Patents by Inventor Shigeki Yamane

Shigeki Yamane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11104282
    Abstract: A circuit assembly where the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed, the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board, the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and the heat dissipation plate is overlaid so as to transfer heat on the circuit board on the second surface of the circuit board.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: August 31, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuya Ota, Shigeki Yamane, Hirotoshi Maeda, Toshiyuki Tsuchida, Junya Aichi
  • Patent number: 11081869
    Abstract: An electrical junction box includes: a circuit board to which an electronic component is connected; and a frame positioned with respect to the circuit board. The frame integrally includes a sub frame that surrounds at least part of a periphery of the electronic component. The sub frame is provided with a holding portion that holds the electronic component in the holding portion.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: August 3, 2021
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Xiaoguang Zheng
  • Publication number: 20210212192
    Abstract: A circuit device 1 includes a circuit board, an inductor mounted on the circuit board, and a heat dissipation member to which the circuit board and the inductor are assembled. The inductor includes a case main body, and mounting pieces extending from the case main body in parallel with the circuit board. A heat dissipation member includes a main plate portion disposed along a heat dissipation surface on the opposite side of a mounting surface on which the inductor is mounted in the circuit board, and support post portions extending from the main plate portion and penetrating the circuit board and the mounting pieces . The circuit board and the mounting pieces are fixed to the support post portions by an adhesive.
    Type: Application
    Filed: May 17, 2019
    Publication date: July 8, 2021
    Inventors: Shigeki Yamane, Toshiyuki Tsuchida
  • Patent number: 10893611
    Abstract: A circuit assembly includes: a substrate with an electrically conducting path; plate-shaped busbars that have connection portions connected to the electrically conducting path of the substrate, and are arranged in an orientation in which plate surfaces thereof intersects with a surface of the substrate; a heat discharge member that is laid on a side of the substrate opposite to the busbars, and is configured to discharge heat of the substrate; and a resin frame that extends along the busbars, and holds the busbars while being in intimate contact with the busbars, wherein the frame includes mounting portions mounted on at least either the substrate or the heat discharge member.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: January 12, 2021
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane
  • Publication number: 20200411231
    Abstract: An inductor includes: a magnetic core; a conduction path penetrating the magnetic core; a pedestal portion including a core holding portion that holds the magnetic core, and support portions that support, when placed on a circuit board, electronic components at a height at which the electronic components can be accommodated on the circuit board side with respect to the core holding portion; and a shield portion that is provided on the circuit board side with respect to the magnetic core, and that shields a magnetic field generated by flow of electricity in the conduction path.
    Type: Application
    Filed: January 25, 2019
    Publication date: December 31, 2020
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Junya Aichi
  • Publication number: 20200308700
    Abstract: A film-forming device which includes a chamber having a horizontal central axis, capable of maintaining a vacuum, and movable along the horizontal central axis, the chamber including an inner chamber and an outer chamber that houses the inner chamber; a workpiece holder that aligns and holds workpieces to be processed in multiple stages in the inner chamber; and a heater that heats an inside of the chamber.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Inventors: Yasuhiro Chikaishi, Shigeki Yamane
  • Publication number: 20200308701
    Abstract: A film-forming device that includes a cylindrical chamber capable of maintaining vacuum therein, a workpiece holder that is constructed to align and hold workpieces to be processed in multiple stages such that main surfaces of the workpieces are oriented in a vertical direction relative to a central axis of the chamber, a deposition material supply pipe, a modifier supply pipe, a carrier gas supply pipe, and an exhaust mechanism, wherein in a cross section of the chamber in a direction parallel to the main surfaces of the workpieces, the exhaust mechanism is located on a side opposite to an opening direction of gas outlets of the deposition, modifier, and carrier gas supply pipes, and a total gas flow from the deposition, modifier, and carrier gas supply pipes is symmetric about a centerline of the chamber.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Inventors: Yasuhiro Chikaishi, Shigeki Yamane
  • Patent number: 10777346
    Abstract: A circuit assembly includes: a circuit board; an inductor that is disposed on the circuit board, and that includes a coil including a winding portion made by winding a winding wire, and a core member; and a heat dissipation plate that is disposed on the opposite side of the surface of the circuit board on which the inductor is disposed, wherein a through hole is provided in a region of the circuit board that corresponds to the inductor, and a receiving protrusion that penetrates the through hole and protrudes to a surface side of the circuit board on which the inductor is disposed, and that is in heat transfer contact with the coil and the core member is provided in a region that corresponds to the through hole in the heat dissipation plate.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: September 15, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane
  • Publication number: 20200194159
    Abstract: A coil device includes a coil unit that includes a coil and a magnetic core, a case that is made of resin and that houses the coil unit, and a bus bar that includes a connection portion that can be connected to a conductive path of a circuit board, and that is held in close contact with the case. The case includes a mounting portion that can be mounted on a face of the circuit board.
