Patents by Inventor Shigeki Yamane
Shigeki Yamane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11908610Abstract: An inductor includes: a magnetic core; a conduction path penetrating the magnetic core; a pedestal portion including a core holding portion that holds the magnetic core, and support portions that support, when placed on a circuit board, electronic components at a height at which the electronic components can be accommodated on the circuit board side with respect to the core holding portion; and a shield portion that is provided on the circuit board side with respect to the magnetic core, and that shields a magnetic field generated by flow of electricity in the conduction path.Type: GrantFiled: January 25, 2019Date of Patent: February 20, 2024Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Junya Aichi
-
Patent number: 11891692Abstract: A film-forming device which includes a chamber having a horizontal central axis, capable of maintaining a vacuum, and movable along the horizontal central axis, the chamber including an inner chamber and an outer chamber that houses the inner chamber; a workpiece holder that aligns and holds workpieces to be processed in multiple stages in the inner chamber; and a heater that heats an inside of the chamber.Type: GrantFiled: June 15, 2020Date of Patent: February 6, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro Chikaishi, Shigeki Yamane
-
Publication number: 20230354555Abstract: A board unit includes: a board stack including a first circuit board and a second circuit board that are supported while being spaced apart from each other; an electronic component mounted on the first circuit board; a first heat dissipation member that covers the board stack from outside of the first circuit board; a second heat dissipation member that covers the board stack from outside of the second circuit board; a first heat transfer portion that thermally connects the electronic component and the first heat transfer portion; and a second heat transfer portion that thermally connects the electronic component and the second circuit board. The electronic component has a body located between the first circuit board and the second circuit board, and the second heat transfer portion is partially provided at a position that corresponds to the body of the electronic component.Type: ApplicationFiled: July 30, 2021Publication date: November 2, 2023Inventors: Shun TAKAMIZAWA, Shigeki YAMANE
-
Publication number: 20230007958Abstract: An electrical junction box includes: a bus bar; a frame that holds the bus bar; and a temperature detection member that detects the temperature of the bus bar, wherein the temperature detection member includes a detection main body part capable of detecting temperature, and a wiring part extending from the detection main body part, and is held by one or more holding parts, the frame is integrally molded in a shape including a frame part surrounding a periphery of at least a part of the bus bar that includes a detection target portion to be subjected to detection by the temperature detection member, and at least one holding part of the one or more holding parts, and the at least one holding part of the one or more holding parts is provided so as to be located inward of the frame part.Type: ApplicationFiled: November 20, 2020Publication date: January 12, 2023Inventors: Shun TAKAMIZAWA, Shigeki YAMANE
-
Patent number: 11377731Abstract: A film-forming device that includes a cylindrical chamber capable of maintaining vacuum therein, a workpiece holder that is constructed to align and hold workpieces to be processed in multiple stages such that main surfaces of the workpieces are oriented in a vertical direction relative to a central axis of the chamber, a deposition material supply pipe, a modifier supply pipe, a carrier gas supply pipe, and an exhaust mechanism, wherein in a cross section of the chamber in a direction parallel to the main surfaces of the workpieces, the exhaust mechanism is located on a side opposite to an opening direction of gas outlets of the deposition, modifier, and carrier gas supply pipes, and a total gas flow from the deposition, modifier, and carrier gas supply pipes is symmetric about a centerline of the chamber.Type: GrantFiled: June 15, 2020Date of Patent: July 5, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro Chikaishi, Shigeki Yamane
-
Patent number: 11289261Abstract: A circuit assembly that includes an inductor including a core; a fixation member to which the inductor is fixed; a base that is attached to the core, wherein: the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and an adhesive layer that is disposed between the base and the fixation member, and that bonds the base and the fixation member together.Type: GrantFiled: March 8, 2017Date of Patent: March 29, 2022Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Hirotoshi Maeda, Takuya Ota, Junya Aichi
