixels. Plug vias can be arranged in different planar layers to conductively couple upper-level LEDs to respective pixel circuits in respective regions over the backplane device. The plug vias can extend from an upper planar layer into a lower planar layer to fix the two planar layers together.

Abstract: Larger displays formed by multiple sub-displays, e.g., integrated light-emitting diode (LED) pixel array micro-displays, and methods of operating and making the larger displays are provided. An example larger display includes a plurality of sub-displays arranged on a display substrate. Each sub-display includes an array of light-emitting pixels formed on a first side of a substrate, each pixel including at least one light-emitting element, integrated circuits formed on a second side of the substrate, conductive electrodes penetrating through the substrate and coupling the array of light-emitting pixels to the integrated circuits, and a conductive grid array package, e.g., a ball grid array (BGA) package, formed on the second side of the substrate and conductively coupled to the integrated circuits. Interconnects are conductively coupled to the conductive grid array packages of the plurality of sub-displays to form the larger display.

Abstract: Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. An example method includes: forming multiple layers on a first substrate to form a light emitting structure, integrating the light emitting structure on the first substrate with a backplane device on a second substrate by connecting a first top layer of the light emitting structure with a second top layer of the backplane device, e.g., by using low temperature bonding, the backplane device including at least one backplane having pixel circuits, and after the integration, patterning the light emitting structure to form an array of light emitting elements each conductively coupled to respective pixel circuits to thereby form an array of active-matrix light emitting pixels. A pattern of different color phosphor or different size quantum dots materials can be deposited on the light emitting pixels to form an array of multi-color display pixels.