Patents by Inventor Shigeru Yoshikawa
Shigeru Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240115835Abstract: A dilator (30) insertable into a catheter (20) includes a tubular shaft part (40), and a tubular flexible part (50) located on a distal end side of the shaft part (40) and formed of a resin more flexible than the shaft part (40), and includes, in the shaft part (40) and/or the flexible part (50), a physical property inclined part (42) in which rigidity gradually decreases from a proximal end side toward a distal end side. The catheter assembly is capable of achieving both stable catheter insertability into a blood vessel and reduction in risk of blood vessel perforation.Type: ApplicationFiled: December 4, 2023Publication date: April 11, 2024Inventors: Ryo Okamura, Shigeru Yoshikawa, Masakazu Miyata, Shingo Ishii
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Patent number: 11698080Abstract: A sealing system includes: a double mechanical seal having a pump-side sealing mechanism (10, 12) and an atmospheric-side sealing mechanism (11, 13); a pump mechanism (19) driven by a rotational shaft (1); a first medium circulation line (30) for circulating a fluid barrier-and-cooling medium between a first chamber (22a) and a second chamber (22b), the first medium circulation line (30) being coupled to the first chamber (22a) and the second chamber (22b), the fluid barrier-and-cooling medium being different from a fluid handled by the centrifugal pump; a heat exchanger (21) and a shut-off valve (28) attached to the first medium circulation line (30); a second medium circulation line (31) bypassing the shut-off valve (28); and a medium pressurizing pump (45) and an on-off valve (23) attached to the second medium circulation line (31).Type: GrantFiled: July 18, 2022Date of Patent: July 11, 2023Assignee: EBARA CORPORATIONInventors: Shigeru Yoshikawa, Junichi Hayakawa
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Publication number: 20220381258Abstract: A sealing system includes: a double mechanical seal having a pump-side sealing mechanism (10, 12) and an atmospheric-side sealing mechanism (11, 13); a pump mechanism (19) driven by a rotational shaft (1); a first medium circulation line (30) for circulating a fluid barrier-and-cooling medium between a first chamber (22a) and a second chamber (22b), the first medium circulation line (30) being coupled to the first chamber (22a) and the second chamber (22b), the fluid barrier-and-cooling medium being different from a fluid handled by the centrifugal pump; a heat exchanger (21) and a shut-off valve (28) attached to the first medium circulation line (30); a second medium circulation line (31) bypassing the shut-off valve (28); and a medium pressurizing pump (45) and an on-off valve (23) attached to the second medium circulation line (31).Type: ApplicationFiled: July 18, 2022Publication date: December 1, 2022Inventors: Shigeru YOSHIKAWA, Junichi HAYAKAWA
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Patent number: 11441571Abstract: A sealing system includes: a double mechanical seal having a pump-side sealing mechanism (10, 12) and an atmospheric-side sealing mechanism (11, 13); a pump mechanism (19) driven by a rotational shaft (1); a first medium circulation line (30) for circulating a fluid barrier-and-cooling medium between a first chamber (22a) and a second chamber (22b), the first medium circulation line (30) being coupled to the first chamber (22a) and the second chamber (22b), the fluid barrier-and-cooling medium being different from a fluid handled by the centrifugal pump; a heat exchanger (21) and a shut-off valve (28) attached to the first medium circulation line (30); a second medium circulation line (31) bypassing the shut-off valve (28); and a medium pressurizing pump (45) and an on-off valve (23) attached to the second medium circulation line (31).Type: GrantFiled: August 15, 2018Date of Patent: September 13, 2022Assignee: EBARA CORPORATIONInventors: Shigeru Yoshikawa, Junichi Hayakawa
