Patents by Inventor Sheng-Yen Wu

Sheng-Yen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927392
    Abstract: The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang
  • Publication number: 20240017525
    Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 20 phr to 40 phr of an epoxy resin, 40 phr to 60 phr of a modified benzoxazine resin, 2 phr to 10 phr of a maleimide resin, and 25 phr to 50 phr of fillers. The modified benzoxazine resin contains a DOPO group. Based on a total weight of the modified benzoxazine resin being 100 wt %, an amount of the DOPO group ranges from 10 wt % to 20 wt %.
    Type: Application
    Filed: December 25, 2022
    Publication date: January 18, 2024
    Inventors: SHENG-YEN WU, KAI-YANG CHEN, MENG-HAN YEH, LI-CHUNG LU
  • Publication number: 20240002653
    Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 5 phr to 15 phr of a maleimide resin, 5 phr to 30 phr of a benzoxazine resin, 40 phr to 70 phr of an epoxy resin, and 40 phr to 60 phr of fillers. An amount of fluorine atoms contained in the maleimide resin ranges from 10 wt % to 50 wt %.
    Type: Application
    Filed: May 8, 2023
    Publication date: January 4, 2024
    Inventors: SHENG-YEN WU, SHOU-NENG TO, YA-PING LIU, CHEN-HAO CHANG, PEI-CHUN LAI
  • Publication number: 20230348708
    Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a polybenzoxazine compound, an anhydride grafted olefin polymer, and a diisocyanate compound; and (B) a thermosetting polymer; wherein, in the toughened and modified compound, the diisocyanate compound forms a bond with the polybenzoxazine compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace, and the like.
    Type: Application
    Filed: December 6, 2022
    Publication date: November 2, 2023
    Inventors: Sheng-Yen WU, Tzu-Fang CHEN, Po-Kai TSENG, Yu-Chieh HSU, Te-Chieh LI, Shao-Wei YU
  • Publication number: 20230348673
    Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.
    Type: Application
    Filed: October 12, 2022
    Publication date: November 2, 2023
    Inventors: Sheng-Yen WU, Po-Hsun LEE, Chun-Ming CHIU, Wen-Pin SU, Jui-Teng HSU, Chen-Yu HUANG, Chun-Han LIN
  • Patent number: 11744330
    Abstract: A composite cleat includes a first component and a second component. The first component is made of a first material and is formed a first connecting portion extended along a longitudinal axis and a ground contact surface disposed at one end thereof. The second component is made of a second material different from the first material and is formed a second connecting portion fixedly connected with the first connecting portion and a threaded stud disposed at one end thereof.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: September 5, 2023
    Assignee: COMPLAM MATERIAL CO., LTD.
    Inventors: Chia Yang Lu, Sheng Yen Wu, Yi Wen Xiao
  • Patent number: 11691354
    Abstract: A manufacturing method of a halogen-free flame-retardant thermoplastic braided fiber reinforced polymer composite board, comprising steps of: preparing a recycled material containing a halogen-free flame-retardant thermoplastic braided fiber reinforced polymer composite; adding a polymer base material to the recycled material to form a core layer material and extruding the core layer material with a low shear extruder; hot pressing the core layer material by rollers to obtain a recycled fiber core layer; preparing a reinforcement layer containing a fiber material or a fabric with pores; and stacking and hot pressing the recycled fiber core layer and the reinforcement layer.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: July 4, 2023
    Assignee: COMPLAM MATERIAL CO., LTD.
