Abstract: A laminated sheet includes a first porous layer including a plurality of fibers of at least one of inorganic fiber or carbonized fiber; and a second porous layer formed of a plurality of organic fibers, wherein the laminated sheet has a surface density of greater than or equal to 400 g/m2 and less than or equal to 1550 g/m2, wherein the second porous layer is formed of the plurality of organic fibers having a mean diameter of fibers being greater than or equal to 0.5 ?m and less than or equal to 14 ?m, and wherein, expressing a total volume of solids and voids filling a unit volume of the second porous layer as 100%, a percentage of the solids is greater than or equal to 1.0% and less than or equal to 8.0%.

Abstract: Proposed is an improvement in a method for the preparation of an enriched and purified aqueous hydrogen peroxide solution from a crude aqueous hydrogen peroxide solution comprising the steps of evaporating the crude aqueous hydrogen peroxide solution in an evaporator into vapor with accompanying liquid in the form of a mist, separating the vapor from the mist of liquid in a gas-liquid separator and subjecting the vapor to fractionating distillation in a fractionating distillation column in order to greatly upgrade the product solution relative to the impurity content.

Abstract: The peeling solution for photo- or electron beam-sensitive resin according to the present invention consists of an aqueous solution comprising hydrogen peroxide and a compound represented by the general formula (I) ##STR1## wherein R.sub.1 is H or an alkyl group of 1-2 carbon atoms, R.sub.2 is H or an alkyl group of 1-3 carbon atoms, and R.sub.3 is H or an alkyl group of 1-3 carbon atoms.The process for peeling off a photo- or electron beam-sensitive resin according to the present invention comprises a step of treating a photo- or electron beam-sensitive resin-coated substrate with a peeling solution for photo- or electron beam-sensitive resin cnsisting of an aqueous solution comprising hydrogen peroxide and a compound represented by the above general formula (I).

Abstract: The peeling solution for photo- or electron beam-sensitive resin according to the present invention consists of an aqueous solution consisting of hydrogen peroxide and a compound represented by the general formula (I) ##STR1## wherein R.sub.1 is H or an alkyl group of 1-2 carbon atoms, R.sub.2 is H or an alkyl group of 1-3 carbon atoms, and R.sub.3 is H or an alkyl group of 1-3 carbon atoms.

Abstract: A method for purifying an impure aqueous hydrogen peroxide solution, which comprises passing an impure aqueous hydrogen peroxide solution through(a) a cation exchange resin layer, a halogen-containing porous resin layer and an anion exchange resin layer in this order, or(b) a halogen-containing porous resin layer, a cation exchange resin layer and an anion exchange resin layer in this order, or(c) a halogen-containing porous resin layer and a cation/anion mixed-bed resin layer in this order to contact said solution with each resin.