Abstract: In an inspection apparatus for inspecting an inspection target device formed on an inspection object, the inspection target device is a back-illuminated imaging device into which light is incident from a rear surface opposite to a side of a wiring layer. The inspection apparatus includes a stage having the inspection object placed such that the inspection object faces the rear surface. The stage includes a light transmitter made of a light-transmissive material. The inspection object is placed on the light transmitter below which a light illuminator is disposed. The light illuminator includes a flat light guide plate having a facing surface facing the inspection object. A light source is provided laterally outside the light guide plate configured to diffuse light emitted from the light source incident from a side end surface of the light guide plate, and to emit the light as planar light from the facing surface.

Abstract: An image processing apparatus includes a processor configured to: extract position coordinates of each document image from an entire image resulting from photographing multiple documents; perform a first operation that extracts, from the document images included in the entire image, a first document image having two sides parallel with a direction of arrangement of the documents and having a first side of the two sides being a far side from a first coordinate axis, the first side having the shortest distance to the first coordinate axis, the first coordinate axis being in parallel with the direction of the arrangement of the documents set with respect to an origin of the entire image; perform a second operation that extracts, as an document image of the same group, a second document image overlapping an extension of the first side of the extracted first image document; and perform a third operation that sets a page number on each of the extracted document images of the same group in an order of closeness from

Abstract: There is provided a placement table having an upper surface on which a device to be processed is placed. The placement table comprises: a top plate having a placement surface for the device; a heating unit configured to heat the top plate; a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view. The positioning unit is formed of a flexible substrate having flexibility.

Abstract: A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

Abstract: A power supply for supplying a power to a heating mechanism used for heating a measurement target that emits a measurement signal includes an input device configured to output an input signal that reflects a control signal in a differentiable periodic waveform having a frequency of 1 kHz or less. The power supply includes a switching amplifier configured to amplify the input signal from the input device and output the amplified signal.

Abstract: There is provided a control method of a test device, the test device comprising a chuck on which an object to be tested is mounted, a tester configured to supply electric power to the object to be tested to test the object to be tested, and a controller configured to control a temperature of the chuck. The control method comprises: when an actual temperature of the object to be tested cannot be fed back, estimating a temperature difference between the temperature of the chuck and the temperature of the object to be tested on the basis of a heat amount of the object to be tested; correcting a target temperature of the chuck on the basis of a target temperature of the object to be tested and the temperature difference; and controlling the temperature of the chuck on the basis of the corrected target temperature of the chuck and an actual temperature of the chuck.

Abstract: A method for performing temperature control of a mounting base on which a substrate is to be mounted. A substrate mounting surface of the mounting base is divided in the radial direction into a plurality of regions, and a heater is provided to each of the plurality of regions. The method includes: a step for performing feedback control that adjusts the operation amount of the heater in the centermost region of the plurality of regions of the substrate mounting surface such that the centermost region is at a set temperature; and a step for performing feedback control that adjusts the operation amount of the heater in an outside region that is further to the outside than the centermost region of the plurality of regions of the substrate mounting surface such that the temperature difference between the outside region and the region that is adjacent to the outside region on the inside in the radial direction is a preset value.

Abstract: Provided an apparatus including: a signal acquisition part that acquires an oscillation signal from a sensor that detects an oscillation induced in a target object; and an estimation part that obtains a feature value for each frame of the oscillation signal by applying Fourier transform to each frame extracted by a window of a predetermined length to calculate the feature value for the each frame in a frequency domain, and performs Gaussian mixture model-clustering on a time series of the feature values for respective frames to estimate one or more clusters, each of which is modeled with a Gaussian probability distribution best fit to the time series, and detect one or more events by detecting one or more corresponding clusters, a probability density value thereof greater than a predetermined threshold value.

Abstract: A test wafer according to an embodiment of the present disclosure is a test wafer used for simulation of heat emission of devices on a wafer, and includes a silicon wafer and a silicon heater bonded to a surface of the silicon wafer.

Abstract: An apparatus includes a signal acquisition part acquires oscillation signals from sensors provided under lanes of a bridge and close to an expansion joint, a signal separation part applies BSS to the oscillation signals to estimate source oscillation signals respectively separated in the plurality of lanes, and adjusts amplitude of the source oscillation signals to output amplitude adjusted oscillation signals, and a vehicle estimation part estimates, from the amplitude adjusted oscillation signal, a response oscillation due to a vehicle passing on the lane of interest to detect and count vehicles passing on the lane.

Abstract: A state estimation apparatus 1 includes an acquisition unit 2 that acquires deterioration information indicating a deterioration state of each structural object and a learning unit 3 that learns common information that is common between pieces of the deterioration information and estimation index information that is used for estimating a deterioration state of a target structural object, using the deterioration information as input.

