Patents by Inventor Shigeru Iwasaki

Shigeru Iwasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER JOINT STRUCTURE, SOLDERING METHOD, AND ELECTRONIC-COMPONENT MANUFACTURING APPARATUS USING THE SAME STRUCTURE AND THE METHOD
    Publication number: 20080179379
    Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.
    Type: Application
    Filed: October 3, 2007
    Publication date: July 31, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroshi AKAMATSU, Yukinori KAWAMURA, Hiroshi KAI, Osamu KURAMOTO, Shigeru IWASAKI, Kenji ASAI, Minoru HIBINO
  • Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method
    Patent number: 7293692
    Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: November 13, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Akamatsu, Yukinori Kawamura, Hiroshi Kai, Osamu Kuramoto, Shigeru Iwasaki, Kenji Asai, Minoru Hibino
  • Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method
    Publication number: 20040253474
    Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.
    Type: Application
    Filed: June 10, 2004
    Publication date: December 16, 2004
    Inventors: Hiroshi Akamatsu, Yukinori Kawamura, Hiroshi Kai, Osamu Kuramoto, Shigeru Iwasaki, Kenji Asai, Minoru Hibino
  • Portable radio telephone having a slidable speaker unit
    Patent number: 5461672
    Abstract: A portable radiotelephone transmits and receives voice information signals to and from a telephone base station by radio. The radio telephone includes a telephone main body having a key pad section mounted on its outer surface and containing a microphone unit. A speaker housing containing a speaker unit is slidably mounted on the telephone main body. A switching unit located between the telephone body and the speaker housing establishes electrical connection and disconnection between the telephone body and the speaker housing depending upon their relative positions as changed by sliding the speaker unit. Electrical connection is established when the speaker housing is moved in a direction away from the microphone unit located on the telephone main body.
    Type: Grant
    Filed: July 15, 1993
    Date of Patent: October 24, 1995
    Assignee: Sony Corporation
    Inventors: Kazuhiro Enokido, Akio Suzuki, Shigeru Iwasaki