Patents by Inventor Shengqian Kong
Shengqian Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220064352Abstract: The present invention provides high temperature performing, conductive thermosetting resin compositions.Type: ApplicationFiled: December 30, 2019Publication date: March 3, 2022Inventor: Stanley Shengqian KONG
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Publication number: 20210371620Abstract: Disclosed herein are thermal interface materials based on two-part polyurethane resins comprising a polyurethane resin and a thermally conductive filler dispersed throughout the polyurethane resin, wherein the polyurethane resin is formed from two parts comprising: a first part comprising a triol, and a second part comprising an isocyanate-functionalized component, wherein at least one of the first part and the second part comprises a thermally conductive filler material.Type: ApplicationFiled: August 13, 2021Publication date: December 2, 2021Inventors: Stanley Shengqian Kong, Valerie Alexis, Maria Cristina Barbosa Dejesus, Claudia Meckel-Jonas, Elizabeth Jackson, Chunyong Wu
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Patent number: 10392543Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.Type: GrantFiled: November 2, 2018Date of Patent: August 27, 2019Assignee: Henkel IP & Holding GmbHInventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
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Publication number: 20190169478Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.Type: ApplicationFiled: June 5, 2018Publication date: June 6, 2019Inventors: Shengqian KONG, Yayun LIU, Wenhua ZHANG, Stephen HYNES, John G. WOODS, Jiangbo OUYANG, Chunyu SUN, Bahram ISSARI
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Patent number: 10280349Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.Type: GrantFiled: December 7, 2016Date of Patent: May 7, 2019Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbHInventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram Issari, Shengqian Kong, Yayun Liu, Wenhua Zhang
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Publication number: 20190071593Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.Type: ApplicationFiled: November 2, 2018Publication date: March 7, 2019Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
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Patent number: 9850409Abstract: A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.Type: GrantFiled: November 13, 2015Date of Patent: December 26, 2017Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbHInventors: Wenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang, Chunyu Sun
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Publication number: 20170081574Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.Type: ApplicationFiled: December 7, 2016Publication date: March 23, 2017Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram lssari, Shengqian Kong, Yayun Liu, Wenhua Zhang
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Patent number: 9556313Abstract: This invention is a vinylcarbosiloxane resin that is the hydrosilation reaction product of 1,3,5,7 -tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and a hydride-terminated linear polysiloxane, siloxane, or silane, having two terminal Si—H hydrogens reactive with vinyl groups in a hydrosilation reaction, in the presence of a platinum catalyst. Suitable hydride-terminated linear polysiloxanes, siloxances, and silanes include those having the structures: In another embodiment, the vinylcarbosiloxane resin can be reacted with one or more other hydrido-silanes and hydrido-polysiloxanes in the presence of a platinum catalyst to form a curable composition.Type: GrantFiled: December 8, 2014Date of Patent: January 31, 2017Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbHInventors: Shengqian Kong, Liwei Zhang, Yong Zhang, Wentao Thomas Xing, Daniel J. Duffy
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Publication number: 20160068720Abstract: A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetra-siloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator. In further embodiments, this invention is an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition is disposed between the substrates, and a method for fabricating that assembly. The debondable adhesive composition maintains its adhesion at temperatures of 300° C. or greater, and is mechanically debondable at room temperature at a force less than 5N/25 mm.Type: ApplicationFiled: November 13, 2015Publication date: March 10, 2016Inventors: Wenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang, Chunyu Sun
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Publication number: 20150087791Abstract: This invention is a vinylcarbosiloxane resin that is the hydrosilation reaction product of 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and a hydride-terminated linear polysiloxane, siloxane, or silane, having two terminal Si—H hydrogens reactive with vinyl groups in a hydrosilation reaction, in the presence of a platinum catalyst. Suitable hydride-terminated linear polysiloxanes, siloxances, and silanes include those having the structures: In another embodiment, the vinylcarbosiloxane resin can be reacted with one or more other hydrido-silanes and hydrido-polysiloxanes in the presence of a platinum catalyst to form a curable composition.Type: ApplicationFiled: December 8, 2014Publication date: March 26, 2015Inventors: Shengqian Kong, Liwei Zhang, Yong Zhang, Wentao Thomas Xing, Daniel J. Duffy
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Patent number: 8921443Abstract: A radiation curable temporary laminating adhesive composition for use in temperature applications at 150° C. or greater, and typically at 200° C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.Type: GrantFiled: September 14, 2012Date of Patent: December 30, 2014Assignee: Henkel IP & Holding GmbHInventors: Donald E. Herr, Shengqian Kong, Sharon Chaplinsky, Allison Yue Xiao
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Publication number: 20140264165Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: Henkel CorporationInventors: Puwei Liu, Donghang Xie, Emilie Barriau, Shengqian Kong
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Publication number: 20140209951Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.Type: ApplicationFiled: March 28, 2014Publication date: July 31, 2014Applicants: HENKEL IP & HOLDING GMBH, HENKEL AG & CO. KGAAInventors: Shengqian Kong, Puwei Liu, Stijn Gillissen, Donghang Xie, Lirong Bao, Daniel J. Duffy, Allison Yue Xiao, Emilie Barriau
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Patent number: 8791033Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.Type: GrantFiled: December 7, 2012Date of Patent: July 29, 2014Assignee: Henkel IP & Holding GmbHInventors: Jeffrey Gasa, Dung Nghi Phan, Jeffrey Leon, Sharad Hajela, Shengqian Kong
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Publication number: 20140011904Abstract: A radiation curable temporary laminating adhesive composition for use in temperature applications at 150° C. or greater, and typically at 200° C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.Type: ApplicationFiled: September 14, 2012Publication date: January 9, 2014Applicant: Henkel CorporationInventors: Donald E. Herr, Shengqian Kong, Sharon Chaplinsky, Allison Yue Xiao
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Patent number: 8278401Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.Type: GrantFiled: March 29, 2006Date of Patent: October 2, 2012Assignee: Henkel AG & Co. KGaAInventors: Shengqian Kong, Sarah E. Grieshaber
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Patent number: 7902305Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator.Type: GrantFiled: June 26, 2008Date of Patent: March 8, 2011Assignee: Henkel AG & Co. KGaAInventor: Shengqian Kong
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Patent number: 7887716Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.Type: GrantFiled: July 25, 2008Date of Patent: February 15, 2011Assignee: Henkel AG & Co. KGaAInventors: Shengqian Kong, Stijn Gillissen
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Publication number: 20100164368Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.Type: ApplicationFiled: March 29, 2006Publication date: July 1, 2010Applicant: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING COInventors: Shengqian Kong, Sarah E. Grieshaber