-
Patent number: 11104282Abstract: A circuit assembly where the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed, the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board, the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and the heat dissipation plate is overlaid so as to transfer heat on the circuit board on the second surface of the circuit board.Type: GrantFiled: March 1, 2017Date of Patent: August 31, 2021Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Takuya Ota, Shigeki Yamane, Hirotoshi Maeda, Toshiyuki Tsuchida, Junya Aichi
-
Patent number: 11081869Abstract: An electrical junction box includes: a circuit board to which an electronic component is connected; and a frame positioned with respect to the circuit board. The frame integrally includes a sub frame that surrounds at least part of a periphery of the electronic component. The sub frame is provided with a holding portion that holds the electronic component in the holding portion.Type: GrantFiled: May 9, 2018Date of Patent: August 3, 2021Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Xiaoguang Zheng
-
Publication number: 20210212192Abstract: A circuit device 1 includes a circuit board, an inductor mounted on the circuit board, and a heat dissipation member to which the circuit board and the inductor are assembled. The inductor includes a case main body, and mounting pieces extending from the case main body in parallel with the circuit board. A heat dissipation member includes a main plate portion disposed along a heat dissipation surface on the opposite side of a mounting surface on which the inductor is mounted in the circuit board, and support post portions extending from the main plate portion and penetrating the circuit board and the mounting pieces . The circuit board and the mounting pieces are fixed to the support post portions by an adhesive.Type: ApplicationFiled: May 17, 2019Publication date: July 8, 2021Inventors: Shigeki Yamane, Toshiyuki Tsuchida
-
Patent number: 10893611Abstract: A circuit assembly includes: a substrate with an electrically conducting path; plate-shaped busbars that have connection portions connected to the electrically conducting path of the substrate, and are arranged in an orientation in which plate surfaces thereof intersects with a surface of the substrate; a heat discharge member that is laid on a side of the substrate opposite to the busbars, and is configured to discharge heat of the substrate; and a resin frame that extends along the busbars, and holds the busbars while being in intimate contact with the busbars, wherein the frame includes mounting portions mounted on at least either the substrate or the heat discharge member.Type: GrantFiled: April 25, 2018Date of Patent: January 12, 2021Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Toshiyuki Tsuchida, Shigeki Yamane
-
Publication number: 20200411231Abstract: An inductor includes: a magnetic core; a conduction path penetrating the magnetic core; a pedestal portion including a core holding portion that holds the magnetic core, and support portions that support, when placed on a circuit board, electronic components at a height at which the electronic components can be accommodated on the circuit board side with respect to the core holding portion; and a shield portion that is provided on the circuit board side with respect to the magnetic core, and that shields a magnetic field generated by flow of electricity in the conduction path.Type: ApplicationFiled: January 25, 2019Publication date: December 31, 2020Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Junya Aichi
-
Publication number: 20200308701Abstract: A film-forming device that includes a cylindrical chamber capable of maintaining vacuum therein, a workpiece holder that is constructed to align and hold workpieces to be processed in multiple stages such that main surfaces of the workpieces are oriented in a vertical direction relative to a central axis of the chamber, a deposition material supply pipe, a modifier supply pipe, a carrier gas supply pipe, and an exhaust mechanism, wherein in a cross section of the chamber in a direction parallel to the main surfaces of the workpieces, the exhaust mechanism is located on a side opposite to an opening direction of gas outlets of the deposition, modifier, and carrier gas supply pipes, and a total gas flow from the deposition, modifier, and carrier gas supply pipes is symmetric about a centerline of the chamber.Type: ApplicationFiled: June 15, 2020Publication date: October 1, 2020Inventors: Yasuhiro Chikaishi, Shigeki Yamane
-
Publication number: 20200308700Abstract: A film-forming device which includes a chamber having a horizontal central axis, capable of maintaining a vacuum, and movable along the horizontal central axis, the chamber including an inner chamber and an outer chamber that houses the inner chamber; a workpiece holder that aligns and holds workpieces to be processed in multiple stages in the inner chamber; and a heater that heats an inside of the chamber.Type: ApplicationFiled: June 15, 2020Publication date: October 1, 2020Inventors: Yasuhiro Chikaishi, Shigeki Yamane
