Patents by Inventor Shigeru Mori

Shigeru Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11366416
    Abstract: A light-emitting-device head includes a first light-emitting-device arrangement including light emitting devices arranged in lines extending in a first scanning direction; a second light-emitting-device arrangement including light emitting devices arranged in lines extending in a first scanning direction, the second light-emitting-device arrangement overlapping the first light-emitting-device arrangement in a second scanning direction at least in part; an optical device that forms an electrostatic latent image by focusing light emitted from the light emitting devices on a photoconductor and exposing the photoconductor to the light; and a switching unit that switches the light-emitting-device arrangement to be lit up between the first light-emitting-device arrangement and the second light-emitting-device arrangement at a switching position defined at any position in an overlapping portion where the first light-emitting-device arrangement and the second light-emitting-device arrangement overlap each other.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: June 21, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Shigeru Arai, Kyoji Yagi, Shun Yashima, Junichiro Mori
  • Publication number: 20220165807
    Abstract: A first stack-structured light-emitting element includes light-emitting units and a first charge generation layer between the light-emitting units. A second stack-structured light-emitting element includes light-emitting units and a second charge generation layer between the light-emitting units. Each of the first and second charge generation layers consists of one or more charge generation component layers. A first end region of the first charge generation layer and a second end region of the second charge generation layer overlap above the top face of the element separation layer. In the overlap region, an end region of a component layer of the first or second stack-structured light-emitting element configured to block charges of either polarity is interposed between charge generation component layers of the first and second charge generation layers configured to generate charges of the same polarity as the charges to be blocked by the component layer.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 26, 2022
    Applicant: Wuhan Tianma Micro-Electronics Co., Ltd.
    Inventors: Keita Hamada, Shigeru Mori
  • Patent number: 11257732
    Abstract: A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: February 22, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Maki Hasegawa, Shuhei Yokoyama, Shogo Shibata, Shigeru Mori, Toru Iwagami
  • Publication number: 20220037607
    Abstract: An organic light-emitting device includes an anode electrode and a cathode electrode that are arranged facing each other; a light-emitting layer arranged between the anode electrode and the cathode electrode; and a hole transport layer arranged between the anode electrode and the light-emitting layer, and including one or more layers. A layer, of the one or more layers of the hole transport layer, contacting the light-emitting layer has a HOMO energy level 12bH that is higher than a HOMO energy level 13H of the light-emitting layer. A difference ?E1 between the HOMO energy level 12bH of the layer contacting the light-emitting layer of the hole transport layer and the HOMO energy level 13H of the light-emitting layer is 0.32 eV or less.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 3, 2022
    Applicant: Wuhan Tianma Micro-Electronics Co., Ltd.
    Inventors: Keita HAMADA, Hiromu HANASHIMA, Shigeru MORI
  • Patent number: 11069602
    Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: July 20, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Shogo Shibata, Maki Hasegawa, Koichiro Noguchi, Shigeru Mori, Toru Iwagami
  • Patent number: 10944095
    Abstract: In a wrinkling prevention device, a work roll having a diameter smaller than that of a press-roll is pressed against the press-roll, and the work roll is supported by a bearing frame through a backup. With this configuration, an uncoated part can be elongated with a uniform pressing force. Further, an edge roller is disposed at an end part of the bearing frame which supports the work roll, and the edge roller is brought into contact with the other press-rolls not in contact with the work roll so that the axis parallelism of the work roll with the press-roll can be ensured.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: March 9, 2021
    Assignee: Oono-Roll Corporation
    Inventors: Katsuhiko Yanai, Shigeru Mori
  • Patent number: 10796979
    Abstract: A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: October 6, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Maki Hasegawa, Shuhei Yokoyama, Shigeru Mori, Hisashi Kawafuji
  • Patent number: 10741472
    Abstract: A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: August 11, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Maki Hasegawa, Shuhei Yokoyama, Shigeru Mori, Hisashi Kawafuji
  • Publication number: 20200194353
    Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.
    Type: Application
    Filed: November 22, 2016
    Publication date: June 18, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shuhei YOKOYAMA, Shogo SHIBATA, Maki HASEGAWA, Koichiro NOGUCHI, Shigeru MORI, Toru IWAGAMI
  • Publication number: 20200194772
    Abstract: In a wrinkling prevention device, a work roll having a diameter smaller than that of a press-roll is pressed against the press-roll, and the work roll is supported by a bearing frame through a backup. With this configuration, an uncoated part can be elongated with a uniform pressing force. Further, an edge roller is disposed at an end part of the bearing frame which supports the work roll, and the edge roller is brought into contact with the other press-rolls not in contact with the work roll so that the axis parallelism of the work roll with the press-roll can be ensured.
    Type: Application
    Filed: February 27, 2018
    Publication date: June 18, 2020
    Inventors: Katsuhiko Yanai, Shigeru Mori
  • Patent number: 10673060
    Abstract: Provided is a roll-press machine provided with a wrinkle occurrence prevention device for suppressing occurrence of wrinkles caused by a roll-pressing operation on a coated part and an uncoated part of an electrode plate, and a roll-pressing method. A work roll having a diameter smaller than that of the pressing roll is pressed to allow the uncoated part to be rolled between the pressing roll and the work roll, and the work roll is held by two backup rolls arranged in a V-shape formation so that the work roll can press the uncoated part with a pressing force uniform width-wise.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: June 2, 2020
    Assignee: Ono Roll Co., Ltd.
