Abstract: A module including a stack of a plurality of dies and a package substrate. The stack including a main die, two intermediate dies disposed between the package substrate and the main die, a sub die being juxtaposed with the main die, and a connecting component electrically connecting the package substrate to the main die and the sub die. An other intermediate die of the two intermediate dies is disposed in a state in which an entirety of the circuit surface of the other intermediate die faces the circuit surface of the main die, and the one intermediate die is disposed astride an end portion of the circuit surface of the main die and an end portion of the circuit surface of the sub die in a state in which the circuit surface of the one intermediate die faces the end portions.

Abstract: An absolute encoder includes: a scale including an optical pattern that includes code patterns for a plurality of cycles; an illumination unit that outputs light for illuminating the scale; a light detection unit that detects light from the scale; a section determination unit that determines, for a region of the optical pattern divided into a plurality of sections, the section to which a code string belongs; and an absolute position calculation unit that obtains an absolute position of the scale on the basis of the section determined and the code string. When N is the number of the cycles of the code patterns on the scale, in a case where N is equal to two, the number of the sections is three or more, and in a case where N is equal to three or more, the number of the sections is N or more.

Abstract: An object is to provide a technique capable of enhancing electrical characteristics and reliability of a semiconductor device. The semiconductor device includes a plurality of semiconductor chips, a plurality of electrodes each being electrically connected to each of the plurality of semiconductor chips, a sealing member, and a joint part. The sealing member covers the plurality of semiconductor chips, and parts being connected to the plurality of semiconductor chips, of the plurality of electrodes. The joint part is disposed outside the sealing member to electrically connect parts which are not covered by the sealing member, of the plurality of electrodes.

Abstract: An object of the present invention is to suppress reduction in a temperature cycle life of a wiring in a two-in-one type chopper module. A two-in-one type chopper module according to the present invention includes: a switching transistor; a first diode inverse-parallelly connected to the switching transistor; a second diode serially connected to the switching transistor and the first diode; a first wiring pattern mounting the switching transistor and the first diode; and a second wiring pattern mounting the second diode, wherein each of the switching transistor and the first diode has a power loss substantially identical with each other at a time of a forward direction current conduction, and an effective area of the second diode is larger than an effective area of the first diode.

Abstract: An object of the present invention is to suppress reduction in a temperature cycle life of a wiring in a two-in-one type chopper module. A two-in-one type chopper module according to the present invention includes: a switching transistor; a first diode inverse-parallelly connected to the switching transistor; a second diode serially connected to the switching transistor and the first diode; a first wiring pattern mounting the switching transistor and the first diode; and a second wiring pattern mounting the second diode, wherein each of the switching transistor and the first diode has a power loss substantially identical with each other at a time of a forward direction current conduction, and an effective area of the second diode is larger than an effective area of the first diode.

Abstract: An engine off natural vacuum (EONV) evaporative fuel leak check system includes a fuel tank, a heat exchanger, an air duct, a fan, a fuel temperature sensor, and a controller. The fan directs air onto the heat exchanger, and the heat exchanger heats air passing around the heat exchanger in a heat exchange process using heat from engine coolant within the heat exchanger. The air duct extends between the fuel tank and the heat exchanger and the fan moves the heated air through the air duct toward the fuel tank. The controller is configured to control the fan for moving the heated air toward the fuel tank based on a temperature of the fuel within the fuel tank, as detected by the fuel temperature sensor.

Abstract: A first plate portion covers one opening of a pump chamber of a tubular portion, and a second plate portion covers the other opening of the pump chamber along a center axis of the tubular portion. A hole forming portion is equipped to an outside of the tubular portion to form a connection hole. A length of the hole forming portion along the center axis is less than or equal to a length of the tubular portion along the center axis. A first imaginary line connects a center of an outer opening of the connection hole with a point on the center axis. The first imaginary line intersects perpendicularly with the center axis. A length of the connection hole in a direction perpendicular to both the first imaginary line and the center axis is greater than a length of the connection hole along the center axis.

Abstract: It is an object of the present invention to provide a semiconductor device which allows an increase in the number of semiconductor elements mounted in parallel and prevents a shape of an insulating substrate onto which the semiconductor elements are mounted, from being laterally long, and provide a semiconductor module including such semiconductor device. A semiconductor device according to the present invention includes an insulating substrate, a metal pattern which is a continuous piece and is bonded to one main surface of the insulating substrate, and a plurality of switching elements which are bonded to a surface opposite to the insulating substrate on the metal pattern, and the plurality of switching elements are arranged in a matrix of two or more rows and two or more columns on the metal pattern.

Abstract: A base plate, and a plurality of unit structures formed on the base plate are provided. Each of the unit structures including an insulating substrate fixed on the base plate, a metal pattern formed on the insulating substrate, a semiconductor element electrically connected to the metal pattern, and a main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate.

Abstract: An inspection apparatus includes a pressure sensor, a reference orifice, a pump, and a switching valve. The reference orifice is disposed in a first communication passage communicating a pressure passage receiving the pressure sensor, with a tank passage communicating with a fuel tank. The pump depressurizing or pressurizing the pressure passage includes an intake port and a discharge port, and one of which communicates with an atmospheric passage communicating with the atmosphere and the other one communicates with the pressure passage. The switching valve and switches between a state shutting off a communication of a second communication passage that leads to the pressure passage and passages other than the pressure passage and communicating the atmospheric passage with the tank passage and a state shutting off a communication of the atmospheric passage and passages other than the pump and the atmosphere and communicating the second communication passage with the tank passage.