    Type: Application
    Filed: May 9, 2018
    Publication date: June 18, 2020
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane
  • Publication number: 20200194160
    Abstract: A circuit assembly includes: a circuit board; an inductor that is disposed on the circuit board, and that includes a coil including a winding portion made by winding a winding wire, and a core member; and a heat dissipation plate that is disposed on the opposite side of the surface of the circuit board on which the inductor is disposed, wherein a through hole is provided in a region of the circuit board that corresponds to the inductor, and a receiving protrusion that penetrates the through hole and protrudes to a surface side of the circuit board on which the inductor is disposed, and that is in heat transfer contact with the coil and the core member is provided in a region that corresponds to the through hole in the heat dissipation plate.
    Type: Application
    Filed: May 9, 2018
    Publication date: June 18, 2020
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane
  • Publication number: 20200194984
    Abstract: An electrical junction box includes: a circuit board to which an electronic component is connected; and a frame positioned with respect to the circuit board. The frame integrally includes a sub frame that surrounds at least part of a periphery of the electronic component. The sub frame is provided with a holding portion that holds the electronic component in the holding portion.
    Type: Application
    Filed: May 9, 2018
    Publication date: June 18, 2020
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Xiaoguang Zheng
  • Publication number: 20200120803
    Abstract: A circuit assembly includes: a substrate with an electrically conducting path; plate-shaped busbars that have connection portions connected to the electrically conducting path of the substrate, and are arranged in an orientation in which plate surfaces thereof intersects with a surface of the substrate; a heat discharge member that is laid on a side of the substrate opposite to the busbars, and is configured to discharge heat of the substrate; and a resin frame that extends along the busbars, and holds the busbars while being in intimate contact with the busbars, wherein the frame includes mounting portions mounted on at least either the substrate or the heat discharge member.
    Type: Application
    Filed: April 25, 2018
    Publication date: April 16, 2020
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane
  • Patent number: 10448497
    Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: October 15, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takuya Ota, Shigeki Yamane, Hirotoshi Maeda, Toshiyuki Tsuchida, Yoshihiro Tozawa
  • Publication number: 20190206604
    Abstract: A circuit assembly that includes an inductor including a core; a fixation member to which the inductor is fixed; a base that is attached to the core, wherein: the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and an adhesive layer that is disposed between the base and the fixation member, and that bonds the base and the fixation member together.
    Type: Application
    Filed: March 8, 2017
    Publication date: July 4, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Toshiyuki TSUCHIDA, Shigeki YAMANE, Hirotoshi MAEDA, Takuya OTA, Junya AICHI
  • Patent number: 10304606
    Abstract: A coil assembly includes a coil unit in which a coil obtained by winding a winding wire is disposed around a magnetic core, a coil case that accommodates the coil unit, and a potting material with which an inside of the coil case is filled, and the coil case has an elastic fixing portion that is attachable to a resin member to which the coil case is to be fixed. The above-described configuration makes it possible to provide a coil assembly that is unlikely to crack and generate abnormal noises.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: May 28, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Junya Aichi, Yoshikazu Sasaki, Kyungwoo Kim, Shigeki Yamane, Takehito Kobayashi, Yukinori Kita, Tomohiro Ooi, Toru Takahashi
  • Patent number: 10297998
    Abstract: An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: May 21, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Hirotoshi Maeda, Takuya Ota, Junya Aichi, Yoshihiro Tozawa
  • Publication number: 20190118735
    Abstract: A circuit assembly where the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed, the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board, the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and the heat dissipation plate is overlaid so as to transfer heat on the circuit board on the second surface of the circuit board.
    Type: Application
    Filed: March 1, 2017
    Publication date: April 25, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuya OTA, Shigeki YAMANE, Hirotoshi MAEDA, Toshiyuki TSUCHIDA, Junya AICHI
  • Publication number: 20190067925
    Abstract: An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.
    Type: Application
    Filed: February 8, 2017
    Publication date: February 28, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Toshiyuki TSUCHIDA, Shigeki YAMANE, Hirotoshi MAEDA, Takuya OTA, Junya AICHI, Yoshihiro TOZAWA
  • Publication number: 20190045618
    Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.
    Type: Application
    Filed: September 6, 2016
    Publication date: February 7, 2019
    Applicants: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuya Ota, Shigeki Yamane, Hirotoshi Maeda, Toshiyuki Tsuchida, Yoshihiro Tozawa
  • Patent number: 10187969
    Abstract: A circuit structure includes a circuit board mounted with electronic components, a heat release member overlaid by the circuit board and releasing heat of the circuit board, a screw screwing the circuit board to the heat release member, and a spacer on which an insertion hole is formed to insert a shaft portion of the screw and the spacer is arranged between the circuit board and the screw to receive the screw. The spacer includes a board presser pressing the circuit board and a heat release member presser pressing the heat release member when the circuit board is screwed to the heat release member.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: January 22, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomohiro Ooi, Yoshikazu Sasaki, Takehito Kobayashi, Yukinori Kita, Shigeki Yamane