-
Patent number: 10777346Abstract: A circuit assembly includes: a circuit board; an inductor that is disposed on the circuit board, and that includes a coil including a winding portion made by winding a winding wire, and a core member; and a heat dissipation plate that is disposed on the opposite side of the surface of the circuit board on which the inductor is disposed, wherein a through hole is provided in a region of the circuit board that corresponds to the inductor, and a receiving protrusion that penetrates the through hole and protrudes to a surface side of the circuit board on which the inductor is disposed, and that is in heat transfer contact with the coil and the core member is provided in a region that corresponds to the through hole in the heat dissipation plate.Type: GrantFiled: May 9, 2018Date of Patent: September 15, 2020Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Toshiyuki Tsuchida, Shigeki Yamane
-
Publication number: 20200194159Abstract: A coil device includes a coil unit that includes a coil and a magnetic core, a case that is made of resin and that houses the coil unit, and a bus bar that includes a connection portion that can be connected to a conductive path of a circuit board, and that is held in close contact with the case. The case includes a mounting portion that can be mounted on a face of the circuit board.Type: ApplicationFiled: May 9, 2018Publication date: June 18, 2020Inventors: Toshiyuki Tsuchida, Shigeki Yamane
-
Publication number: 20200194984Abstract: An electrical junction box includes: a circuit board to which an electronic component is connected; and a frame positioned with respect to the circuit board. The frame integrally includes a sub frame that surrounds at least part of a periphery of the electronic component. The sub frame is provided with a holding portion that holds the electronic component in the holding portion.Type: ApplicationFiled: May 9, 2018Publication date: June 18, 2020Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Xiaoguang Zheng
-
Publication number: 20200194160Abstract: A circuit assembly includes: a circuit board; an inductor that is disposed on the circuit board, and that includes a coil including a winding portion made by winding a winding wire, and a core member; and a heat dissipation plate that is disposed on the opposite side of the surface of the circuit board on which the inductor is disposed, wherein a through hole is provided in a region of the circuit board that corresponds to the inductor, and a receiving protrusion that penetrates the through hole and protrudes to a surface side of the circuit board on which the inductor is disposed, and that is in heat transfer contact with the coil and the core member is provided in a region that corresponds to the through hole in the heat dissipation plate.Type: ApplicationFiled: May 9, 2018Publication date: June 18, 2020Inventors: Toshiyuki Tsuchida, Shigeki Yamane
-
Publication number: 20200120803Abstract: A circuit assembly includes: a substrate with an electrically conducting path; plate-shaped busbars that have connection portions connected to the electrically conducting path of the substrate, and are arranged in an orientation in which plate surfaces thereof intersects with a surface of the substrate; a heat discharge member that is laid on a side of the substrate opposite to the busbars, and is configured to discharge heat of the substrate; and a resin frame that extends along the busbars, and holds the busbars while being in intimate contact with the busbars, wherein the frame includes mounting portions mounted on at least either the substrate or the heat discharge member.Type: ApplicationFiled: April 25, 2018Publication date: April 16, 2020Inventors: Toshiyuki Tsuchida, Shigeki Yamane
-
Patent number: 10448497Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.Type: GrantFiled: September 6, 2016Date of Patent: October 15, 2019Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Takuya Ota, Shigeki Yamane, Hirotoshi Maeda, Toshiyuki Tsuchida, Yoshihiro Tozawa
-
Publication number: 20190206604Abstract: A circuit assembly that includes an inductor including a core; a fixation member to which the inductor is fixed; a base that is attached to the core, wherein: the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and an adhesive layer that is disposed between the base and the fixation member, and that bonds the base and the fixation member together.Type: ApplicationFiled: March 8, 2017Publication date: July 4, 2019Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Toshiyuki TSUCHIDA, Shigeki YAMANE, Hirotoshi MAEDA, Takuya OTA, Junya AICHI