    Inventors: Katsuhiko Yanai, Shigeru Mori
  • Publication number: 20200152915
    Abstract: A display device includes a substrate and a plurality of first light-emitting elements having a microcavity structure on the substrate. Each of the plurality of first light-emitting elements includes a first light-emitting film and a first upper electrode and a first lower electrode sandwiching the first light-emitting film. The peak wavelength of an emission spectrum of the first light-emitting film is in a wavelength range where the luminosity curve slopes negatively. Within a wavelength range where the peak wavelength of a multiple interference spectrum caused by the microcavity structure varies when the viewing angle varies from 0° to 60°, the luminosity curve slopes negatively, and the emission spectrum slopes positively.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 14, 2020
    Inventors: Shigeru MORI, Keita HAMADA
  • Patent number: 10566222
    Abstract: It is an object to provide a technique capable of providing a semiconductor device with information indicating a plurality of electrical characteristics. A semiconductor device sorting system includes a characteristic measurement unit measuring electrical characteristics of a semiconductor device, a rank determination database for classifying the electrical characteristics into ranks, a calculation unit classifying the plurality of electrical characteristics of the semiconductor device measured by the characteristic measurement unit into a plurality of ranks with reference to the rank determination database, a writing unit converting the plurality of ranks classified by the calculation unit into a graphic symbolic code and forming the graphic symbolic code on the semiconductor device, a reading unit reading the plurality of ranks from the graphic symbolic code formed on the semiconductor device, and a sorting unit sorting the semiconductor device based on the plurality of ranks being read by the reading unit.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 18, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Maki Hasegawa, Hiroyuki Nakamura, Shigeru Mori, Toru Iwagami
  • Patent number: 10562086
    Abstract: In a small-size rolling mill or a roll press machine, to provide a hydraulic screw-down device compatible with the plate thickness accuracy without using a hydraulic control servo valve. A hydraulic screw-down device that is comprised of a screw to move a piston arranged in a booster cylinder back and forth, and a motor that gives rotational force to the screw controlling freely the rotational angle of the screw so as to move the piston to the purpose position. A screw-down cylinder connected with the booster cylinder through piping makes a ram in the screw-down cylinder move vertically by the move of oil caused by the movement of the piston in the booster cylinder and thereby enables push-up and push-down of the mill roll.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: February 18, 2020
    Assignee: Oono-roll Corporation
    Inventors: Katsuhiko Yanai, Shigeru Mori
  • Publication number: 20190259681
    Abstract: A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.
    Type: Application
    Filed: November 15, 2016
    Publication date: August 22, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Maki HASEGAWA, Shuhei YOKOYAMA, Shogo SHIBATA, Shigeru MORI, Toru IWAGAMI
  • Publication number: 20190115283
    Abstract: A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.
    Type: Application
    Filed: April 16, 2018
    Publication date: April 18, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Maki HASEGAWA, Shuhei YOKOYAMA, Shigeru MORI, Hisashi KAWAFUJI
  • Publication number: 20190103297
    Abstract: It is an object to provide a technique capable of providing a semiconductor device with information indicating a plurality of electrical characteristics. A semiconductor device sorting system includes a characteristic measurement unit measuring electrical characteristics of a semiconductor device, a rank determination database for classifying the electrical characteristics into ranks, a calculation unit classifying the plurality of electrical characteristics of the semiconductor device measured by the characteristic measurement unit into a plurality of ranks with reference to the rank determination database, a writing unit converting the plurality of ranks classified by the calculation unit into a graphic symbolic code and forming the graphic symbolic code on the semiconductor device, a reading unit reading the plurality of ranks from the graphic symbolic code formed on the semiconductor device, and a sorting unit sorting the semiconductor device based on the plurality of ranks being read by the reading unit.
    Type: Application
    Filed: August 27, 2018
    Publication date: April 4, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shuhei YOKOYAMA, Maki HASEGAWA, Hiroyuki NAKAMURA, Shigeru MORI, Toru IWAGAMI
  • Publication number: 20180226630
    Abstract: {Problem} Provided is a roll-press machine provided with a wrinkle occurrence prevention device for suppressing occurrence of wrinkles caused by a roll-pressing operation on a coated part and an uncoated part of an electrode plate, and a roll-pressing method. {Solution} A work roll having a diameter smaller than that of the pressing roll is pressed to allow the uncoated part to be rolled between the pressing roll and the work roll, and the work roll is held by two backup rolls arranged in a V-shape formation so that the work roll can press the uncoated part with a pressing force uniform in width-wise.
    Type: Application
    Filed: February 27, 2017
    Publication date: August 9, 2018
    Inventors: Katsuhiko YANAI, Shigeru MORI
  • Patent number: D859334
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: September 10, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Maki Hasegawa, Shigeru Mori
  • Patent number: D864135
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: October 22, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Maki Hasegawa, Shigeru Mori