    Inventors: Chia yang Lu, Sheng Yen Wu, Yi Wen Xiao
  • Publication number: 20220218072
    Abstract: A composite cleat includes a first component and a second component. The first component is made of a first material and is formed a first connecting portion extended along a longitudinal axis and a ground contact surface disposed at one end thereof. The second component is made of a second material different from the first material and is formed a second connecting portion fixedly connected with the first connecting portion and a threaded stud disposed at one end thereof.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 14, 2022
    Inventors: Chia Yang Lu, Sheng Yen Wu, Yi Wen Xiao
  • Publication number: 20220203631
    Abstract: A manufacturing method of a halogen-free flame-retardant thermoplastic braided fiber reinforced polymer composite board, comprising steps of: preparing a recycled material containing a halogen-free flame-retardant thermoplastic braided fiber reinforced polymer composite; adding a polymer base material to the recycled material to form a core layer material and extruding the core layer material with a low shear extruder; hot pressing the core layer material by rollers to obtain a recycled fiber core layer; preparing a reinforcement layer containing a fiber material or a fabric with pores; and stacking and hot pressing the recycled fiber core layer and the reinforcement layer.
    Type: Application
    Filed: August 27, 2021
    Publication date: June 30, 2022
    Inventors: Chia Yang Lu, Sheng Yen Wu, Yi Wen Xiao
  • Publication number: 20180142073
    Abstract: A biodecomposable film material includes: a biodecomposable material which is one or more selected from the group consisting of polylactic acid, poly(butylene adipate-co-terephthalate) and poly butylene succinate and which has a mass percentage of 60-70%; a food grade agricultural waste having a diameter smaller than 50 ?m and a mass percentage of 10-30%; a modifier which is calcium carbonate powder or magnesium silicate salt powder and which has a diameter smaller than 8 ?m and a mass percentage of 7-29%; and an organic decomposing bacterium which is Bacillus amyloliquefaciens. The organic decomposing bacterium is heat resistant bacillus capable of withstanding a temperature of 100° C. and has a mass percentage of 1-3%. The biodecomposable material, the food grade agricultural waste, the modifier, and the organic decomposing bacterium are subjected to compounding and blowing to form a film having a thickness of 40-60 ?m.
    Type: Application
    Filed: November 23, 2017
    Publication date: May 24, 2018
    Inventors: Sheng-Yen Wu, Feng-Chia Hsieh, Yuan-Fu Jhong, Yao-Kuei Hsiao
  • Patent number: 8722758
    Abstract: The present invention relates to a novel water soluble polyimide resin, which contains a hydrophilic functional group such as —OH, —COOH to increase the solubility of the polyimide resin in alkali aqueous solution, and is suitable for using as an insulation film in electronic and photoelectric products. The present invention also relates to preparation and use of the above polyimide.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: May 13, 2014
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, An Pang Tu, Sheng Yen Wu, Gai Chi Chen, Ching Jui Huang, Jen Fu Wang
  • Patent number: 8367161
    Abstract: A method of preparing carbon nanotube/polymer composite having electromagnetic interference (EMI) shielding effectiveness is disclosed, which includes: dispersing multi-walled carbon nanotubes (MWCNT) in an organic solvent such as N,N-Dimethylacetamide (DMAc); dissolving monomers such as methyl methacrylate (MMA) and an initiator such as 2,2-azobisisobutyronitrile (AIBN) in the MWCNT dispersion; and polymerizing the monomers in the resulting mixture at an elevated temperature such as 120° C. to form a MWCNT/PMMA composite. The composite is coated onto a PET film, and the coated PET film alone or a stack of multiple coated PET films can be applied as an EMI shielding material.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: February 5, 2013
    Assignee: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Siu-Ming Yuen, Chia-Yi Chuang, Kuo-Chi Yu, Sheng Yen Wu
  • Patent number: 8084512
    Abstract: The present invention relates to a water soluble photosensitive polyimide polymer, preparation thereof and a photoresist composition containing the same. The water soluble photosensitive polyimide polymer is characterized by having repeat units represented by the following formula (I): the other symbols are defined in the specification].