Abstract: An abnormality estimation apparatus 10 includes: a detection unit 11 configured to detect a vibration response when a vehicle passes over an expansion and contraction apparatus 23, using vibration information indicating vibration that occurs in a bridge; a first index calculation unit 12 configured to calculate a first index for determining the presence or absence of an abnormality in the expansion and contraction apparatus 23, using the vibration response; and an estimation unit 13 configured to estimate the presence or absence of an abnormality in accordance with a change in the first index.

Abstract: A damage diagnosis device is provided with: a detection unit for detecting that, immediately after a vehicle crossing a bridge has exited from the bridge, another vehicle is not crossing the bridge; a determination unit for determining whether the weight of the vehicle satisfies a criterion; and a diagnosis unit that, when the detection unit has detected that no other vehicle is crossing the bridge and the determination unit has determined that the weight of the vehicle satisfies the criterion, diagnoses damage to the bridge on the basis of information representing free vibration generated in the bridge due to the crossing of the vehicle, thereby improving the precision of diagnosis when damage to a bridge is diagnosed on the basis of information representing free vibration generated in the bridge due to the crossing of a vehicle.

Abstract: An inspection apparatus is provided to inspect an imaging device formed on an inspection object by bringing a contact terminal into electrical contact with a wiring layer of the imaging device while causing light to enter the imaging device. The light enters the imaging device from a back surface that is a surface on the side opposite to the side on which the wiring layer is formed. The inspection apparatus includes a substrate support made of a light-transmissive material and on which the inspection object is supported such that the substrate support faces a back surface of the imaging device, and a light irradiation mechanism disposed to be opposite to the inspection object with the substrate support interposed therebetween and having a plurality of LEDs such that light from the LEDs is oriented toward the inspection object.

Abstract: An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.

Abstract: A vehicle weight estimation apparatus 10 includes: a collecting unit 11 that collects vibration information indicating vibration output from a sensor 25 installed to a structure having a vibration-generating structure that generates vibration upon passage of a vehicle 30; an axle response extracting unit 12 that detects, by using the vibration information, axle responses indicating the passage of one or more axles of the vehicle 30 over the vibration-generating structure; an axle index calculating unit 13 that calculates axle indices corresponding to the individual axles based on the axle responses; a converting unit 14 that converts the axle indices into axle weights by referring to conversion information that is stored in advance and that indicates a relationship between axle indices and axle weights; and a vehicle weight calculating unit 15 that calculates the weight of the vehicle by totaling the axle weights of the individual axles.

Abstract: There is provided a mounting table on which a workpiece is mounted, including: a plurality of layers including a ceiling layer having a front surface on which the workpiece is mounted, and a heating layer formed at a rear surface side of the ceiling layer and configured to heat the ceiling layer, the plurality of layers being stacked above one another. Each of the plurality of layers is formed by a silicon single crystal substrate or a silicon polycrystalline substrate. Each of the plurality of layers is bonded to a different layer which is adjacent in a stacking direction through oxide films formed on the silicon single crystal substrate or the silicon polycrystalline substrate.

Abstract: This temperature control device for controlling the temperature of an object that is subject to temperature control is provided with: a heating mechanism which has a heat source for heating said object subject to temperature control; a temperature measuring instrument for measuring the peripheral temperature of said object subject to temperature control; a temperature estimation unit for dynamically estimating the temperature of said object subject to temperature control on the basis of power inputted to the heat source, power supplied to said object subject to temperature control, and the peripheral temperature; and a temperature controller for performing control on the temperature of said object subject to temperature control by controlling the power inputted to the heat source on the basis of the estimated temperature of said object subject to temperature control.

Abstract: A method for performing temperature control of a mounting base on which a substrate is to be mounted. A substrate mounting surface of the mounting base is divided in the radial direction into a plurality of regions, and a heater is provided to each of the plurality of regions. The method includes: a step for performing feedback control that adjusts the operation amount of the heater in the centermost region of the plurality of regions of the substrate mounting surface such that the centermost region is at a set temperature; and a step for performing feedback control that adjusts the operation amount of the heater in an outside region that is further to the outside than the centermost region of the plurality of regions of the substrate mounting surface such that the temperature difference between the outside region and the region that is adjacent to the outside region on the inside in the radial direction is a preset value.

Abstract: An apparatus for inspecting an electronic device, includes: a placement table on which a substrate having the electronic device provided thereon is placed and including a refrigerant flow path; a light irradiation mechanism having LEDs directed to the substrate; and a controller for controlling heat absorption by the refrigerant and heating by light from the LEDs. The controller includes: a temperature information acquisition part for acquiring information on a temperature of the electronic device; a heating controller for performing the heating control based on the temperature of the electronic device as a current inspection object; and a heat absorption controller for estimating a transition of power applied to the electronic device at a next inspection based on a transition of the temperature of the electronic device in a past inspection, and performing the heat absorption control at a time of the next inspection.