Patents by Inventor Shigekatsu Ohnishi

Shigekatsu Ohnishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive paste
    Patent number: 10984921
    Abstract: Provided is a conductive paste which makes it possible to form a conductive layer having excellent conductivity even when spherical copper powder having a small particle diameter is used. Disclosed is a conductive paste containing a conductive filler and a binder resin.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: April 20, 2021
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masahiro Ishii, Akira Nakasuga, Shoji Nozato, Shigekatsu Ohnishi
  • Conductive filler, method for manufacturing conductive filler, and conductive paste
    Patent number: 10639713
    Abstract: There is provided conductive paste excellent in electro-conductivity and thermal conductivity. Conductive paste comprising conductive filler being composite particles including copper powder and nanosize precipitates which are disposed on the surface of the copper powder and composed of at least one kind of transition metal belonging to the group 8 to group 10 of the periodic table or a compound of the transition metal, and a binder resin.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: May 5, 2020
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventor: Shigekatsu Ohnishi
  • CONDUCTIVE PASTE
    Publication number: 20200118702
    Abstract: Provided is a conductive paste which makes it possible to form a conductive layer having excellent conductivity even when spherical copper powder having a small particle diameter is used. Disclosed is a conductive paste containing a conductive filler and a binder resin.
    Type: Application
    Filed: June 28, 2018
    Publication date: April 16, 2020
    Inventors: Masahiro Ishii, Akira Nakasuga, Shoji Nozato, Shigekatsu Ohnishi
  • Conductive filler, method for producing same, conductive paste and method for producing conductive paste
    Patent number: 10533098
    Abstract: A conductive paste having excellent electroconductivity and thermal conductivity is provided. A conductive paste comprising a conductive filler comprising a copper alloy powder comprising at least one transition metal belonging to group 8 to group 10 of the periodic table, and a carbon allotrope covering a surface of the copper alloy powder; and a binder resin.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: January 14, 2020
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventor: Shigekatsu Ohnishi
  • CONDUCTIVE FILLER, METHOD FOR MANUFACTURING CONDUCTIVE FILLER, AND CONDUCTIVE PASTE
    Publication number: 20170216914
    Abstract: There is provided conductive paste excellent in electro-conductivity and thermal conductivity. Conductive paste comprising conductive filler being composite particles including copper powder and nanosize precipitates which are disposed on the surface of the copper powder and composed of at least one kind of transition metal belonging to the group 8 to group 10 of the periodic table or a compound of the transition metal, and a binder resin.
    Type: Application
    Filed: March 3, 2015
    Publication date: August 3, 2017
    Inventor: Shigekatsu Ohnishi
  • CONDUCTIVE FILLER, METHOD FOR PRODUCING SAME, CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PASTE
    Publication number: 20160168395
    Abstract: A conductive paste having excellent electroconductivity and thermal conductivity is provided. A conductive paste comprising a conductive filler comprising a copper alloy powder comprising at least one transition metal belonging to group 8 to group 10 of the periodic table, and a carbon allotrope covering a surface of the copper alloy powder; and a binder resin.
    Type: Application
    Filed: July 29, 2014
    Publication date: June 16, 2016
    Inventor: Shigekatsu Ohnishi
  • Solid electrolytic capacitor
    Patent number: 7023689
    Abstract: A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: April 4, 2006
    Assignees: Sanyo Electric Co., Ltd., Saga Sanyo Industries Co., Ltd., Taiyo Ink Mfg. Co., Ltd.
    Inventors: Takayuki Matsumoto, Tetsuyuki Sakuda, Nobuhiro Honda, Shigekatsu Ohnishi, Naoyuki Shiozawa, Hideaki Kojima
  • Solid electrolytic capacitor
    Publication number: 20050254198
    Abstract: A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.
    Type: Application
    Filed: October 27, 2004
    Publication date: November 17, 2005
    Applicants: SANYO ELECTRIC CO., LTD., SAGA SANYO INDUSTRIES CO., LTD., TAIYO INK MFG. CO., LTD.
    Inventors: Takayuki Matsumoto, Tetsuyuki Sakuda, Nobuhiro Honda, Shigekatsu Ohnishi, Naoyuki Shiozawa, Hideaki Kojima