Patents by Inventor Shengqian Kong

Shengqian Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10392543
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 27, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Publication number: 20190169478
    Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.
    Type: Application
    Filed: June 5, 2018
    Publication date: June 6, 2019
    Inventors: Shengqian KONG, Yayun LIU, Wenhua ZHANG, Stephen HYNES, John G. WOODS, Jiangbo OUYANG, Chunyu SUN, Bahram ISSARI
  • Patent number: 10280349
    Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: May 7, 2019
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram Issari, Shengqian Kong, Yayun Liu, Wenhua Zhang
  • Publication number: 20190071593
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 7, 2019
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Patent number: 9850409
    Abstract: A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: December 26, 2017
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Wenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang, Chunyu Sun
  • Publication number: 20170081574
    Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
    Type: Application
    Filed: December 7, 2016
    Publication date: March 23, 2017
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram lssari, Shengqian Kong, Yayun Liu, Wenhua Zhang
  • Patent number: 9556313
    Abstract: This invention is a vinylcarbosiloxane resin that is the hydrosilation reaction product of 1,3,5,7 -tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and a hydride-terminated linear polysiloxane, siloxane, or silane, having two terminal Si—H hydrogens reactive with vinyl groups in a hydrosilation reaction, in the presence of a platinum catalyst. Suitable hydride-terminated linear polysiloxanes, siloxances, and silanes include those having the structures: In another embodiment, the vinylcarbosiloxane resin can be reacted with one or more other hydrido-silanes and hydrido-polysiloxanes in the presence of a platinum catalyst to form a curable composition.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: January 31, 2017
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Shengqian Kong, Liwei Zhang, Yong Zhang, Wentao Thomas Xing, Daniel J. Duffy
  • Publication number: 20160068720
    Abstract: A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetra-siloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator. In further embodiments, this invention is an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition is disposed between the substrates, and a method for fabricating that assembly. The debondable adhesive composition maintains its adhesion at temperatures of 300° C. or greater, and is mechanically debondable at room temperature at a force less than 5N/25 mm.
    Type: Application
    Filed: November 13, 2015
    Publication date: March 10, 2016
    Inventors: Wenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang, Chunyu Sun
  • Publication number: 20150087791
    Abstract: This invention is a vinylcarbosiloxane resin that is the hydrosilation reaction product of 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and a hydride-terminated linear polysiloxane, siloxane, or silane, having two terminal Si—H hydrogens reactive with vinyl groups in a hydrosilation reaction, in the presence of a platinum catalyst. Suitable hydride-terminated linear polysiloxanes, siloxances, and silanes include those having the structures: In another embodiment, the vinylcarbosiloxane resin can be reacted with one or more other hydrido-silanes and hydrido-polysiloxanes in the presence of a platinum catalyst to form a curable composition.
    Type: Application
    Filed: December 8, 2014
    Publication date: March 26, 2015
    Inventors: Shengqian Kong, Liwei Zhang, Yong Zhang, Wentao Thomas Xing, Daniel J. Duffy
  • Patent number: 8921443
    Abstract: A radiation curable temporary laminating adhesive composition for use in temperature applications at 150° C. or greater, and typically at 200° C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: December 30, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Donald E. Herr, Shengqian Kong, Sharon Chaplinsky, Allison Yue Xiao
  • Publication number: 20140264165
    Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Puwei Liu, Donghang Xie, Emilie Barriau, Shengqian Kong
  • Publication number: 20140209951
    Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicants: HENKEL IP & HOLDING GMBH, HENKEL AG & CO. KGAA
    Inventors: Shengqian Kong, Puwei Liu, Stijn Gillissen, Donghang Xie, Lirong Bao, Daniel J. Duffy, Allison Yue Xiao, Emilie Barriau
  • Patent number: 8791033
    Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: July 29, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Jeffrey Gasa, Dung Nghi Phan, Jeffrey Leon, Sharad Hajela, Shengqian Kong
  • Publication number: 20140011904
    Abstract: A radiation curable temporary laminating adhesive composition for use in temperature applications at 150° C. or greater, and typically at 200° C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 9, 2014
    Applicant: Henkel Corporation
    Inventors: Donald E. Herr, Shengqian Kong, Sharon Chaplinsky, Allison Yue Xiao
  • Patent number: 8278401
    Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: October 2, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Shengqian Kong, Sarah E. Grieshaber
  • Patent number: 7902305
    Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: March 8, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventor: Shengqian Kong
  • Patent number: 7887716
    Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: February 15, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventors: Shengqian Kong, Stijn Gillissen
  • Publication number: 20100168279
    Abstract: This invention is a barrier composition comprising a resin or resin/filler system that is capable of being cured at low temperature while still maintaining superior barrier performance. This composition comprises (a) an aromatic compound having meta-substituted epoxy functionalities; (b) a multifunctional aliphatic amine; (c) optionally, one or more fillers; (d) optionally one or more adhesion promoters; (c) optionally, a phenolic cure accelerator.
    Type: Application
    Filed: March 30, 2006
    Publication date: July 1, 2010
    Inventors: Shengqian Kong, Sarah E. Grieshaber, Donald E. Herr
  • Publication number: 20100164368
    Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.
    Type: Application
    Filed: March 29, 2006
    Publication date: July 1, 2010
    Applicant: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CO
    Inventors: Shengqian Kong, Sarah E. Grieshaber
  • Publication number: 20080296159
    Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.
    Type: Application
    Filed: July 25, 2008
    Publication date: December 4, 2008
    Applicant: Henkel Corporation
    Inventors: Shengqian Kong, Stijn Gillissen