Abstract: Provided is a highly reliable electronic control unit capable of improving responsiveness of an output current of a switching power supply to load current variation and suppressing power supply voltage variation accompanying the load current variation at low cost and with high power efficiency. Provided are: a calculation unit that performs signal processing; a first power supply circuit that supplies a first power supply voltage to the calculation unit; and a second power supply circuit that supplies a second power supply voltage to the first power supply circuit. The calculation unit has a function of outputting a control signal when a change in a consumed current of the calculation unit exceeds a predetermined threshold, and changes any one or both of a control scheme of the first power supply circuit and the second power supply voltage according to the control signal.

Abstract: A circuit for EMC 1 in a power input circuit includes at least two wirings of a high-potential-side wiring 2 and a low-potential-side wiring 3 having different potentials and formed on a circuit board, a cutoff part 6 having one end connected to the high-potential-side wiring 2, a capacitor 10 connected between the other end of the cutoff part 6 and the low-potential-side wiring 3, a cutoff part 7 having one end connected to the high-potential-side wiring 2, a capacitor 20 connected between the other end of the cutoff part 7 and the low-potential-side wiring 3, and a capacitor 30 connected between a connection part 4 where the cutoff part 6 and the capacitor 10 are connected and a connection part 5 where the cutoff part 7 and the capacitor 20 are connected. This can reduce the number of capacitors while preventing a decrease in the capacitance.

Abstract: Provided is an in-vehicle control system capable of reducing an increase in cost accompanying advancement of a fallback operation. Therefore, the in-vehicle control system includes: a plurality of control circuits 3 and 4 respectively including control units that perform data communication with each other; an external environment recognition sensor a5; and a plurality of wirings 11, 12, 13, and 14 connecting the external environment recognition sensor a5 and the plurality of control circuits 3 and 4. The plurality of control circuits 3 and 4 include: a first power supply unit that supplies power to the external environment recognition sensor a5 via a corresponding wiring among the plurality of wirings 11, 12, 13, and 14; and a first detection unit that detects an abnormality related to the power supplied to the external environment recognition sensor a5.

Abstract: Provided is a highly reliable electronic control unit capable of improving responsiveness of an output current of a switching power supply to load current variation and suppressing power supply voltage variation accompanying the load current variation at low cost and with high power efficiency. Provided are: a calculation unit that performs signal processing; a first power supply circuit that supplies a first power supply voltage to the calculation unit; and a second power supply circuit that supplies a second power supply voltage to the first power supply circuit. The calculation unit has a function of outputting a control signal when a change in a consumed current of the calculation unit exceeds a predetermined threshold, and changes any one or both of a control scheme of the first power supply circuit and the second power supply voltage according to the control signal.

Abstract: Provided is an in-vehicle control system capable of reducing an increase in cost accompanying advancement of a fallback operation. Therefore, the in-vehicle control system includes: a plurality of control circuits 3 and 4 respectively including control units that perform data communication with each other; an external environment recognition sensor a5; and a plurality of wirings 11, 12, 13, and 14 connecting the external environment recognition sensor a5 and the plurality of control circuits 3 and 4. The plurality of control circuits 3 and 4 include: a first power supply unit that supplies power to the external environment recognition sensor a5 via a corresponding wiring among the plurality of wirings 11, 12, 13, and 14; and a first detection unit that detects an abnormality related to the power supplied to the external environment recognition sensor a5.

Abstract: According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.

Abstract: A thermal humidity measuring device includes first and second heating elements, and is capable of obtaining a plurality of measurement values (measured values) by effectively utilizing each of the heating elements, which includes measuring humidity by the first heating element. A thermal humidity measuring device includes a first bridge circuit that includes a first heating element that senses humidity, and a second bridge circuit that includes a second heating element that heats air around the first heating element. In the thermal humidity measuring device, a first output signal is extracted from the first bridge circuit, and the humidity is sensed. A second output signal is extracted from the second bridge circuit, and the second output signal includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Abstract: According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: It is an object to provide a highly reliable physical-quantity measurement device which can relax thermal stress at a time of bonding and suppress creep or drift of a sensor output. To attain the above-described object, a physical-quantity measurement device according to the present invention includes a semiconductor element, and a base board connected to the semiconductor element with a plurality of layers being interposed. In the plurality of layers, a stress relaxing layer including at least metal as a main ingredient and a glass layer including glass as a main ingredient are formed each in a layered form including one or more layers. At least one of the stress relaxing layer and the glass layer includes low-melting-point glass, and a softening point of the low-melting-point glass is equal to or lower than the highest heat temperature that the semiconductor element can resist.

Abstract: It is an object of the present invention to provide a thermal humidity measuring device that has a configuration including a first heating element and a second heating element and that is capable of obtaining a plurality of measurement values (measured values) including humidity measured by the first heating element, by effectively utilizing each of the heating elements. A thermal humidity measuring device 1 includes a first bridge circuit 2 that includes a first heating element 4 that senses humidity, and a second bridge circuit 3 that includes a second heating element 10 that heats air around the first heating element 4. In the thermal humidity measuring device 1, a first output signal Va5 is extracted from the first bridge circuit 2, and the humidity is sensed. A second output signal Va15 is extracted from the second bridge circuit 3, and the second output signal Va15 includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Abstract: Provided is a humidity measuring apparatus that can measure a humidity of gas with high accuracy even in an environment with pulsation of gas to be measured, in measuring a humidity of gas with a humidity measuring apparatus using a thermal humidity detecting element. The humidity detecting element is disposed in a space offset from an extension line of a pressure introduction passage in a storage chamber, or a space formed on a depth side of a member provided on an extension line of the pressure introduction passage in the storage chamber such that gas introduced from a pressure introduction port into the pressure introduction passage is bent at least once before reaching the humidity detecting element.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: A pressure detecting device is mounted in a measurement target and instrument includes a strain inducer to which pressure of a pressure medium is applied and which generates strain in accordance with the pressure and a strain detecting element that is bonded onto a surface opposite to a pressure receiving surface of the strain inducer, in which the strain detecting element includes one or multiple central strain resistant bridges which are arranged at a central portion of the strain detecting element in a bonded surface direction, and one or multiple outer peripheral strain resistant bridges which are arranged at an outer periphery, and in which, for example, deformation of the strain detecting element caused by an external force when being screw-fixed to the measurement target instrument is obtained through the multiple strain resistant bridges. An error of detection pressure caused by the deformation in a pressure value detected through the central strain resistant bridge is corrected.