Patents by Inventor Shigemitsu Tomaki

Shigemitsu Tomaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190198959
    Abstract: A band-pass filter includes a main body, five resonators, a shield, and a partition. The main body is formed of a dielectric. The partition is formed of a conductor. The five resonators are configured so that capacitive coupling is established between every two of the resonators adjacent to each other in circuit configuration. Each of the five resonators includes a resonator conductor portion. A first stage resonator and a fifth stage resonator are magnetically coupled to each other although not adjacent to each other in circuit configuration. The partition extends to pass between the respective resonator conductor portions of the first stage resonator and the fifth stage resonator, and is electrically connected to the shield.
    Type: Application
    Filed: November 2, 2018
    Publication date: June 27, 2019
    Applicant: TDK CORPORATION
    Inventors: Yuta ASHIDA, Noriyuki HIRABAYASHI, Shigemitsu TOMAKI
  • Publication number: 20190007018
    Abstract: A multilayer electronic component includes a multilayer stack, and a band elimination filter formed using the multilayer stack. The band elimination filter includes a first input/output end, a second input/output end, a connection path connecting the first and second input/output ends, and a resonator coupled to the connection path. The connection path includes an impedance transformer. The resonator includes a first conductor line constituting a first distributed constant line. The impedance transformer includes a second conductor line constituting a second distributed constant line, and a through hole line section connected in series to the second conductor line.
    Type: Application
    Filed: May 15, 2018
    Publication date: January 3, 2019
    Applicant: TDK CORPORATION
    Inventors: Yuta ASHIDA, Noriyuki HIRABAYASHI, Shigemitsu TOMAKI
  • Publication number: 20180226934
    Abstract: A band-pass filter includes a main body formed of a dielectric, a plurality of resonators, a shield, and a partition formed of a conductor. Each of the plurality of resonators includes a resonator conductor portion. The resonator conductor portion has a first end and a second end opposite to each other in the longitudinal direction. The first end is connected to a ground, and the second end is open. The partition extends to pass through between the respective resonator conductor portions of two resonators, and is electrically connected to the shield.
    Type: Application
    Filed: January 23, 2018
    Publication date: August 9, 2018
    Applicant: TDK CORPORATION
    Inventors: Yuta ASHIDA, Naoki SOTOMA, Shigemitsu TOMAKI, Yasuyuki HIWATASHI
  • Publication number: 20170365902
    Abstract: A dielectric filter includes: a resonator body formed of dielectric material; surrounding dielectric portion present around the resonator body and formed of dielectric material having a relative permittivity lower than the dielectric material used to form the resonator body; and an input/output conductor portion formed of a conductor and configured to perform at least one supply of an electromagnetic wave to the resonator body and reception of an electromagnetic wave from the resonator body. The resonator body has a first end face and a second end face located at opposite ends in a first direction. The input/output conductor portion is located either at least part of the input/output conductor portion is contained in a space formed by shifting a virtual plane corresponding to the first end face in the first direction away from the second end face, or the input/output conductor portion is in contact with the space.
    Type: Application
    Filed: June 12, 2017
    Publication date: December 21, 2017
    Applicant: TDK CORPORATION
    Inventors: Yuta ASHIDA, Kazunari KIMURA, Shigemitsu TOMAKI
  • Patent number: 9698464
    Abstract: A transmission line is provided with a line portion with a first relative permittivity which is composed of a first dielectric and a conductor filler dispersed in the first dielectric, and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the surrounding dielectric portion exists around the line portion in a cross section perpendicular to a direction in which electromagnetic waves transmit in the line portion, the first relative permittivity is 600 or more, and the second relative permittivity is smaller than the first relative permittivity. An electronic component has the transmission line. Further, an electronic component is provided with a resonator having a resonant frequency ranging from 1 GHz to 10 GHz, wherein, the resonator is formed by using the transmission line.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: July 4, 2017
    Assignee: TDK CORPORATION
    Inventors: Takashi Fukui, Kiyoshi Hatanaka, Toshio Sakurai, Shigemitsu Tomaki
  • Patent number: 9647316
    Abstract: A transmission line and an electronic component including a resonator using the transmission line are provided. The transmission line is capable of transmitting electromagnetic waves of at least one frequency ranging from 1 GHz to 10 GHz and is composed of a first dielectric with a first relative permittivity and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the first dielectric is represented by a formula of {XBaO.(1?X)SrO}TiO2 (0.25<X?0.55), and the second relative permittivity is smaller than the first relative permittivity.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: May 9, 2017
    Assignee: TDK CORPORATION
    Inventors: Toshio Sakurai, Kiyoshi Hatanaka, Takashi Fukui, Shigemitsu Tomaki
  • Patent number: 9601816