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Publication number: 20200408219Abstract: The pump includes a rotational shaft (1), an impeller (3) fixed to the rotational shaft (1), a casing (2) that houses the impeller (3), a double mechanical seal (20), a seal chamber (25) that houses the double mechanical seal (20), an oil reservoir (30) configured to store oil, an oil supply line (26) providing fluid communication between the oil reservoir (30) and the seal chamber (25), a first oil pump (31) configured to pressurize oil supplied from the oil reservoir (30) and deliver the oil to the seal chamber (25), a second oil pump (42) arranged in parallel with the first oil pump (31), an oil outlet line (27) coupled to the seal chamber (25), and a pressure retaining mechanism for retaining pressure of oil in the seal chamber (25).Type: ApplicationFiled: July 20, 2018Publication date: December 31, 2020Inventors: Shigeru YOSHIKAWA, Junichi HAYAKAWA
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Publication number: 20200309146Abstract: A sealing system includes: a double mechanical seal having a pump-side sealing mechanism (10, 12) and an atmospheric-side sealing mechanism (11, 13); a pump mechanism (19) driven by a rotational shaft (1); a first medium circulation line (30) for circulating a fluid barrier-and-cooling medium between a first chamber (22a) and a second chamber (22b), the first medium circulation line (30) being coupled to the first chamber (22a) and the second chamber (22b), the fluid barrier-and-cooling medium being different from a fluid handled by the centrifugal pump; a heat exchanger (21) and a shut-off valve (28) attached to the first medium circulation line (30); a second medium circulation line (31) bypassing the shut-off valve (28); and a medium pressurizing pump (45) and an on-off valve (23) attached to the second medium circulation line (31).Type: ApplicationFiled: August 15, 2018Publication date: October 1, 2020Inventors: Shigeru YOSHIKAWA, Junichi HAYAKAWA
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Publication number: 20190321616Abstract: An integrally-molded medical device is provided including a tubular member and a fixing member molded around and fixed to a first end of the tubular member. The fixing member is molded around the tubular member to include an outer circumferential contact portion in contact with an outer circumferential face of the tubular member, and to include an inner circumferential contact portion in contact with an inner circumferential face of the tubular member. The circumferential wall of the tubular member includes, at different positions in a circumferential direction, a pinching portion which is pinched by the outer circumferential contact portion and the inner circumferential contact portion, and a non-pinching portion which is in contact with the outer circumferential contact portion, is not in contact with the inner circumferential contact portion, and is not pinched by the outer circumferential contact portion and the inner circumferential contact portion.Type: ApplicationFiled: July 3, 2019Publication date: October 24, 2019Inventors: Yuta Akahori, Shigeru Yoshikawa
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Patent number: 9966269Abstract: One embodiment of the present invention relates to a polishing liquid for CMP containing cerium oxide particles and water, wherein the half-value width of the main peak appearing within a range from 2?=27.000 to 29.980° in a powder X-ray diffraction chart of the cerium oxide particles is from 0.26 to 0.36°, the average particle size of the cerium oxide particles is at least 130 nm but less than 175 nm, and the number of cerium oxide particles having a particle size of 1.15 ?m or greater is 5000×103/mL or less.Type: GrantFiled: May 29, 2015Date of Patent: May 8, 2018Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Shigeru Yoshikawa, Munehiro Oota, Takaaki Tanaka, Takashi Shinoda
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Publication number: 20170276176Abstract: A bearing apparatus is capable of stably supplying an appropriate amount of lubricating oil to a bearing with a simple arrangement, even if a peripheral speed of a rotational shaft increases. The bearing apparatus includes a bearing unit for receiving a load of a rotational shaft, a lubricating oil reservoir disposed below the bearing unit, and an oil disk rotatable together with the rotational shaft to scoop up lubricating oil stored in the lubricating oil reservoir. The oil disk has a side surface facing the bearing unit, the side surface having a groove formed therein. An outer-circumferential-side end surface of the groove extends parallel to an axial direction of the rotational shaft, and constitutes a guide surface for changing a direction of movement of the lubricating oil in the groove from a radial direction of the oil disk to the axial direction of the rotational shaft.Type: ApplicationFiled: August 4, 2015Publication date: September 28, 2017Inventors: Kazuya HIRATA, Takashi YAMANAKA, Shigeru YOSHIKAWA, Dai KUDO