Abstract: It is an object of the present invention to provide a semiconductor device which allows an increase in the number of semiconductor elements mounted in parallel and prevents a shape of an insulating substrate onto which the semiconductor elements are mounted, from being laterally long, and provide a semiconductor module including such semiconductor device. A semiconductor device according to the present invention includes an insulating substrate, a metal pattern which is a continuous piece and is bonded to one main surface of the insulating substrate, and a plurality of switching elements which are bonded to a surface opposite to the insulating substrate on the metal pattern, and the plurality of switching elements are arranged in a matrix of two or more rows and two or more columns on the metal pattern.

Abstract: An object is to provide a technique capable of enhancing electrical characteristics and reliability of a semiconductor device. The semiconductor device includes a plurality of semiconductor chips, a plurality of electrodes each being electrically connected to each of the plurality of semiconductor chips, a sealing member, and a joint part. The sealing member covers the plurality of semiconductor chips, and parts being connected to the plurality of semiconductor chips, of the plurality of electrodes. The joint part is disposed outside the sealing member to electrically connect parts which are not covered by the sealing member, of the plurality of electrodes.

Abstract: An inspection apparatus includes a pressure sensor, a reference orifice, a pump, and a switching valve. The reference orifice is disposed in a first communication passage communicating a pressure passage receiving the pressure sensor, with a tank passage communicating with a fuel tank. The pump depressurizing or pressurizing the pressure passage includes an intake port and a discharge port, and one of which communicates with an atmospheric passage communicating with the atmosphere and the other one communicates with the pressure passage. The switching valve and switches between a state shutting off a communication of a second communication passage that leads to the pressure passage and passages other than the pressure passage and communicating the atmospheric passage with the tank passage and a state shutting off a communication of the atmospheric passage and passages other than the pump and the atmosphere and communicating the second communication passage with the tank passage.

Abstract: A filter element is accommodated in a filter case. A housing is affixed to the filter case. A partition plate is located between the filter case and the housing. A switching valve is equipped in the housing. The switching valve includes a solenoid actuator, a valve, and a valve seat member. A vibration transmission member is located on one side in a driving direction of the valve relative to the valve seat member. The vibration transmission member is in contact with the switching valve at one end and is in contact with the partition plate at the other end. The vibration transmission member transmits oscillation, which is caused when the valve is seated on the valve seat, to the filter element through the partition plate.

Abstract: A housing receiving a switching valve, a pressure sensor, and a pump includes a tubular portion having an inner wall provided with a support portion into which an attachment portion is inserted. The pump includes a pump portion and a motor portion which are connected to the attachment portion. The support portion receives an elastic member abutting on the attachment portion. The elastic member prevents a vibration generated due to an operation of the pump from being transmitted to the tubular portion. Since the pump is supported by a cover through a pressure detection pipe including a pressure detection passage and is supported by the tubular portion through the elastic member and the support portion, the pump prevents from vibrating by its weight. Therefore, a noise radiated out of the housing due to the vibration transmitted from the pump to the housing can be reduced.

Abstract: A first tubular portion has a cross sectional shape which is a non-perfect circle relative to an axis thereof. A second tubular portion is disposed concentrically with the first tubular portion. The second tubular portion has a cross sectional shape relative to its axis, which is a congruent shape of the cross sectional shape of the first tubular portion. A sealing member is disposed between the first tubular portion and the second tubular portion for sealing therebetween. The sealing member has a cross sectional shape of which length parallel to its axis is greater than length which is perpendicular to the axis.

Abstract: According to the present invention, a switching element includes a substrate, a first gate pad formed on the substrate, a second gate pad formed on the substrate, a first resistor portion formed on the substrate, the first resistor portion connecting the first gate pad and the second gate pad to each other, and a cell region formed on the substrate and connected to the first gate pad. Thus, measurement of the gate resistance value and selection from gate resistances of the switching element can be performed after the completion of the gate-resistor-incorporating-type switching element.

Abstract: The vane pump has a pump chamber, in which a first inner plate and a second inner plate are movably accommodated at each of axial ends of a rotor. In a case that an electric motor is arranged at a lower side of the vane pump, the first inner plate is moved in a direction to the second inner plate by a force of gravity, so that the first inner plate is brought into contact with a first axial end of the rotor. As a result, an upper side axial open end of each pumping room, which is respectively defined by multiple vanes, is closed by the first inner plate. An amount of air leaking from one of the pumping rooms to the other pumping rooms can be reduced.

Abstract: According to the present invention, a switching element includes a substrate, a first gate pad formed on the substrate, a second gate pad formed on the substrate, a first resistor portion formed on the substrate, the first resistor portion connecting the first gate pad and the second gate pad to each other, and a cell region formed on the substrate and connected to the first gate pad. Thus, measurement of the gate resistance value and selection from gate resistances of the switching element can be performed after the completion of the gate-resistor-incorporating-type switching element.

Abstract: A first plate portion covers one opening of a pump chamber of a tubular portion, and a second plate portion covers the other opening of the pump chamber along a center axis of the tubular portion. A hole forming portion is equipped to an outside of the tubular portion to form a connection hole. A length of the hole forming portion along the center axis is less than or equal to a length of the tubular portion along the center axis. A first imaginary line connects a center of an outer opening of the connection hole with a point on the center axis. The first imaginary line intersects perpendicularly with the center axis. A length of the connection hole in a direction perpendicular to both the first imaginary line and the center axis is greater than a length of the connection hole along the center axis.