    Abstract: A dielectric line includes a line portion and a surrounding dielectric portion. The line portion is formed of a first dielectric having a first relative permittivity. The surrounding dielectric portion is formed of a second dielectric having a second relative permittivity. The line portion propagates one or more electromagnetic waves of one or more frequencies within the range of 1 to 10 GHz. In a cross section orthogonal to the direction of propagation of the one or more electromagnetic waves through the line portion, the surrounding dielectric portion is present around the line portion. The first relative permittivity is 1,000 or higher. The second relative permittivity is lower than the first relative permittivity.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: March 21, 2017
    Assignee: TDK CORPORATION
    Inventors: Shigemitsu Tomaki, Tomoaki Kawata, Kiyoshi Hatanaka, Toshio Sakurai, Yasunori Sakisaka
  • Publication number: 20160013537
    Abstract: A transmission line and an electronic component including a resonator using the transmission line are provided. The transmission line is capable of transmitting electromagnetic waves of at least one frequency ranging from 1 GHz to 10 GHz and is composed of a first dielectric with a first relative permittivity and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the first dielectric is represented by a formula of {XBa·(1-X)SrO}TiO2 (0.25<X?0.55), and the second relative permittivity is smaller than the first relative permittivity.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 14, 2016
    Inventors: Toshio SAKURAI, Kiyoshi HATANAKA, Takashi FUKUI, Shigemitsu TOMAKI
  • Publication number: 20160013535
    Abstract: A transmission line is provided with a line portion with a first relative permittivity which is composed of a first dielectric and a conductor filler dispersed in the first dielectric, and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the surrounding dielectric portion exists around the line portion in a cross section perpendicular to a direction in which electromagnetic waves transmit in the line portion, the first relative permittivity is 600 or more, and the second relative permittivity is smaller than the first relative permittivity. An electronic component has the transmission line. Further, an electronic component is provided with a resonator having a resonant frequency ranging from 1 GHz to 10 GHz, wherein, the resonator is formed by using the transmission line.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 14, 2016
    Inventors: Takashi FUKUI, Kiyoshi HATANAKA, Toshio SAKURAI, Shigemitsu TOMAKI
  • Patent number: 9107323
    Abstract: A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: August 11, 2015
    Assignee: TDK Corporation
    Inventors: Shigemitsu Tomaki, Yoshikazu Tsuya, Masamichi Tanaka, Isao Abe
  • Patent number: 8952767
    Abstract: A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: February 10, 2015
    Assignee: TDK Corporation
    Inventors: Eiko Wakata, Shigemitsu Tomaki, Isao Abe
  • Publication number: 20150035626
    Abstract: A dielectric line includes a line portion and a surrounding dielectric portion. The line portion is formed of a first dielectric having a first relative permittivity. The surrounding dielectric portion is formed of a second dielectric having a second relative permittivity. The line portion propagates one or more electromagnetic waves of one or more frequencies within the range of 1 to 10 GHz. In a cross section orthogonal to the direction of propagation of the one or more electromagnetic waves through the line portion, the surrounding dielectric portion is present around the line portion. The first relative permittivity is 1,000 or higher. The second relative permittivity is lower than the first relative permittivity.
    Type: Application
    Filed: July 25, 2014
    Publication date: February 5, 2015
    Inventors: Shigemitsu TOMAKI, Tomoaki KAWATA, Kiyoshi HATANAKA, Toshio SAKURAI, Yasunori SAKISAKA
  • Patent number: 8864925
    Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: October 21, 2014
    Assignee: TDK Corporation
    Inventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
  • Publication number: 20130266758
    Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
    Type: Application
    Filed: July 21, 2011
    Publication date: October 10, 2013
    Applicant: TDK Corporation
    Inventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
  • Publication number: 20130120950
    Abstract: A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.
    Type: Application
    Filed: July 21, 2011
    Publication date: May 16, 2013
    Applicant: TDK Corporation
    Inventors: Shigemitsu Tomaki, Yoshikazu Tsuya, Masamichi Tanaka, Isao Abe
  • Publication number: 20130115411
    Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
    Type: Application
    Filed: July 21, 2011
    Publication date: May 9, 2013
    Applicant: TDK Corporation
    Inventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
  • Publication number: 20120313743
    Abstract: A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.
    Type: Application
    Filed: September 7, 2011
    Publication date: December 13, 2012
    Applicant: TDK Corporation
    Inventors: Kazunari Kimura, Shigemitsu Tomaki, Misaki Tabata, Isao Abe
  • Publication number: 20120249264
    Abstract: A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.
    Type: Application
    Filed: March 26, 2012
    Publication date: October 4, 2012
    Applicant: TDK CORPORATION
    Inventors: Eiko WAKATA, Shigemitsu TOMAKI, Isao ABE
  • Patent number: 8120446
    Abstract: An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: February 21, 2012
    Assignee: TDK Corporation
    Inventors: Shigemitsu Tomaki, Noriaki Ootsuka, Yoshikazu Tsuya, Kazushige Shinoda
  • Patent number: 8018305
    Abstract: An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: September 13, 2011
    Assignee: TDK Corporation
    Inventors: Shigemitsu Tomaki, Noriaki Ootsuka, Yoshikazu Tsuya, Kazushige Shinoda