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Publication number: 20170200617Abstract: One embodiment of the present invention relates to a polishing liquid for CMP containing cerium oxide particles and water, wherein the half-value width of the main peak appearing within a range from 2?=27.000 to 29.980° in a powder X-ray diffraction chart of the cerium oxide particles is from 0.26 to 0.36°, the average particle size of the cerium oxide particles is at least 130 nm but less than 175 nm, and the number of cerium oxide particles having a particle size of 1.15 ?m or greater is 5000×103/mL or less.Type: ApplicationFiled: May 29, 2015Publication date: July 13, 2017Inventors: Shigeru YOSHIKAWA, Munehiro OOTA, Takaaki TANAKA, Takashi SHINODA
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Publication number: 20170133237Abstract: Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO3M group and —PO3M2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.Type: ApplicationFiled: December 1, 2016Publication date: May 11, 2017Inventors: Munehiro Oota, Takaaki Tanaka, Toshio Takizawa, Shigeru Yoshikawa, Takaaki Matsumoto, Takahiro Yoshikawa, Takashi Shinoda
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Patent number: 9564337Abstract: Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO3M group and —PO3M2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.Type: GrantFiled: December 22, 2011Date of Patent: February 7, 2017Assignee: HITACHI CHEMICAL CO., LTD.Inventors: Munehiro Oota, Takaaki Tanaka, Toshio Takizawa, Shigeru Yoshikawa, Takaaki Matsumoto, Takahiro Yoshikawa, Takashi Shinoda
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Patent number: 8592317Abstract: The polishing solution for CMP of the invention comprises abrasive grains, a first additive and water, wherein the first additive is at least 1,2-benzoisothiazole-3(2H)-one or 2-aminothiazole. The polishing method of the invention is a polishing method for a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad.Type: GrantFiled: May 6, 2011Date of Patent: November 26, 2013Assignee: Hitachi Chemical Co., Ltd.Inventors: Eiichi Satou, Shigeru Nobe, Munehiro Oota, Masayuki Hanano, Shigeru Yoshikawa
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Cerium oxide slurry, cerium oxide polishing slurry and method for polishing substrate using the same
Patent number: 8591612Abstract: The present invention provides a cerium oxide slurry, a cerium oxide polishing slurry, and a method of polishing a substrate by using the same, wherein decrease of scratches and polish at high speed can be realized by reducing the content of coarse grains by improving in the disperse state of cerium oxide particles. The invention relates to a cerium oxide slurry containing cerium oxide particles, dispersant and water, in which the ratio of weight of cerium oxide/weight of dispersant is in a range of 20 to 80 and relates a cerium oxide polishing slurry comprising the cerium oxide slurry and additives such as a water-soluble polymer.Type: GrantFiled: January 15, 2013Date of Patent: November 26, 2013Assignee: Hitachi Chemical Co., Ltd.Inventors: Kazuhiro Enomoto, Shigeru Yoshikawa -
Publication number: 20130260558Abstract: Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO3M group and —PO3M2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.Type: ApplicationFiled: December 22, 2011Publication date: October 3, 2013Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Munehiro Oota, Takaaki Tanaka, Toshio Takizawa, Shigeru Yoshikawa, Takaaki Matsumoto, Takahiro Yoshikawa, Takashi Shinoda
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Publication number: 20120214307Abstract: The first embodiment of the CMP polishing liquid of the invention comprises cerium oxide particles, an organic compound with an acetylene bond, and water, the content of the organic compound with an acetylene bond being at least 0.00001 mass % and not greater than 0.01 mass % based on the total mass of the CMP polishing liquid. The second embodiment of the CMP polishing liquid of the invention comprises cerium oxide particles, an organic compound with an acetylene bond, an anionic polymer compound or salt thereof, and water, the anionic polymer compound being obtained by polymerizing a composition comprising a vinyl compound with an anionic substituent as a monomer component, the content of the organic compound with an acetylene bond being at least 0.000001 mass % and less than 0.05 mass % based on the total mass of the CMP polishing liquid.Type: ApplicationFiled: September 14, 2010Publication date: August 23, 2012Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventors: Shigeru Yoshikawa, Toshiaki Akutsu, Masato Fukusawa
