Abstract: An antenna module including a dielectric substrate formed by stacking a plurality of dielectric layers, a radiating element formed on or in the dielectric substrate, a ground electrode facing the radiating element, and peripheral electrodes that are formed in a plurality of layers between the radiating element and the ground electrode at an outer periphery of the dielectric substrate.

Abstract: A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

Abstract: A transmission line member includes a base body extending along a transmission direction of a high-frequency signal, and a first transmission line, a second transmission line, and a third transmission line. The base body includes a first portion including the first transmission line, a second portion including the second transmission line, and a third portion including the third transmission line. The second portion is connected between the first and third portions. A thickness of the second portion is smaller than a thickness of the first and third portions. The second transmission line includes only a conductor pattern extending more in the transmission direction than in a direction of the thickness.

Abstract: A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.

Abstract: This antenna module (100) includes a dielectric substrate (130) and radiation electrodes (121) and a ground electrode (GND) that are arranged on or in the dielectric substrate (130). A plurality of openings (122) are formed in at least one electrode out of the radiation electrode (121) and the ground electrode (GND), the plurality of openings (122) penetrating through the electrode but not penetrating through the dielectric substrate (130).

Abstract: An antenna module including a dielectric substrate formed by stacking a plurality of dielectric layers, a radiating element formed on or in the dielectric substrate, a ground electrode facing the radiating element, and peripheral electrodes that are formed in a plurality of layers between the radiating element and the ground electrode at an outer periphery of the dielectric substrate.

Abstract: A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.

Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

Abstract: A resin multilayer board includes an insulating substrate including a first main surface and mounting electrodes only on the first main surface. The insulating substrate includes first and second resin layers that are laminated. The Young's modulus of the second resin layers is higher than that of the first resin layers. The first and second resin layers are arranged in a distributed manner along a lamination direction of the first and second resin layers. The insulating substrate includes a first and second portions that are two equally divided portions of the insulating substrate in the lamination direction and are respectively positioned closer to the first main surface and farther from the first main surface, and a volume ratio of the second resin layers in the first portion is higher than a volume ratio of the second resin layers in the second portion.

Abstract: A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

Abstract: An antenna module includes: a dielectric substrate including a multilayer structure, the dielectric substrate having a first surface and a second surface, the second surface being opposite the first surface; an antenna pattern formed on the first surface side of the dielectric substrate; a RFIC provided on the second surface of the dielectric substrate, the RFIC supplying a radio frequency signal to the antenna pattern; and a power supply line that supplies power to the RFIC, wherein the thickness of the power supply line in the stacking direction (Z axis direction) of the dielectric substrate is thicker than the thickness of the antenna pattern in the stacking direction.

Abstract: A transmission line member includes a base body extending along a transmission direction of a high-frequency signal, and a first transmission line, a second transmission line, and a third transmission line. The base body includes a first portion including the first transmission line, a second portion including the second transmission line, and a third portion including the third transmission line. The second portion is connected between the first and third portions. A thickness of the second portion is smaller than a thickness of the first and third portions. The second transmission line includes only a conductor pattern extending more in the transmission direction than in a direction of the thickness.

Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

Abstract: A resin multilayer board includes an insulating substrate including a first main surface and mounting electrodes only on the first main surface. The insulating substrate includes first and second resin layers that are laminated. The Young's modulus of the second resin layers is higher than that of the first resin layers. The first and second resin layers are arranged in a distributed manner along a lamination direction of the first and second resin layers. The insulating substrate includes a first and second portions that are two equally divided portions of the insulating substrate in the lamination direction and are respectively positioned closer to the first main surface and farther from the first main surface, and a volume ratio of the second resin layers in the first portion is higher than a volume ratio of the second resin layers in the second portion.

Abstract: A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.

Abstract: A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.

Abstract: This antenna module (100) includes a dielectric substrate (130) and radiation electrodes (121) and a ground electrode (GND) that are arranged on or in the dielectric substrate (130). A plurality of openings (122) are formed in at least one electrode out of the radiation electrode (121) and the ground electrode (GND), the plurality of openings (122) penetrating through the electrode but not penetrating through the dielectric substrate (130).

Abstract: An antenna module includes: a dielectric substrate including a multilayer structure, the dielectric substrate having a first surface and a second surface, the second surface being opposite the first surface; an antenna pattern formed on the first surface side of the dielectric substrate; a RFIC provided on the second surface of the dielectric substrate, the RFIC supplying a radio frequency signal to the antenna pattern; and a power supply line that supplies power to the RFIC, wherein the thickness of the power supply line in the stacking direction (Z axis direction) of the dielectric substrate is thicker than the thickness of the antenna pattern in the stacking direction.

Abstract: A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view.

Abstract: A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.