Abstract: A silicone composition having an electromagnetic wave absorbing property and thermal conductivity includes liquid silicone; a high-specific-gravity soft magnetic filler having a specific gravity of 4.5 or greater; an intermediate-specific-gravity thermally conductive filler having a specific gravity of 4.0 or less; and a non-liquid anti-thickening and anti-settling agent. Furthermore, a curable grease is a two-component curable grease including a combination of a base compound and a curing agent that are used by being mixed together when used, the curable grease being to be cured by mixing of the base compound with the curing agent. The base compound is a silicone composition of the present invention, in which the liquid silicone is an organopolysiloxane having a vinyl group at an end thereof. The curing agent is a silicone composition of the present invention, in which the liquid silicone is an organohydrogenpolysiloxane.

Abstract: A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.

Abstract: A silicone composition having an electromagnetic wave absorbing property and thermal conductivity includes liquid silicone; a high-specific-gravity soft magnetic filler having a specific gravity of 4.5 or greater; an intermediate-specific-gravity thermally conductive filler having a specific gravity of 4.0 or less; and a non-liquid anti-thickening and anti-settling agent. Furthermore, a curable grease is a two-component curable grease including a combination of a base compound and a curing agent that are used by being mixed together when used, the curable grease being to be cured by mixing of the base compound with the curing agent. The base compound is a silicone composition of the present invention, in which the liquid silicone is an organopolysiloxane having a vinyl group at an end thereof. The curing agent is a silicone composition of the present invention, in which the liquid silicone is an organohydrogenpolysiloxane.

Abstract: To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.

Abstract: A heat-conducting sheet 1 comprising a first heat-conducting layer 1a and a second heat-conducting layer 1b, which each comprise a polymer matrix 2 and an anisotropic filler 3, and wherein the anisotropic filler is oriented in a thickness direction. The first and second heat-conducting layers 1a and 1b are laminated via an interface 5 in which a filling ratio of the anisotropic filler 3 is lower than that of the first and second heat-conducting layers 1a and 1b.

Abstract: To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A key sheet has a base sheet formed of a rubber-like elastic material in which a heat conductive filler is mixed. Thus, if a semiconductor device on a board generates heat, it is possible to suppress local heat storage by the heat conductive filler of the base sheet. Further, there is no need to provide a separate member for heat diffusion between the board and the key sheet, making it possible to realize a reduction in thickness. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses, and the requirement for a reduction in the thickness and weight of electronic apparatuses.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A base sheet of a key sheet is provided with a heat diffusion sheet. The heat diffusion sheet is provided with a graphite sheet and a resin film and, in some cases, a thin metal plate. The base sheet itself thus constitutes the heat diffusion sheet, so even if no member for heat diffusion is provided between a board and the key sheet, it is possible to diffuse local heat generated by a semiconductor device in the face direction of the base sheet. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses and to meet the requirement for a reduction in the thickness and further in weight of electronic apparatuses.

Abstract: Provided is an illumination type key sheet which efficiently diffuses local heat generated by a mounted element on a board and which makes an EL member relatively free from generation of unevenness in luminance. An illumination type key sheet is equipped with a graphite sheet which diffuses heat in a surface direction. Thus, if a semiconductor device on a board generates heat, it is possible to prevent local heating of an EL sheet by the graphite sheet, making the EL sheet relatively free from generation of unevenness in luminance. At the same time, it is possible to prevent occurrence of problems, such as malfunction and failure, due to heat storage of the semiconductor device. As compared with other materials, the graphite sheet exhibits high heat conductivity allows efficient heat diffusion, and is lightweight. Thus, it can meet the demand for a reduction in a weight of portable electronic apparatuses.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A key sheet has a base sheet formed of a rubber-like elastic material in which a heat conductive filler is mixed. Thus, if a semiconductor device on a board generates heat, it is possible to suppress local heat storage by the heat conductive filler of the base sheet. Further, there is no need to provide a separate member for heat diffusion between the board and the key sheet, making it possible to realize a reduction in thickness. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses, and the requirement for a reduction in the thickness and weight of electronic apparatuses.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A base sheet of a key sheet is provided with a heat diffusion sheet. The heat diffusion sheet is provided with a graphite sheet and a resin film and, in some cases, a thin metal plate. The base sheet itself thus constitutes the heat diffusion sheet, so even if no member for heat diffusion is provided between a board and the key sheet, it is possible to diffuse local heat generated by a semiconductor device in the face direction of the base sheet. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses and to meet the requirement for a reduction in the thickness and further in weight of electronic apparatuses.