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: December 27, 2011
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Jen Fu Wang, Sheng Yen Wu, An Pang Tu, Kuen Yuan Hwang
  • Publication number: 20110200740
    Abstract: A method of preparing carbon nanotube/polymer composite having electromagnetic interference (EMI) shielding effectiveness is disclosed, which includes: dispersing multi-walled carbon nanotubes (MWCNT) in an organic solvent such as N,N-Dimethylacetamide (DMAc); dissolving monomers such as methyl methacrylate (MMA) and an initiator such as 2,2-azobisisobutyronitrile (AIBN) in the MWCNT dispersion; and polymerizing the monomers in the resulting mixture at an elevated temperature such as 120° C. to form a MWCNT/PMMA composite. The composite is coated onto a PET film, and the coated PET film alone or a stack of multiple coated PET films can be applied as an EMI shielding material.
    Type: Application
    Filed: April 26, 2011
    Publication date: August 18, 2011
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Martin MA, Siu-Ming Yuen, Chia-Yi Chuang, Kuo-Chi Yu, Sheng Yen Wu
  • Publication number: 20110172324
    Abstract: The present invention relates to a novel water soluble polyimide resin, which contains a hydrophilic functional group such as —OH, —COOH to increase the solubility of the polyimide resin in alkali aqueous solution, and is suitable for using as an insulation film in electronic and photoelectric products. The present invention also relates to preparation and use of the above polyimide.
    Type: Application
    Filed: January 12, 2011
    Publication date: July 14, 2011
    Inventors: Kuen Yuan HWANG, An Pang Tu, Sheng Yen Wu, Gai Chi Chen, Ching Jui Huang, Jen Fu Wang
  • Patent number: 7955654
    Abstract: A method of preparing carbon nanotube/polymer composite having electromagnetic interference (EMI) shielding effectiveness is disclosed, which includes: dispersing multi-walled carbon nanotubes (MWCNT) in an organic solvent such as N,N-Dimethylacetamide (DMAc); dissolving monomers such as methyl methacrylate (MMA) and an initiator such as 2,2-azobisisobutyronitrile (AIBN) in the MWCNT dispersion; and polymerizing the monomers in the resulting mixture at an elevated temperature such as 120° C. to form a MWCNT/PMMA composite. The composite is coated onto a PET film, and the coated PET film alone or a stack of multiple coated PET films can be applied as an EMI shielding material.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: June 7, 2011
    Assignee: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Siu-Ming Yuen, Chia-Yi Chuang, Kuo-Chi Yu, Sheng Yen Wu
  • Patent number: 7816437
    Abstract: A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: October 19, 2010
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, An Pang Tu, Sheng Yen Wu
  • Publication number: 20100167208
    Abstract: The present invention relates to a water soluble photosensitive polyimide polymer, preparation thereof and a photoresist composition containing the same. The water soluble photosensitive polyimide polymer is characterized by having repeat units represented by the following formula (I): the other symbols are defined in the specification].
    Type: Application
    Filed: April 10, 2009
    Publication date: July 1, 2010
    Inventors: Jen FU WANG, Sheng Yen Wu, An Pang Tu, Kuen Yuan Hwang
  • Publication number: 20100136327
    Abstract: The present invention provides a modified carbon nanotube having —C(O)—R? or —C(O)—R—COOH covalently bounded to a surface of carbon nanotube, wherein R? is C1-C26 alkyl or C2-C26 alkenyl, and R is C1-C26 alkylene or C2-C26 alkenylene. The present invention also discloses a carbon nanotubes/polymer composite having electromagnetic interference shielding effectiveness, which contains 0.1-10% of modified carbon nanotubes, based on the weight of the polymer. The present invention further provides methods for preparing the modified carbon nanotubes and the composite.
    Type: Application
    Filed: December 17, 2009
    Publication date: June 3, 2010
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Siu-Ming Yuen, Chia-Yi Chuang, Kuo-Chi Yu, Sheng Yen Wu
  • Patent number: 7566757
    Abstract: The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: July 28, 2009
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, An Pang Tu, Sheng Yen Wu, Yu Lin Huang