Abstract: When a plating layer is formed on through holes in semiconductor packages, first and second stacked bodies are stacked with first and second cavities formed in the first and second stacked bodies facing the inner side and are bonded together by applying adhesive to peripheral regions so that the cavities of the first and second stacked bodies form sealed spaces, and the through holes are formed such that part of the first and second stacked bodies including the bonding surface remains. Then, the through holes are plated to form the plating layer, the peripheral regions are removed as cutting allowances, i.e., removal regions, and the first and second stacked bodies are divided into a plurality of pieces along dicing lines to form semiconductor packages.

Abstract: To obtain a position detection device capable of detecting highly accurate and robust position by suppressing affect of error detection of an edge, provided is a configuration for performing a validity determination of edges detected by binarizing an image signal (21) converted by a light-receiving element (3) for receiving light irradiated from a light source (1) toward a scale (2) having a code pattern, and performing position detection after removing the edges determined to be invalid as edges that have been affected by foreign matter and the like among the edges on which the validity determination has been performed.

Abstract: To obtain a position detection device capable of detecting highly accurate and robust position by suppressing affect of error detection of an edge, provided is a configuration for performing a validity determination of edges detected by binarizing an image signal (21) converted by a light-receiving element (3) for receiving light irradiated from a light source (1) toward a scale (2) having a code pattern, and performing position detection after removing the edges determined to be invalid as edges that have been affected by foreign matter and the like among the edges on which the validity determination has been performed.

Abstract: Provided is an absolute encoder capable of detecting the absolute angle at high resolution and with high precision. An image sensor receives light in an absolute value code pattern of a scale, an edge detecting unit detects from the received light signal an edge pixel position and an edge direction, and an edge position correcting unit corrects the edge pixel position based on the edge direction. A phase detecting unit detects from the corrected edge pixel position the phase shift amount of a shift from a reference pixel position of the image sensor, and a high precision detection unit uses a rough absolute position detected by a rough detection unit and the phase shift amount detected by the phase detecting unit to detect the absolute position with high precision.

Abstract: Provided is an absolute encoder capable of detecting the absolute angle at high resolution and with high precision. An image sensor receives light in an absolute value code pattern of a scale, an edge detecting unit detects from the received light signal an edge pixel position and an edge direction, and an edge position correcting unit corrects the edge pixel position based on the edge direction. A phase detecting unit detects from the corrected edge pixel position the phase shift amount of a shift from a reference pixel position of the image sensor, and a high precision detection unit uses a rough absolute position detected by a rough detection unit and the phase shift amount detected by the phase detecting unit to detect the absolute position with high precision.

Abstract: When a plating layer is formed on through holes in semiconductor packages, first and second stacked bodies are stacked with first and second cavities formed in the first and second stacked bodies facing the inner side and are bonded together by applying adhesive to peripheral regions so that the cavities of the first and second stacked bodies form sealed spaces, and the through holes are formed such that part of the first and second stacked bodies including the bonding surface remains. Then, the through holes are plated to form the plating layer, the peripheral regions are removed as cutting allowances, i.e., removal regions, and the first and second stacked bodies are divided into a plurality of pieces along dicing lines to form semiconductor packages.

Abstract: In a close talking microphone device in use for a communication apparatus for a motorcycle, a front casing 2 and a back casing 3 are provided with a front opening 7 and a back opening respectively. Elastic supporting members 5, 6 and 15 for a microphone 4 are accommodated through a first and second filters 11 and 12 between the front casing 2 and the back casing 3 and formed thereon with first, second and third through holes 13, 14 and 16 connected to each other. The microphone 4 is engaged within the third through hole to form a pair of sound paths at each front and back side of the microphone 4. The front sound path is smaller in volume than the back sound path and the opening size of the through hole 13 is defined narrower than that of the through hole 14, whereby a sideward noise diverges into two courses "a" and "b" and the diverging noises reaching the microphone are cancelled by each other so as to be dampened.