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Publication number: 20110275217Abstract: The polishing solution for CMP of the invention comprises abrasive grains, a first additive and water, wherein the first additive is at least 1,2-benzoisothiazole-3(2H)-one or 2-aminothiazole. The polishing method of the invention is a polishing method for a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad.Type: ApplicationFiled: May 6, 2011Publication date: November 10, 2011Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventors: Eiichi Satou, Shigeru Nobe, Munehiro Oota, Masayuki Hanano, Shigeru Yoshikawa
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CERIUM OXIDE SLURRY, CERIUM OXIDE POLISHING SLURRY AND METHOD FOR POLISHING SUBSTRATE USING THE SAME
Publication number: 20070093183Abstract: The present invention provides a cerium oxide slurry, a cerium oxide polishing slurry, and a method of polishing a substrate by using the same, wherein decrease of scratches and polish at high speed can be realized by reducing the content of coarse grains by improving in the disperse state of cerium oxide particles. The invention relates to a cerium oxide slurry containing cerium oxide particles, dispersant and water, in which the ratio of weight of cerium oxide/weight of dispersant is in a range of 20 to 80 and relates a cerium oxide polishing slurry comprising the cerium oxide slurry and additives such as a water-soluble polymer.Type: ApplicationFiled: October 19, 2006Publication date: April 26, 2007Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Shigeru Yoshikawa, Kazuhiro Enomoto -
Patent number: 6979793Abstract: To provide a mail sorting and distributing transfer system, which extends transformable time of mail fed from a mail charging line so that the mail can be timely, reliably transferred to conveyor baskets on a mail sorting line, there is a mail sorting and distributing transfer system in which transfer timing levers maintain the receipt ports of transfer baskets provided on an outer circumferential edge of a sorting and distributing turntable in a state where the receipt ports of the transfer baskets are in registry with a mail charging line during the receipt of mail and where the lever pivots so it moves the associated transfer basket. Underlying conveyor baskets on a mail sorting line are moved parallel to and in synchronization with the transfer baskets during the transfer of the mail. The lever is pivoted about an axis parallel to the axis of the mail sorting and distributing turntable.Type: GrantFiled: May 23, 2003Date of Patent: December 27, 2005Assignee: Tsubakimoto Chain Co.Inventors: Ryosuke Shiibashi, Toshio Kanbe, Masakazu Shimomura, Shigeru Yoshikawa
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Patent number: 6897395Abstract: A mail sorter, which can reliably sort mail while avoiding the breakage and the recovery mistake of mail released from conveyor baskets, which move on the mail sorting line in circulation. The mail sorter has a conveyor line with a conveying forward run and a conveying return run closely arranged back to back with each, and layered mail recovery box groups are disposed along a lower region of the conveying return run in parallel to each other. The mail recovery box groups comprise lowest stage boxes for recovering mail M released from conveyor baskets on the conveying forward run through a transverse deflection chute, middle stage boxes for recovering mail M released from the conveyor baskets on the conveying forward run through a discharge chute, and uppermost stage boxes for recovering mail M released from the conveying baskets on the conveying return run through a buffer chute.Type: GrantFiled: May 15, 2003Date of Patent: May 24, 2005Assignee: Tsubakimoto Chain Co.Inventors: Ryosuke Shiibashi, Toshio Kanbe, Masakazu Shimomura, Shigeru Yoshikawa